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"Integrated thermal assembly using hierarchical kernel regression method."

Jianhua Su et al. (2019)

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DOI: 10.1080/01691864.2019.1679252

access: closed

type: Journal Article

metadata version: 2020-08-29

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  dblp key:
  - journals/ar/SuCLYLQ19
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  - https://dblp.org/rec/journals/ar/SuCLYLQ19
Jianhua Su, Bin Chen, Chuankai Liu, Xu Yang, Zhiyong Liu, Hong Qiao:
Integrated thermal assembly using hierarchical kernel regression method. Adv. Robotics 33(22): 1194-1208 (2019)

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