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Melina Lofrano
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2020 – today
- 2023
- [c6]Youqi Ding
, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes:
Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. IRPS 2023: 1-7 - [c5]Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei
Towards accurate temperature prediction in BEOL for reliability assessment (Invited). IRPS 2023: 1-7 - [c4]Subrat Mishra, Sankatali Venkateswarlu
Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). IRPS 2023: 1-7 - 2022
- [c3]O. Varela Pedreira
Assessment of critical Co electromigration parameters. IRPS 2022: 8 - 2021
- [c2]Alicja Lesniewska, Olalla Varela Pedreira
Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps. IRPS 2021: 1-6
2010 – 2019
- 2018
- [j3]Melina Lofrano, Vladimir Cherman, Mario Gonzalez
Enhanced Cu pillar design to reduce thermomechanical stress induced during flip chip assembly. Microelectron. Reliab. 87: 97-105 (2018) - [c1]Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf
Stress mitigation of 3D-stacking/packaging induced stresses. IRPS 2018: 4 - 2014
- [j2]Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54(6-7): 1200-1205 (2014) - 2011
- [j1]Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson:
Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach. Microelectron. Reliab. 51(9-11): 1578-1581 (2011)
Coauthor Index
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