Abstract
Advances in product miniaturization leads to size and weight reduction which can substantially increase the convenience and value of many products [1, 2]. Micro-Electro- Mechanical Systems (MEMS) are typical examples of micro products. It is an integration of mechanical elements, sensors, actuators, and electronics on a common substrate through micro fabrication technology. The choice of substrate materials for MEMS is very wide. Amongst these materials, single crystalline silicon is by far the most common. Complementing silicon is a host of materials that include polysilicon, amorphous silicon, silicon oxides and nitrides, glass, organic polymers, and metals. While the electronics are fabricated using integrated circuit (IC) process sequences (e.g., CMOS, Bipolar, or BICMOS processes), the micro mechanical components are fabricated using compatible micro machining processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electro-mechanical devices. Over the years, tool-based micro machining methods have been applied to a variety of substrates to fabricate micro structures and transducers in addition to etching and LIGA (from the German: Lithographie Galvanformung und Abformung), which is a process based on lithography, electroplating and molding. The workpiece may be a final part, a mold for electroplating to create a microstructure, or an x-ray lithography mask, for example [3].
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Fang, F.Z., Liu, K., Kurfess, T.R., Lim, G.C. (2006). Tool-based Micro Machining and Applications in MEMS. In: Leondes, C.T. (eds) MEMS/NEMS. Springer, Boston, MA. https://doi.org/10.1007/0-387-25786-1_18
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