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10.1145/2934466acmotherconferencesBook PagePublication PagessplcConference Proceedingsconference-collections
SPLC '16: Proceedings of the 20th International Systems and Software Product Line Conference
ACM2016 Proceeding
  • General Chair:
  • Hong Mei
Publisher:
  • Association for Computing Machinery
  • New York
  • NY
  • United States
Conference:
SPLC '16: The 20th International Systems and Software Product Line Conference Beijing China September 16 - 23, 2016
ISBN:
978-1-4503-4050-2
Published:
16 September 2016
Sponsors:
Huawei Technologies Co. Ltd., Key Laboratory of High Confidence Software Technologies, DC Holdings

Reflects downloads up to 12 Dec 2024Bibliometrics
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Abstract

SPLC is the premier forum for practitioners, researchers and educators to present and discuss the most recent ideas, innovations, trends, experiences, and concerns in the area of software product lines, software product family engineering and, more in general, systems family engineering.

Contributors
  1. Proceedings of the 20th International Systems and Software Product Line Conference
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    Acceptance Rates

    Overall Acceptance Rate 167 of 463 submissions, 36%
    YearSubmittedAcceptedRate
    SPLC '22411434%
    SPLC '22411434%
    SPLC '20491735%
    SPLC '15873439%
    SPLC '14973637%
    SPLC '12662233%
    SPLC '09823037%
    Overall46316736%