Abstract
This paper presents a morphological classification of approaches to the assembly of hybrid microsystems or hybrid MEMS. The need for the presented classification comes from the fact that at the moment only limited well structured knowledge is available on how to assemble hybrid MEMS. The classification is based and evaluated on the basis of cases found in literature. The scheme is used in a case study to analyze the assembly process of die encapsulation.
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Kurniawan, I., Tichem, M., Bartek, M. (2006). Morphological Classification of Hybrid Microsystems Assembly. In: Ratchev, S. (eds) Precision Assembly Technologies for Mini and Micro Products. IPAS 2006. IFIP International Federation for Information Processing, vol 198. Springer, Boston, MA. https://doi.org/10.1007/0-387-31277-3_14
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DOI: https://doi.org/10.1007/0-387-31277-3_14
Publisher Name: Springer, Boston, MA
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