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abstract

iMold: Enabling Interactive Design Optimization for In-Mold Electronics

Authors:

James D. Holbery,

Siyuan MaAuthors Info & Claims

CHI EA '20: Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems

Pages 1 - 7

https://doi.org/10.1145/3334480.3382804

Published: 25 April 2020 Publication History

Abstract

In recent years, in-mold electronics (IME) technique was introduced as a combination of printing electrically functional materials and vacuum plastic forming. IME has gained significant attention across various industries since it enables various electrical functionalities on a wide range of 3D geometries. Although IME shows great application potentials, hardships still exist during design for the manufacturing stage. For example, printed 2D structures experience mechanical bending and stretching during vacuum forming. This results in challenges for designers to ensure precise circuit-to-3D mold registration or to prevent over deformation of circuit and attached components. To this end, we propose a software toolkit that provides real time 2D-to-3D mapping, guided structural and electrical circuit design with interactive user interface. We present a novel software-guided IME process that leads to fully functional 3D electronic structures with printed conductive traces and assembled surface-mount components.

References

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DuPont. 2019. DuPont In-Mold Electronic Technology. Retrieved Nov 30, 2019. (Nov. 2019). from https://www.dupont.com/products/in-mold-electronic-technology.html.

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DuraTech. 2019. IN-MOLD ELECTRONICS (IME). Retrieved Nov 30, 2019. (Nov. 2019). from https://www.duratech.com/capabilities/ime-in-mold-electronics.

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Eastprint. 2019. IN-MOLD ELECTRONICS DESIGN & MANUFACTURING AT EASTPRINT, INC. Retrieved Nov 30, 2019. (Nov. 2019). from https://www.eastprint.com/in-mold-electronics.html.

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ECM. 2019. Product List. Retrieved Nov 30, 2019. (Nov. 2019). from http://www.conductives.com/new_products.php.

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Ghaffarzadeh, Khasha and Collins, Richard . 2019. In-Mold Electronics 2019--2029: Technology, Market Forecasts, Players. Technical Report.

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Pentti Karioja, Jukka-Tapani Mäkinen, Kimmo Keränen, Janne Aikio, Teemu Alajoki, Tuomo Jaakola, Matti Koponen, Antti Keränen, Mikko Heikkinen, Markus Tuomikoski, and others. 2012. Printed hybrid systems. In Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2012, Vol. 8344. International Society for Optics and Photonics, 83440G.

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Terho Kololuoma, Mikko Keränen, Timo Kurkela, Tuomas Happonen, Marko Korkalainen, Minna Kehusmaa, Lucia Gomez, Aida Branco, Sami Ihme, Carlos Pinheiro, and others. 2019. Adopting Hybrid Integrated Flexible Electronics in Products: Case-Personal Activity Meter. IEEE Journal of the Electron Devices Society (2019).

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JT Mäkinen, K Keränen, T Alajoki, M Koponen, A Keränen, A Kemppainen, and K Rönkä. 2011. Over-molded electronics and printed hybrid systems. In SMTA Microelectronic Symposium, Kona. 18--20.

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Creative Materials. 2019. Conductive Silver Inks. Retrieved Nov 30, 2019. (Nov. 2019). from http://www.creativematerials.com/products/silver-inks.

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TactoTek Oy. 2019. TactoTek. Retrieved Nov 30, 2019. (Nov. 2019). from https://tactotek.com.

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Christian Schüller, Daniele Panozzo, Anselm Grundhöfer, Henning Zimmer, Evgeni Sorkine, and Olga Sorkine-Hornung. 2016. Computational thermoforming. ACM Transactions on Graphics (TOG) 35, 4 (2016), 43.

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Charlie CL Wang. 2004. CyberTape: An interactive measurement tool on polyhedral surface. Computers & Graphics 28, 5 (2004), 731--745.

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Cited By

Madadnia BVanfleteren JBossuyt F(2023)Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed ElectronicsMicromachines10.3390/mi1412224814:12(2248)Online publication date: 16-Dec-2023
https://doi.org/10.3390/mi14122248
Lall PNaranagaparambil JMiller S(2023)Process Recipes and Performance of Printable Formable inks for In-Mold Electronics Applications2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITherm55368.2023.10177641(1-10)Online publication date: 30-May-2023
https://doi.org/10.1109/ITherm55368.2023.10177641
Hammes NRibeiro CMachado CFerreira JCampos RFaye DCortez AMelo SDuarte FPontes AViana JPedrosa PHomem N(2023)Materials screening and characterization for functional printed automotive interiors partsFlexible and Printed Electronics10.1088/2058-8585/acdfe08:2(025022)Online publication date: 30-Jun-2023
https://doi.org/10.1088/2058-8585/acdfe0
Show More Cited By

Index Terms

iMold: Enabling Interactive Design Optimization for In-Mold Electronics
1. Human-centered computing
  1. Human computer interaction (HCI)
    1. Interactive systems and tools

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Information & Contributors

Information

Published In

cover image ACM Conferences

CHI EA '20: Extended Abstracts of the 2020 CHI Conference on Human Factors in Computing Systems

April 2020

4474 pages

ISBN:9781450368193

DOI:10.1145/3334480

General Chairs:
Regina Bernhaupt
Eindhoven University of Technology, Netherlands
,
Florian 'Floyd' Mueller
Monash University, Australia
,
David Verweij
Newcastle University, UK
,
Josh Andres
RMIT, Australia
,
Program Chairs:
Joanna McGrenere
University of British Columbia, Canada
,
Andy Cockburn
University of Canterbury, New Zealand
,
Ignacio Avellino
University of Maryland Baltimore County, USA
,
Alix Goguey
Grenoble Alpes University, France
,
Pernille Bjørn
University of Copenhagen, Denmark
,
Shengdong (Shen) Zhao
National University of Singapore, Singapore
,
Briane Paul Samson
Future University Hakodate, Japan & De La Salle University, Philippines
,
Rafal Kocielnik
University of Washington, USA

Copyright © 2020 Owner/Author.

Permission to make digital or hard copies of part or all of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for third-party components of this work must be honored. For all other uses, contact the Owner/Author.

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SIGCHI: ACM Special Interest Group on Computer-Human Interaction

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Association for Computing Machinery

New York, NY, United States

Publication History

Published: 25 April 2020

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CHI '20

Sponsor:

SIGCHI

CHI '20: CHI Conference on Human Factors in Computing Systems

April 25 - 30, 2020

HI, Honolulu, USA

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Overall Acceptance Rate 6,164 of 23,696 submissions, 26%

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CHI 2025

Sponsor:
sigchi

ACM CHI Conference on Human Factors in Computing Systems

April 26 - May 1, 2025

Yokohama , Japan

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Citations

Cited By

Madadnia BVanfleteren JBossuyt F(2023)Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed ElectronicsMicromachines10.3390/mi1412224814:12(2248)Online publication date: 16-Dec-2023
https://doi.org/10.3390/mi14122248
Lall PNaranagaparambil JMiller S(2023)Process Recipes and Performance of Printable Formable inks for In-Mold Electronics Applications2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)10.1109/ITherm55368.2023.10177641(1-10)Online publication date: 30-May-2023
https://doi.org/10.1109/ITherm55368.2023.10177641
Hammes NRibeiro CMachado CFerreira JCampos RFaye DCortez AMelo SDuarte FPontes AViana JPedrosa PHomem N(2023)Materials screening and characterization for functional printed automotive interiors partsFlexible and Printed Electronics10.1088/2058-8585/acdfe08:2(025022)Online publication date: 30-Jun-2023
https://doi.org/10.1088/2058-8585/acdfe0
Madadnia BBossuyt FVanfleteren J(2022)Innovative component positioning method for thermoformed electronicsFlexible and Printed Electronics10.1088/2058-8585/ac99897:4(045006)Online publication date: 25-Oct-2022
https://doi.org/10.1088/2058-8585/ac9989
Buga CViana J(2022)The role of printed electronics and related technologies in the development of smart connected productsFlexible and Printed Electronics10.1088/2058-8585/ac91de7:4(043001)Online publication date: 5-Oct-2022
https://doi.org/10.1088/2058-8585/ac91de
Hong FTendera LMyant CBoyle D(2022)Vacuum-Formed 3D Printed Electronics: Fabrication of Thin, Rigid and Free-Form Interactive SurfacesSN Computer Science10.1007/s42979-022-01174-13:4Online publication date: 6-May-2022
https://dl.acm.org/doi/10.1007/s42979-022-01174-1
Madadnia BBossuyt FVanfleteren J(2022)A Novel Method for Component Positioning in Thermoformed ElectronicsAdvances in System-Integrated Intelligence10.1007/978-3-031-16281-7_57(607-615)Online publication date: 4-Sep-2022
https://doi.org/10.1007/978-3-031-16281-7_57
Paredes LReddy SChidambaram SVagholkar DZhang YBenes BRamani K(2021)FabHandWearProceedings of the ACM on Interactive, Mobile, Wearable and Ubiquitous Technologies10.1145/34635185:2(1-22)Online publication date: 24-Jun-2021
https://dl.acm.org/doi/10.1145/3463518
Choi JHan CCho SKim KAhn JDel Orbe DCho IZhao ZOh YHong HKim SPark I(2021)Customizable, conformal, and stretchable 3D electronics via predistorted pattern generation and thermoformingScience Advances10.1126/sciadv.abj06947:42Online publication date: 15-Oct-2021
https://doi.org/10.1126/sciadv.abj0694

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