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"TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and ..."

Moongon Jung et al. (2012)

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DOI: 10.1109/TCAD.2012.2188400

access: closed

type: Journal Article

metadata version: 2022-10-02

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Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Kyu Lim:
TSV Stress-Aware Full-Chip Mechanical Reliability Analysis and Optimization for 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 31(8): 1194-1207 (2012)

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