More Web Proxy on the site http://driver.im/

default search action

combined dblp search
author search
venue search
publication search

ask others

"Chip-Package Interaction in 3D stacked IC packages using Finite Element ..."

Bart Vandevelde et al. (2014)

> Home

Details and statistics

DOI: 10.1016/J.MICROREL.2014.02.026

access: closed

type: Journal Article

metadata version: 2024-08-04

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - journals/mr/VandeveldeIDLVGCGPWBT14
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/journals/mr/VandeveldeIDLVGCGPWBT14
Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei:
Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling. Microelectron. Reliab. 54(6-7): 1200-1205 (2014)

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.