Abstract
Despite their contributions to the financial efficiency and environmental sustainability of industrial processes, robotic assembly and disassembly have been understudied in the existing literature. This is in contradiction to their importance in realizing the Fourth Industrial Revolution. More specifically, although most of the literature has extensively discussed how to optimally assemble or disassemble given products, the role of other factors has been overlooked. For example, and among other factors, the choices of the robots involved in implementing the sequence plans, which should ideally be taken into account throughout the whole chain consisting of design, assembly, disassembly, and reassembly, may greatly affect the underlying implications with a considerable impact on the viability and effectiveness of the measures aimed at substantiating, realizing, and strengthening the backbones of a circular economy. Isolating the foregoing operations from the rest of the components of the relevant ecosystems may lead to erroneous inferences toward both the necessity and efficiency of the underlying procedures. In this paper, we try to alleviate these shortcomings by comprehensively investigating the state of the art in robotic assembly and disassembly. We consider and review various aspects of manufacturing and remanufacturing frameworks while particularly focusing on their desirability for supporting a circular economy.
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Notes
Throughout this paper, RAD will be used to refer to Robotic Assembly and Disassembly, in general. Whenever differences are important, the more specific terms Robotic Assembly (RA) or Robotic Disassembly (RD) will be used accordingly.
The constituents and the level of robustness of different elements of the Building Information Modelling at various stages [123].
Non-deterministic polynomial time.
A product at the end of its useful life.
A machine learning strategy taking simultaneous advantage of reinforcement learning and deep learning, where the former concerns the ability of a computational agent to learn how to make decisions through trial and error, i.e., to figure out what to do in order to optimize an objective function, and the latter helps it to do so based on large unstructured input data, obviating the necessity of manual manipulation of the state space [69, 142].
The maximum (minimum) of a problem is the inverse function to the minimum (maximum) of the inverse problem [161].
A system in which a mechanism is monitored or controlled using computer software [168].
Fast, high-precision placement of a wide range of electronic surface mount devices (SMDs), including integrated circuits, resistors and capacitors, as well as through-hole components, onto Printed Circuit Boards (PCBs) utilized in telecommunication, medical, military, automotive, and industrial devices, consumer electronics and computers [169].
A family of discrete dynamic systems utilized for mathematical modeling of distributed systems, where places and transitions are shown as white circles and rectangles, respectively, within a bipartite graph [170].
Enabling computers to obtain useful data from, and about, the environment, i.e., “things,” without requiring human aid, thereby making it possible to acquire information more accurately, rigorously, and extensively [189].
Further involving other elements, such as people, data, and processes, resulting in a more comprehensive concept than the Internet of Things [190].
Abbreviations
- 3D:
-
Three-dimensional
- AI:
-
Artificial intelligence
- AS:
-
Assembly sequence
- ASP:
-
Assembly sequence planning
- CE:
-
Circular economy
- DLBP:
-
Disassembly line balancing problem
- DS:
-
Disassembly sequence
- DSP:
-
Disassembly sequence planning
- EE:
-
End-effector
- EoL:
-
End-of-life
- HRC:
-
Human–robot collaboration
- OASP:
-
Optimal assembly sequence planning
- ODSP:
-
Optimal disassembly sequence planning
- PCB:
-
Printed circuit board
- RA:
-
Robotic assembly
- RAD:
-
Robotic assembly and disassembly
- RD:
-
Robotic disassembly
- SMD:
-
Surface mount device
- SP:
-
Sequence planning
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This work was supported by the European Social Fund via IT Academy program and the Estonian Research Council [grant numbers COVSG24 and PSG605].
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Graduate School of Informatics, Kyoto University, Kyoto 606-8501, Japan of the first author’s affiliation is previously with the University of Tartu.
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Daneshmand, M., Noroozi, F., Corneanu, C. et al. Industry 4.0 and prospects of circular economy: a survey of robotic assembly and disassembly. Int J Adv Manuf Technol 124, 2973–3000 (2023). https://doi.org/10.1007/s00170-021-08389-1
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DOI: https://doi.org/10.1007/s00170-021-08389-1