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An Effective Chemical Mechanical Polishing Fill Insertion Approach

Published: 11 May 2016 Publication History

Abstract

To reduce chip-scale topography variation, dummy fill is commonly used to improve the layout density uniformity. Previous works either sought the most uniform density distribution or sought to minimize the inserted dummy fills while satisfying certain density uniformity constraint. However, due to more stringent manufacturing challenges, more criteria, like line deviation and outlier, emerge at newer technology nodes. This article presents a joint optimization scheme to consider variation, total fill, line deviation, outlier, overlap, and running time simultaneously. More specifically, first we decompose the rectilinear polygons and partition fillable regions into rectangles for easier processing. After decomposition, we insert dummy fills into the fillable rectangular regions optimizing the fill metrics simultaneously. We propose three approaches, Fast Median approach, LP approach, and Iterative approach, which are much faster with better quality, compared with the results of the top three contestants in the ICCAD Contest 2014.

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    cover image ACM Transactions on Design Automation of Electronic Systems
    ACM Transactions on Design Automation of Electronic Systems  Volume 21, Issue 3
    Special Section on New Physical Design Techniques for the Next Generation Integration Technology and Regular Papers
    July 2016
    434 pages
    ISSN:1084-4309
    EISSN:1557-7309
    DOI:10.1145/2926747
    • Editor:
    • Naehyuck Chang
    Issue’s Table of Contents
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Association for Computing Machinery

    New York, NY, United States

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    Publication History

    Published: 11 May 2016
    Accepted: 01 January 2016
    Revised: 01 January 2016
    Received: 01 August 2015
    Published in TODAES Volume 21, Issue 3

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    Author Tags

    1. Polygon decomposition
    2. fill insertion
    3. filling optimization
    4. overlap optimization

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    Funding Sources

    • Research Grants Council of the Hong Kong Special Administrative Region, China

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    • (2023)CmpCNN: CMP Modeling with Transfer Learning CNN ArchitectureACM Transactions on Design Automation of Electronic Systems10.1145/356994128:4(1-18)Online publication date: 17-May-2023
    • (2023)Rectangular partitions of a rectilinear polygonComputational Geometry10.1016/j.comgeo.2022.101965110(101965)Online publication date: Mar-2023
    • (2022)Rectangularization of Digital Objects and Its Relation with Straight SkeletonsCombinatorial Image Analysis10.1007/978-3-031-23612-9_2(31-45)Online publication date: 13-Jul-2022
    • (2020)Equivalent Capacitance Guided Dummy Fill Insertion for Timing and ManufacturabilityProceedings of the 25th Asia and South Pacific Design Automation Conference10.1109/ASP-DAC47756.2020.9045668(133-138)Online publication date: 17-Jan-2020
    • (2019)Density-Uniformity-Aware Analog Layout RetargetingIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.278972837:10(1999-2012)Online publication date: 14-Nov-2019
    • (2017)High Performance Dummy Fill Insertion With Coupling and Uniformity ConstraintsIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2016.263845236:9(1532-1544)Online publication date: Sep-2017
    • (2017)Computing conforming partitions of orthogonal polygons with minimum stabbing numberTheoretical Computer Science10.1016/j.tcs.2017.05.035689(157-168)Online publication date: Aug-2017

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