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"A Through-Hole Capacitive Micromachined Ultrasonic Transdcuer with High ..."

Jie Li et al. (2019)

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DOI: 10.1109/NEMS.2019.8915605

access: closed

type: Conference or Workshop Paper

metadata version: 2023-11-10

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  dblp key:
  - conf/nems/LiJZLLZXGWZ19
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  - https://dblp.org/rec/conf/nems/LiJZLLZXGWZ19
Jie Li, Zhuangde Jiang, Libo Zhao, Dejiang Lu, Zhikang Li, Yihe Zhao, Tingzhong Xu, Shuaishuai Guo, Jiuhong Wang, Yulong Zhao:
A Through-Hole Capacitive Micromachined Ultrasonic Transdcuer with High Perfromance. NEMS 2019: 181-186

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