Abstract
The residue which is left on or around a solder joint after reflowing solder paste is expected to be the mixture of ingredients in the flux/ vehicle portion of the paste, interreaction products among ingredients, and the reaction product between ingredients and substrate or solder alloy. Therefore, chemically, the residue is composed of polar organics, nonpolar organics, ionic salts, and metal salts of organics. For a typical RMA-type system, hypothetical constituents in the residue may contain the following:
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gum rosin or other rosins
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gum rosin derivatives or other rosin derivatives
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carboxylic acid
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amine and derivatives
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hydrocarbon
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alcohol
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ether
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ester
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fatty acid or fatty amine
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lead salt of rosin acid
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tin salt of rosin acid
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copper salt of rosin acid
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© 1992 Springer Science+Business Media New York
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Hwang, J.S. (1992). Cleaning. In: Solder Paste in Electronics Packaging. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3528-7_8
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DOI: https://doi.org/10.1007/978-1-4615-3528-7_8
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