Piel et al. - Google Patents
Optical Characterization and Defect Inspection for 3D Stacked IC TechnologyPiel et al.
View PDF- Document ID
- 4092327408907139998
- Author
- Piel J
- Fresquet G
- Perrot S
- Randle Y
- Lebellego D
- Petitgrand S
- Ribette G
External Links
Snippet
Advanced packaging technologies are rapidly evolving and 3D architectures requires new inspection and metrology techniques. Existing techniques need to be improved but new techniques must be developed to address new challenges induced by the last fabrication …
- 230000003287 optical 0 title abstract description 26
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating using interferometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating
- G01B11/0625—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material of coating with measurement of absorption or reflection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness for measuring thickness, e.g. of sheet material
- G01B11/0608—Height gauges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/02—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness
- G01B11/026—Measuring arrangements characterised by the use of optical means for measuring length, width or thickness by measuring distance between sensor and object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
- G01N2021/653—Coherent methods [CARS]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Instruments as specified in the subgroups and characterised by the use of optical measuring means
- G01B9/02—Interferometers for determining dimensional properties of, or relations between, measurement objects
- G01B9/0209—Non-tomographic low coherence interferometers, e.g. low coherence interferometry, scanning white light interferometry, optical frequency domain interferometry or reflectometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Instruments as specified in the subgroups and characterised by the use of optical measuring means
- G01B9/02—Interferometers for determining dimensional properties of, or relations between, measurement objects
- G01B9/02001—Interferometers for determining dimensional properties of, or relations between, measurement objects characterised by manipulating or generating specific radiation properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/24—Measuring arrangements characterised by the use of optical means for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using infra-red, visible or ultra-violet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical means
- G01B11/30—Measuring arrangements characterised by the use of optical means for measuring roughness or irregularity of surfaces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Instruments as specified in the subgroups and characterised by the use of optical measuring means
- G01B9/04—Measuring microscopes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colour
- G01J3/12—Generating the spectrum; Monochromators
- G01J3/26—Generating the spectrum; Monochromators using multiple reflection, e.g. Fabry-Perot interferometer, variable interference filters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colour
- G01J3/28—Investigating the spectrum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry
- G01J5/0003—Radiation pyrometry for sensing the radiant heat transfer of samples, e.g. emittance meter
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9305341B2 (en) | System and method for measurement of through silicon structures | |
US9587932B2 (en) | System for directly measuring the depth of a high aspect ratio etched feature on a wafer | |
CN107683400B (en) | Method and device for measuring height on semiconductor wafer | |
US7738113B1 (en) | Wafer measurement system and apparatus | |
EP2446468B1 (en) | System for directly measuring the depth of a high aspect ratio etched feature on a wafer | |
US7884024B2 (en) | Apparatus and method for optical interference fringe based integrated circuit processing | |
TWI642928B (en) | Wafer defect detection device and detection method | |
US20180364028A1 (en) | Device and method for measuring height in the presence of thin layers | |
TW200930977A (en) | Interferometer utilizing polarization scanning | |
US20240183655A1 (en) | Measuring apparatus and method for roughness and/or defect measurement on a surface | |
CN101131317A (en) | Method and device for measuring micro-nano deep groove structure | |
JP2008083059A (en) | Measuring system and measuring device for wafer | |
KR101987402B1 (en) | Optical measuring system for thicknesses of thin and thick films and 3D surface profile using a polarized pixel array | |
US20240281955A1 (en) | Method and a system for characterising structures through a substrate | |
US12025424B2 (en) | Device and method for measuring height profiles on an object | |
Piel et al. | Optical Characterization and Defect Inspection for 3D Stacked IC Technology | |
US10203198B2 (en) | Measurement of surface topography of a work-piece | |
WO1996003615A1 (en) | Film thickness mapping using interferometric spectral imaging | |
Fresquet et al. | Optical characterization and defect inspection for 3D stacked IC technology | |
Le Cunff et al. | Use of optical metrology techniques for uniformity control of 3D stacked IC's | |
TW202242342A (en) | Hyperspectral reflective interference and non-interferential optical characteristic focus measurement device and method capable of auto-focusing when switching between both interfering and non-interfering devices | |
Le Cunff et al. | Uniformity Control of 3-D Stacked ICs: Optical Metrology and Statistical Analysis | |
Jin et al. | Performance evaluation on the diameter and depth measurements of through-silicon vias using a spectral-domain interferometer | |
Fresquet | A Versatile Optical Head for 3D IC TSV Integration Process Control | |
Kang et al. | Effective area measurement of apertures by optical method |