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A Dynamic Reconfigurable Super-VLIW Architecture for a Fault Tolerant Nanoscale Design

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Transactions on High-Performance Embedded Architectures and Compilers V

Abstract

A new scenario emerges due to nanotechnologies that will enable very high integration at the limits or even beyond silicon. However, the fault rate, which is predicted to range from 1% up to 20% of all devices, could compromise the future of nanotechnologies. This work proposes a fault tolerant reconfigurable architecture that tolerates the high fault rates that are expected in future technologies, named Super-VLIW. The architecture consists of a reconfigurable unit tightly coupled to a MIPS processor. The reconfigurable unit is composed of a binary translation unit, a configuration cache, a reconfigurable coarse-grained array of heterogeneous functional units and an interconnection network. Reconfiguration is done at run-time, by translating the binary code, and no recompilation is needed. The interconnection network is based on a set of multistage networks. These networks provide a fault-tolerant communication between any pair of functional unit and from/to the MIPS register file. This work proposes a mechanism to dynamically allocate the available units to ensure parallel execution of basic operations, performing the placement and routing on a single step, which allows the correct interconnection of units even under huge fault rates. Moreover, the proposed architecture could scale to the future nanotechnologies even under a 15% fault rate.

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Acknowledgment

The authors would like to thank the following brazilian institutions for funding this project: Fapemig, CAPES, and CNPq.

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Correspondence to Ricardo Ferreira or Monica Pereira .

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Ferreira, R., Bueno, C., Laure, M., Pereira, M., Carro, L. (2019). A Dynamic Reconfigurable Super-VLIW Architecture for a Fault Tolerant Nanoscale Design. In: Silvano, C., Bertels, K., Schulte, M. (eds) Transactions on High-Performance Embedded Architectures and Compilers V. Lecture Notes in Computer Science(), vol 11225. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-662-58834-5_7

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  • DOI: https://doi.org/10.1007/978-3-662-58834-5_7

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  • Print ISBN: 978-3-662-58833-8

  • Online ISBN: 978-3-662-58834-5

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