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"Reliability design of direct liquid cooled power semiconductor module for ..."

Xiaoping Dai et al. (2016)

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DOI: 10.1016/J.MICROREL.2016.07.063

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/DaiWWLLLJ16
Xiaoping Dai, Yangang Wang, Yibo Wu, Haihui Luo, Guoyou Liu, Daohui Li, Steve Jones:
Reliability design of direct liquid cooled power semiconductor module for hybrid and electric vehicles. Microelectron. Reliab. 64: 474-478 (2016)

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