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"Study of thermal cycling and temperature aging on PbSnAg die attach solder ..."
Franc Dugal, Mauro Ciappa (2014)
- Franc Dugal, Mauro Ciappa:
Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules. Microelectron. Reliab. 54(9-10): 1856-1861 (2014)
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