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Built-In Testing of Integrated Circuit Wafers

Published: 01 February 1990 Publication History

Abstract

Production testing of a digital circuit requires the generation of a sequence of tests and their application to the circuit being tested. Currently, in test application, the output of the circuit under test is compared to a known correct output for each test. The method has some drawbacks likely to become more critical in the near future. In homogeneous systems of identical integrated circuits of silicon wafers, testing can be done in another way, i.e. by applying a common test to several processing elements at once and comparing the results produced by them. The authors analyze such schemes and show that they are inherently as accurate as current methods that use assumed correct results for production testing. Since this approach could allow wafers to be tested for production faults significantly more quickly than by using a probe tester, the results indicate that it can provide an attractive alternative to current methods for production testing of silicon wafers.

References

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{1} M. A. Breuer and A. D. Friedman, Diagnosis and Reliable Design of Digital Systems. Rockville, MD: Computer Science Press, 1976.
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{2} V. Cherkassky and L. Kinney, "A group probing strategy for testing large number of chips," in Proc. Int. Test Conf., 1986, pp. 853-856.
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{3} Y-H. Choi, S. Han, and M. Malek, "Fault diagnosis of reconfigurable systolic arrays," in Proc. Int. Conf. Comput. Design, 1984, pp. 451-455.
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{4} Y-H. Choi, D. Fussell, and M. Malek, "Token triggered systolic diagnosis of wafer scale arrays," in Wafer Scale Integration, Proc. Int. Workshop WSI, Southampton, England, July 1985, C. Jesshope and W. R. Morre, Eds. Bristol, England: Hilger, pp. 246-258.
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{5} Y-H. Choi, D. Fussell, and M. Malek, "Straight-line testing of wafer-scale switch arrays," in Proc. Int. Conf. Comput.-Aided Design, Nov. 1986, pp. 292-295.
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{6} J.N. Coleman and R. M. Lea, "Clock distribution techniques for wafer scale integration," in Wafer Scale Integration, Proc. Int. Workshop WSI, Southampton, England, July 1985, C. Jesshope and W. R. Moore, Eds. Bristol, England: Hilger, pp. 46-53.
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{7} P. T. Desousa and F. P. Mathur, "Sift-out modular redundancy," IEEE Trans. Comput., pp. 624-627, July 1978.
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{9} J. Losq, "A highly efficient redundancy scheme: Self-purging redundancy," IEEE Trans. Comput., pp. 569-577, June 1976.
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{10} S. Rangarajan, D. Fussell, and M. Malek, "Built-in testing of integrated circuit wafers," Tech. Rep. 87-27, Dep. Comput. Sci., Univ. of Texas, Austin, July 1987.
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{12} J. von Neumann, "Probabilistic logics and synthesis of reliable organisms from unreliable components," in Automata Studies, in Annals of Mathematical Studies, no. 34, C. E. Shannon and J. McCarthy, Eds. Princeton, NJ: Princeton University Press, 1956, pp. 43-98.
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{13} E.J. McCluskey, S. Makar, S. Mourad, and K. D. Wagner, "Probability models for pseudorandom test sequences," IEEE Trans. Comput.- Aided Design., pp. 68-74, Jan. 1988.

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Scott Davidson

Assume that a wafer contains an array of identical integrated circuits, that a test can be applied to all of these in parallel, and that the test results for each IC can be compared. In the usual case a test is applied and the results are analyzed by some external hardware. This paper proposes that the status of an IC be determined by voting (comparison of the test results) rather than by analysis of the results by external hardware. The probabilities of optimistic (a faulty circuit declared good) and pessimistic (a good circuit declared faulty) results are computed. The fault coverage of the test is factored into this, but is not an issue for the method. The paper covers the issues of wafer-scale testing quite well. One concern, that of communication between wafers, has been met since the submission of the paper by IEEE standard 1149.1 on boundary scan (see Jarwala and Zorian [1] for an application of boundary scan to wafer testing). One weakness of the paper is that I find it hard to imagine how test inputs can be applied to each circuit at speed. Perhaps if built-in self-test were used for stimulus generation and output data compression, wafer testing would be more practical. In summary, I found this an interesting exercise with limited short-term practical value.

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Published In

cover image IEEE Transactions on Computers
IEEE Transactions on Computers  Volume 39, Issue 2
February 1990
133 pages
ISSN:0018-9340
Issue’s Table of Contents

Publisher

IEEE Computer Society

United States

Publication History

Published: 01 February 1990

Author Tags

  1. VLSI.
  2. automatic testing
  3. built-in testing
  4. integrated circuit testing
  5. integrated circuit wafers
  6. production testing
  7. silicon wafers

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