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research-article

Mixed-Size 3D Analytical Placement with Heterogeneous Technology Nodes

Authors:

Cheng-Hsiu Hsieh,

Shao-Hsiang Chen,

Yao-Wen ChangAuthors Info & Claims

DAC '24: Proceedings of the 61st ACM/IEEE Design Automation Conference

Article No.: 139, Pages 1 - 6

https://doi.org/10.1145/3649329.3657370

Published: 07 November 2024 Publication History

Abstract

This paper proposes a mixed-size 3D analytical placement framework for face-to-face stacked integrated circuits fabricated with heterogeneous technology nodes and connected by hybrid bonding technology. The proposed framework efficiently partitions a given netlist into two dies and optimizes the positions of each macro, standard cell, and hybrid bonding terminal (HBT). A multi-technology objective function and a multi-technology density penalty calculation process are adopted to handle the heterogeneous-technology-node constraints during mixed-size 3D global placement. Furthermore, a 3D objective function is used to refine the placement result during HBT-cell co-optimization. Our placer achieves the best results for all contest test cases compared with the participating teams at the 2023 CAD Contest at ICCAD on 3D Placement with Macros.

References

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Digital Library

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Cited By

Zhao YLiao PLiu SJiang JLin YYu B(2025)Analytical Heterogeneous Die-to-Die 3-D Placement With MacrosIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2024.344471644:2(402-415)Online publication date: Feb-2025
https://doi.org/10.1109/TCAD.2024.3444716

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cover image ACM Conferences

DAC '24: Proceedings of the 61st ACM/IEEE Design Automation Conference

June 2024

2159 pages

ISBN:9798400706011

DOI:10.1145/3649329

Chair:
Vivek De

Copyright © 2024 Copyright is held by the owner/author(s). Publication rights licensed to ACM.

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Published: 07 November 2024

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DAC '24

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DAC '24: 61st ACM/IEEE Design Automation Conference

June 23 - 27, 2024

CA, San Francisco, USA

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

Zhao YLiao PLiu SJiang JLin YYu B(2025)Analytical Heterogeneous Die-to-Die 3-D Placement With MacrosIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2024.344471644:2(402-415)Online publication date: Feb-2025
https://doi.org/10.1109/TCAD.2024.3444716

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