Abstract
During the placement of components in micro-assembly, high impact forces occur. The current approach is to reduce these impact forces by coupling the gripper to the drive unit of the placement device with 5 DOF, wherein the gripper that contacts the component has a relatively low mass. To prevent the gripper from bouncing back at the end of the placement collision a force must be exerted between gripper and drive unit, which can significantly increase the impact forces. A solution has been found to realise an adequate force build-up between gripper and drive unit such that a rebounce of the gripper is prevented without significantly increasing the impact forces. This solution can be implemented relatively easily by placing a spring between gripper and drive unit combined with a force limiter.
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© 2008 International Federation for Information Processing
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Plak, R., Görtzen, R., Puik, E. (2008). Impact Forces Reduction for High-Speed Micro-Assembly. In: Ratchev, S., Koelemeijer, S. (eds) Micro-Assembly Technologies and Applications. IPAS 2008. IFIP — International Federation for Information Processing, vol 260. Springer, Boston, MA. https://doi.org/10.1007/978-0-387-77405-3_32
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DOI: https://doi.org/10.1007/978-0-387-77405-3_32
Publisher Name: Springer, Boston, MA
Print ISBN: 978-0-387-77402-2
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