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Mostafa Said
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2020 – today
- 2021
- [j5]Amin Sarihi
, Ahmad Patooghy
A Survey on the Security of Wired, Wireless, and 3D Network-on-Chips. IEEE Access 9: 107625-107656 (2021) - [j4]Mostafa Said
Novel flexible buffering architectures for 3D-NoCs. Sustain. Comput. Informatics Syst. 29(Part): 100472 (2021) - 2020
- [j3]Fulya Kaplan
LoCool: Fighting Hot Spots Locally for Improving System Energy Efficiency. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 39(4): 895-908 (2020)
2010 – 2019
- 2019
- [j2]Mostafa Said
Thermal-aware network-on-chips: Single- and cross-layered approaches. Future Gener. Comput. Syst. 91: 61-85 (2019) - 2018
- [c7]Mostafa Said, Sofiane Chetoui, Adel Belouchrani, Sherief Reda:
Understanding the Sources of Power Consumption in Mobile SoCs. IGSC 2018: 1-7 - 2017
- [c6]Mostafa Khamis, Mostafa Said, Ahmed Shalaby
Work-in-Progress: A Flexible Router Architecture for 3D NoCs. RTSS 2017: 375-377 - [c5]Mostafa Said, Hossam Hassan, HyungWon Kim, Mostafa Khamis:
A novel power reduction technique using wire multiplexing. SoCC 2017: 149-152 - 2016
- [j1]Mostafa Said
A design methodology and various performance and fabrication metrics evaluation of 3D Network-on-Chip with multiplexed Through-Silicon Vias. Microprocess. Microsystems 43: 26-46 (2016) - [c4]Hossam Hassan, Mostafa Said, HyungWon Kim:
Performance evaluation of buffer sharing routers for Network on Chip. MWSCAS 2016: 1-4 - 2014
- [c3]Mostafa Said, Farhad Mehdipour, Kazuaki J. Murakami, Mohamed El-Sayed:
A Design Methodology for Performance Maintenance of 3D Network-on-Chip with Multiplexed Through-Silicon Vias. MES@ISCA 2014: 9-16 - [c2]Mostafa Said, Mohamed El-Sayed, Farhad Mehdipour, Nobuaki Miyakawa:
Keep-Out-Zone analysis for three-dimensional ICs. VLSI-DAT 2014: 1-4 - 2013
- [c1]Mostafa Said, Farhad Mehdipour, Mohamed El-Sayed:
Improving Performance and Fabrication Metrics of Three-Dimensional ICs by Multiplexing Through-Silicon Vias. DSD 2013: 925-932
Coauthor Index
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