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Tian et al., 2021 - Google Patents

Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock

Tian et al., 2021

Document ID
4100406926204605771
Author
Tian R
Tian Y
Huang Y
Yang D
Chen C
Sun H
Publication year
Publication venue
Journal of Materials Science: Materials in Electronics

External Links

Snippet

The interfacial reactions and the growth behavior of interfacial intermetallic compounds (IMCs), as well as their effects on the mechanical properties of the Sn-3.0 Ag-0.5 Cu (SAC305)/electroless nickel-electroless palladium-immersion gold (ENEPIG) solder joints …
Continue reading at link.springer.com (other versions)

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

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