Motion picture production facility with liquid cooled 512 processor mobile super computing vehicle and virtual reality environment
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Thermal balancing of liquid-cooled 3D-MPSoCs using channel modulation
DATE '12: Proceedings of the Conference on Design, Automation and Test in EuropeWhile possessing the potential to replace conventional air-cooled heat sinks, inter-tier microchannel liquid cooling of 3D ICs also creates the problem of increased thermal gradients from the fluid inlet to outlet ports [1, 2]. These cooling-induced ...
Explicit transient thermal simulation of liquid-cooled 3D ICs
DATE '13: Proceedings of the Conference on Design, Automation and Test in EuropeThe high heat flux and compact structure of three-dimensional circuits (3D ICs) make conventional air-cooled devices more subsceptible to overheating. Liquid cooling is an alternative that can improve heat dissipation, and reduce thermal issues. Fast ...
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- Conference Chairs:
- Aditi Majumder,
- Larry Hodges,
- Daniel Cohen-Or,
- Editor:
- Stephen N. Spencer
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Association for Computing Machinery
New York, NY, United States
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