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ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network

Authors:

Arvind Sridhar,

Mohamed M. Sabry,

David AtienzaAuthors Info & Claims

ICCAD '15: Proceedings of the IEEE/ACM International Conference on Computer-Aided Design

Pages 912 - 915

Published: 02 November 2015 Publication History

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Abstract

Microchannel liquid cooling has been proposed since the late 2000s as a viable enabler for 3D integration of microprocessors to continue scaling of computing power in the face of increasingly reduced returns from CMOS technology scaling. Thermal and electrical demonstrations of microchannel liquid-cooled heat sinks on the back side of IC dies exist in the literature and the compatibility of its fabrication with the existing CMOS process has been shown. This compatibility also gives rise to the prospect of building of nearly an infinite variety of channel networks with no additional manufacturing cost. This ICCAD 2015 problem aims to identify methods to optimize such microchannel fluid networks, and to evaluate impact of different cooling networks on different computing architectures floorplans.

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Cited By

View all

Chen GKuang JZeng ZZhang HYoung EYu B(2017)Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network DesignProceedings of the 54th Annual Design Automation Conference 201710.1145/3061639.3062285(1-6)Online publication date: 18-Jun-2017
https://dl.acm.org/doi/10.1145/3061639.3062285
Viswanathan NHuang SLin RKim MMarculescu DLiu F(2015)Overview of the 2015 CAD Contest at ICCADProceedings of the IEEE/ACM International Conference on Computer-Aided Design10.5555/2840819.2840946(910-911)Online publication date: 2-Nov-2015
https://dl.acm.org/doi/10.5555/2840819.2840946

Index Terms

ICCAD 2015 Contest in 3D Interlayer Cooling Optimized Network
1. Applied computing
  1. Arts and humanities
    1. Architecture (buildings)
      1. Computer-aided design
  2. Physical sciences and engineering
    1. Engineering
      1. Computer-aided design
2. Hardware
  1. Hardware validation

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Information & Contributors

Information

Published In

ICCAD '15: Proceedings of the IEEE/ACM International Conference on Computer-Aided Design

November 2015

955 pages

ISBN:9781467383899

General Chair:
Diana Marculescu
Carnegie Mellon Univ., Dept. of Electrical and Computer Engineering, 5000 Forbes Ave., Pittsburgh, PA 15213, 412-268-1167
,
Program Chair:
Frank Liu
IBM Corp., IBM Austin Research Lab, 11501 Burnet Rd., MS 904-6G017, Austin, TX 78758, 512-286-7267

Publisher

IEEE Press

Publication History

Published: 02 November 2015

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Refereed limited

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ICCAD '15

Sponsor:

SIGDA

ICCAD '15: IEEE/ACM INTERNATIONAL CONFERENCE ON COMPUTER-AIDED DESIGN

November 2 - 6, 2015

TX, Austin, USA

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Overall Acceptance Rate 457 of 1,762 submissions, 26%

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Cited By

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Chen GKuang JZeng ZZhang HYoung EYu B(2017)Minimizing Thermal Gradient and Pumping Power in 3D IC Liquid Cooling Network DesignProceedings of the 54th Annual Design Automation Conference 201710.1145/3061639.3062285(1-6)Online publication date: 18-Jun-2017
https://dl.acm.org/doi/10.1145/3061639.3062285
Viswanathan NHuang SLin RKim MMarculescu DLiu F(2015)Overview of the 2015 CAD Contest at ICCADProceedings of the IEEE/ACM International Conference on Computer-Aided Design10.5555/2840819.2840946(910-911)Online publication date: 2-Nov-2015
https://dl.acm.org/doi/10.5555/2840819.2840946

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Recommendations

ICCAD 2015 contest in 3D interlayer cooling optimized network

Hybrid 3D-IC Cooling System Using Micro-fluidic Cooling and Thermal TSVs

Cooling mechanisms in 3D ICs: Thermo-mechanical perspective