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"Role of process parameters on bondability and pad damage indicators in ..."

I. Qin et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.04.001

access: closed

type: Journal Article

metadata version: 2023-11-13

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I. Qin, Aashish Shah, C. Huynh, M. Meyer, M. Mayer, Norman Y. Zhou:
Role of process parameters on bondability and pad damage indicators in copper ball bonding. Microelectron. Reliab. 51(1): 60-66 (2011)

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