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"The influence of solder composition on the impact strength of lead-free ..."

H. Tsukamoto et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.10.012

access: closed

type: Journal Article

metadata version: 2020-02-22

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H. Tsukamoto, T. Nishimura, S. Suenaga, Stuart D. McDonald, Keith W. Sweatman, Kazuhiro Nogita:
The influence of solder composition on the impact strength of lead-free solder ball grid array joints. Microelectron. Reliab. 51(3): 657-667 (2011)

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