default search action
Sourav Das 0002
Person information
- affiliation: Intel Corporation, Santa Clara, CA, USA
- affiliation (PhD 2018): Washington State University, School of Electrical Engineering and Computer Science, Pullman, WA, USA
Other persons with the same name
- Sourav Das — disambiguation page
- Sourav Das 0001
— University of Illinois at Urbana Champaign, Siebel School of Computing and Data Science, Champaign, IL, USA (and 1 more)
Refine list
refinements active!
zoomed in on ?? of ?? records
view refined list in
export refined list as
2020 – today
- 2020
- [j9]Sourav Das
Testing of Prebond Through Silicon Vias. IEEE Des. Test 37(4): 27-34 (2020) - [j8]Srinivasan Gopal
A Hybrid 3D Interconnect With 2x Bandwidth Density Employing Orthogonal Simultaneous Bidirectional Signaling for 3D NoC. IEEE Trans. Circuits Syst. 67-I(11): 3919-3932 (2020)
2010 – 2019
- 2019
- [j7]Dongjin Lee, Sourav Das, Partha Pratim Pande:
Analyzing power-thermal-performance trade-offs in a high-performance 3D NoC architecture. Integr. 65: 282-292 (2019) - [j6]Dongjin Lee, Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Impact of Electrostatic Coupling on Monolithic 3D-enabled Network on Chip. ACM Trans. Design Autom. Electr. Syst. 24(6): 62:1-62:22 (2019) - [c12]Sourav Das, Fei Su, Sreejit Chakravarty:
A Comparative Study of Pre-bond TSV Test Methodologies. VTS 2019: 1-6 - 2018
- [j5]Dongjin Lee, Sourav Das, Dae Hyun Kim, Janardhan Rao Doppa, Partha Pratim Pande
Design Space Exploration of 3D Network-on-Chip: A Sensitivity-based Optimization Approach. ACM J. Emerg. Technol. Comput. Syst. 14(3): 32:1-32:26 (2018) - [j4]Dongjin Lee, Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Performance and Thermal Tradeoffs for Energy-Efficient Monolithic 3D Network-on-Chip. ACM Trans. Design Autom. Electr. Syst. 23(5): 60:1-60:25 (2018) - [j3]Srinivasan Gopal
High-Performance and Small-Form Factor Near-Field Inductive Coupling for 3-D NoC. IEEE Trans. Very Large Scale Integr. Syst. 26(12): 2921-2934 (2018) - [c11]Sourav Das, Fei Su, Sreejit Chakravarty:
A PVT-Resilient No-Touch DFT Methodology for Prebond TSV Testing. ITC 2018: 1-10 - [c10]Sourav Das, Kanad Basu, Janardhan Rao Doppa, Partha Pratim Pande, Ramesh Karri
Abetting Planned Obsolescence by Aging 3D Networks-on-Chip. NOCS 2018: 10:1-10:8 - 2017
- [j2]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3-D Small-World Network-on-Chip. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(5): 719-732 (2017) - [j1]Sourav Das, Dongjin Lee, Wonje Choi, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
VFI-Based Power Management to Enhance the Lifetime of High-Performance 3D NoCs. ACM Trans. Design Autom. Electr. Syst. 23(1): 7:1-7:26 (2017) - [c9]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Robust TSV-based 3D NoC design to counteract electromigration and crosstalk noise. DATE 2017: 1366-1371 - [c8]Sourav Das, Srinivasan Gopal
Energy-efficient and robust 3D NoCs with contactless vertical links (Invited paper). ICCAD 2017: 1-6 - [c7]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Monolithic 3D-Enabled High Performance and Energy Efficient Network-on-Chip. ICCD 2017: 233-240 - [c6]Dongjin Lee, Sourav Das, Partha Pratim Pande:
Performance-thermal trade-offs for a VFI-enabled 3D NoC architecture. ISQED 2017: 271-276 - [c5]Srinivasan Gopal
Energy and Area Efficient Near Field Inductive Coupling: A Case Study on 3D NoC. NOCS 2017: 5:1-5:8 - 2016
- [c4]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty:
Reliability and performance trade-offs for 3D NoC-enabled multicore chips. DATE 2016: 1429-1432 - [c3]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty
Energy-efficient and reliable 3D network-on-chip (NoC): architectures and optimization algorithms. ICCAD 2016: 57 - [i1]Sourav Das, Janardhan Rao Doppa, Partha Pratim Pande, Krishnendu Chakrabarty:
Design-Space Exploration and Optimization of an Energy-Efficient and Reliable 3D Small-world Network-on-Chip. CoRR abs/1608.06972 (2016) - 2015
- [c2]Sourav Das, Dongjin Lee, Dae Hyun Kim, Partha Pratim Pande:
Small-World Network Enabled Energy Efficient and Robust 3D NoC Architectures. ACM Great Lakes Symposium on VLSI 2015: 133-138 - [c1]Sourav Das, Janardhan Rao Doppa, Daehyun Kim, Partha Pratim Pande, Krishnendu Chakrabarty
Optimizing 3D NoC Design for Energy Efficiency: A Machine Learning Approach. ICCAD 2015: 705-712
Coauthor Index
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.
Unpaywalled article links
Add open access links from to the list of external document links (if available).
Privacy notice: By enabling the option above, your browser will contact the API of unpaywall.org to load hyperlinks to open access articles. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Unpaywall privacy policy.
Archived links via Wayback Machine
For web page which are no longer available, try to retrieve content from the of the Internet Archive (if available).
Privacy notice: By enabling the option above, your browser will contact the API of archive.org to check for archived content of web pages that are no longer available. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Internet Archive privacy policy.
Reference lists
Add a list of references from ,
, and
to record detail pages.
load references from crossref.org and opencitations.net
Privacy notice: By enabling the option above, your browser will contact the APIs of crossref.org, opencitations.net, and semanticscholar.org to load article reference information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the Crossref privacy policy and the OpenCitations privacy policy, as well as the AI2 Privacy Policy covering Semantic Scholar.
Citation data
Add a list of citing articles from and
to record detail pages.
load citations from opencitations.net
Privacy notice: By enabling the option above, your browser will contact the API of opencitations.net and semanticscholar.org to load citation information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the OpenCitations privacy policy as well as the AI2 Privacy Policy covering Semantic Scholar.
OpenAlex data
Load additional information about publications from .
Privacy notice: By enabling the option above, your browser will contact the API of openalex.org to load additional information. Although we do not have any reason to believe that your call will be tracked, we do not have any control over how the remote server uses your data. So please proceed with care and consider checking the information given by OpenAlex.
last updated on 2024-12-23 20:35 CET by the dblp team
all metadata released as open data under CC0 1.0 license
see also: Terms of Use | Privacy Policy | Imprint
dblp was originally created in 1993 at:
since 2018, dblp has been operated and maintained by:
the dblp computer science bibliography is funded and supported by: