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A SPICE model of flexible transition metal dichalcogenide field-effect transistors

Published: 07 June 2015 Publication History

Abstract

This paper presents the first SPICE model of the transition metal dichalcogenide (TMD) field-effect transistor (FET), which is a promising candidate for flexible electronics. The model supports different transistor design parameters such as width, length, oxide thickness, and various channel materials (MoS2, WSe2, etc.), as well as the applied strain, which enables the evaluation of transistor- and circuit-level behavior under process variation and different levels of bending. We performed SPICE simulations on digital logic gates to explore the design space of both MoS2- and WSe2-based transistors, and to evaluate the projected performance of these circuits under applied strain. Our simulations show that WSe2 circuits outperform MoS2 and Si-based CMOS in terms of energy-delay product (EDP) by 1 order of magnitude or more, depending on applications. Finally, we investigate TMDFET's behavior under process variation.

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Cited By

View all
  • (2022)Next-Generation Hybrid RF Front-End with MoS2-FET Supply Management Circuit, CNT-FET Amplifiers, and Graphene Thin-Film AntennasElectronics10.3390/electronics1122370811:22(3708)Online publication date: 12-Nov-2022
  • (2020) Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS 2 Materials With Physical and SPICE Model IEEE Access10.1109/ACCESS.2020.30343218(197287-197299)Online publication date: 2020
  • (2018)Transition metal dichalcogenide MoS 2 field-effect transistors for analog circuits: A simulation studyAEU - International Journal of Electronics and Communications10.1016/j.aeue.2018.02.02588(110-119)Online publication date: May-2018
  • Show More Cited By

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Published In

cover image ACM Conferences
DAC '15: Proceedings of the 52nd Annual Design Automation Conference
June 2015
1204 pages
ISBN:9781450335201
DOI:10.1145/2744769
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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Publication History

Published: 07 June 2015

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Author Tags

  1. MoS2
  2. SPICE
  3. TMDFET
  4. WSe2
  5. compact modeling
  6. flexible electronics
  7. process variation
  8. simulation

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DAC '15
Sponsor:
DAC '15: The 52nd Annual Design Automation Conference 2015
June 7 - 11, 2015
California, San Francisco

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

View all
  • (2022)Next-Generation Hybrid RF Front-End with MoS2-FET Supply Management Circuit, CNT-FET Amplifiers, and Graphene Thin-Film AntennasElectronics10.3390/electronics1122370811:22(3708)Online publication date: 12-Nov-2022
  • (2020) Analog Integrated Circuits Based on Wafer-Level Two-Dimensional MoS 2 Materials With Physical and SPICE Model IEEE Access10.1109/ACCESS.2020.30343218(197287-197299)Online publication date: 2020
  • (2018)Transition metal dichalcogenide MoS 2 field-effect transistors for analog circuits: A simulation studyAEU - International Journal of Electronics and Communications10.1016/j.aeue.2018.02.02588(110-119)Online publication date: May-2018
  • (2016)Flexible transition metal dichalcogenide field-effect transistors: A circuit-level simulation study of delay and power under bending, process variation, and scaling2016 21st Asia and South Pacific Design Automation Conference (ASP-DAC)10.1109/ASPDAC.2016.7428103(761-768)Online publication date: Jan-2016

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