Abstract
In this paper we present an experimental study on the effectivenessof incorporating at-speed I DDQ testing with traditionalBIST for improved test coverage. The high speed I DDQtesting is conducted using the differential built-in on-chip current sensor(BICS) that we have recently developed. Two test chips were designed andfabricated implementing a CMOS version of the 74181 ALU chip. In copies ofthis circuit we included the capability of activating 45 different“realistic” CMOS faults: inter- and intra-layer shorts andopens. We examine the fault coverage of both Boolean (voltage) testing andI DDQ testing for these realistic faults. An interestingfinding of our study is that I DDQ testing also detectedseveral of the open faults. Moreover, these include precisely those openfaults for which two pattern voltage tests can get invalidated because oftransient switching states. Our results show that combining both Boolean andcurrent testing does enhance test coverage in a BIST environment.
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J.P. Hurst and A.D. Singh, “A Differential Built-In Current Sensor Design for High Speed I DDQ Testing,” Proceedings of the Eighth International Conference on VLSI Design, Jan. 1995, pp. 419–423.
J.P. Hurst and A.D. Singh, “A Differential Built-In Current Sensor Design for High Speed I DDQ Testing,” IEEE Journal of Solid State Circuits, Vol. 32, No.1, pp. 122–125, Jan. 1997.
F.J. Ferguson and J.P. Shen, “A CMOS Fault Extractor for Inductive Fault Analysis,” IEEE Trans. on CAD, Vol. 7, No.11, pp. 1181–1194, Nov. 1988.
T. Shen, J.C. Daly, and J. Lo, “On-Chip Current Sensing Circuit for CMOS VLSI,” Proc. IEEE VLSI Test Symp., April 1992, pp. 309–314.
C. Hsue and C. Lin, “Built-In Current Sensor for I DDQ Test in CMOS,” Proc. IEEE Intl. Test Conf., Oct. 1993, pp. 635–641.
W. Maly and P. Nigh, “Built-In Current Testing—Feasibility Study,” Proc. IEEE Intl. Conf. on CAD, Nov. 1988, pp. 340–343.
J.P. Hurst, “High Speed Built-In Current Sensors for I DDQ Testing,” MS Thesis, Auburn University, Auburn, Alabama, Electrical Engineering Department, June 1994.
J. Galiay, Y. Crouzet, and M. Vergniault, “Physical versus Logical Fault Models for MOS LSI Circuits: Impact on Their Testability,” IEEE Trans. on Computers, Vol. C-29, No.6, pp. 527–531, June 1980.
W. Maly, P.K. Nag, and P. Nigh, “Testing Oriented Analysis of CMOSICs with Opens,” Proceedings of ICCAD, 1988, pp. 344–347.
C.F. Hawkins, J.M. Soden, A.W. Righter, and F.J. Ferguson, “Defect Classes—An Overdue Paradigm for CMOSIC Testing,” Proc. IEEE Intl. Test Conf., 1994, pp. 413–425.
R. Chandramouli, “On Testing Stuck-Open Faults,” Digest of Papers, 13th Annual IEEE Symposium on Fault Tolerant Computing, Milan, Italy, June 1983, pp. 258–264.
W.H. Kautz, “Testing Faults in Combinational Cellular Logic Arrays,” Proceedings, 8th Annual IEEE Symposium on Switching and Automata Theory, Oct. 1971, pp. 161–174.
J. Rius and J. Figueras, “Proportional BIC Sensor for Current Testing,” JETTA, Vol. 3, No.4, pp. 104–109, Nov. 1992.
H.-J. Wunderlich, M. Herzog, J. Figueras, J.A. Carrasco, and A. Calderon, “Synthesis of I DDQ-Testable Circuits: Integrating Built-In Current Sensors,” Proceedings of European Design and Test Conference, March 1995, pp. 247–254.
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Weber, W.W., Singh, A.D. Incorporating I DDQ Testing with BIST for Improved Coverage: An Experimental Study. Journal of Electronic Testing 11, 147–156 (1997). https://doi.org/10.1023/A:1008218422533
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DOI: https://doi.org/10.1023/A:1008218422533