2005 Volume 2 Issue 21 Pages 542-547
We report the design, fabrication and electromechanical performance of a newly developed micro electromechanical XY-scanner for micro-optical spatial light modulation using the silicon micromachining technology. A two-dimensional stage is integrated with a silicon micro lens to scan a transmitting infrared light of 1.55-micron-wavelength by the mechanism of the ƒ-θ lens scanner. Mechanical displacement of up to ± 10 microns (optical angle of ± 0.57 degrees) was obtained with a drive voltage of 30V; optical simulation has suggested that the scanner can be used to construct a free-space optical crossconnect of 9-input by 9-output port counts.