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Stochastic modeling of a thermally-managed multi-core system

Published: 08 June 2008 Publication History

Abstract

Achieving high performance under a peak temperature limit is a first-order concern for VLSI designers. This paper presents a new abstract model of a thermally-managed system, where a stochastic process model is employed to capture the system performance and thermal behavior. We formulate the problem of dynamic thermal management (DTM) as the problem of minimizing the energy cost of the system for a given level of performance under a peak temperature constraint by using a controllable Markovian decision process (MDP) model. The key rationale for utilizing MDP for solving the DTM problem is to manage the stochastic behavior of the temperature states of the system under online re-configuration of its micro-architecture and/or dynamic voltage-frequency scaling. Experimental results demonstrate the effectiveness of the modeling framework and the proposed DTM technique.

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    cover image ACM Conferences
    DAC '08: Proceedings of the 45th annual Design Automation Conference
    June 2008
    993 pages
    ISBN:9781605581156
    DOI:10.1145/1391469
    • General Chair:
    • Limor Fix
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 08 June 2008

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    Author Tags

    1. dynamic thermal management
    2. stochastic processes
    3. uncertainty

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    Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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    View all
    • (2023)Dynamic power budget redistribution under a power cap on multi-application environmentsSustainable Computing: Informatics and Systems10.1016/j.suscom.2023.10086538(100865)Online publication date: Apr-2023
    • (2022)Speed and Power Tradeoff Based on FinFET Structure, Voltage Changing and Circuit Layout2022 IEEE 5th International Conference on Automation, Electronics and Electrical Engineering (AUTEEE)10.1109/AUTEEE56487.2022.9994548(465-470)Online publication date: 18-Nov-2022
    • (2022)An SMDP-based approach to thermal-aware task scheduling in NoC-based MPSoC platformsJournal of Parallel and Distributed Computing10.1016/j.jpdc.2022.03.016165(79-106)Online publication date: Jul-2022
    • (2021)Intelligent Management of Mobile Systems Through Computational Self-AwarenessHandbook of Research on Methodologies and Applications of Supercomputing10.4018/978-1-7998-7156-9.ch004(41-73)Online publication date: 2021
    • (2020)Thermal Simulation Flow and Thermal Closure Methodology in High-Performance VLSI/SOC DesignWSEAS TRANSACTIONS ON CIRCUITS AND SYSTEMS10.37394/23201.2020.19.2519(222-244)Online publication date: 23-Dec-2020
    • (2020)Control Systems for Computing Systems: Making computers efficient with modular, coordinated, and robust controlIEEE Control Systems10.1109/MCS.2019.296173340:2(30-55)Online publication date: Apr-2020
    • (2019)HESSLE-FREEACM Transactions on Embedded Computing Systems10.1145/335820318:5s(1-19)Online publication date: 8-Oct-2019
    • (2019)SOSAProceedings of the 52nd Annual IEEE/ACM International Symposium on Microarchitecture10.1145/3352460.3358312(685-698)Online publication date: 12-Oct-2019
    • (2019)Optimal Performance-Aware Cooling on Enterprise ServersIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.285512238:9(1689-1702)Online publication date: Sep-2019
    • (2018)SPECTRACM SIGPLAN Notices10.1145/3296957.317319953:2(169-183)Online publication date: 19-Mar-2018
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