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"A Novel Method Based on Deep Convolutional Neural Networks for Wafer ..."

Guojun Wen et al. (2020)

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DOI: 10.1109/TIM.2020.3007292

access: closed

type: Journal Article

metadata version: 2020-12-31

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  - https://dblp.org/rec/journals/tim/WenGCWM20
Guojun Wen, Zhijun Gao, Qi Cai, Yudan Wang, Shuang Mei:
A Novel Method Based on Deep Convolutional Neural Networks for Wafer Semiconductor Surface Defect Inspection. IEEE Trans. Instrum. Meas. 69(12): 9668-9680 (2020)

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