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"Cost-minimized double die DRAM packaging for ultra-high performance DDR3 ..."

Richard Crisp et al. (2012)

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DOI: 10.1109/ISQED.2012.6187546

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-25

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Richard Crisp, Bill Gervasi, Wael Zohni, Bel Haba:
Cost-minimized double die DRAM packaging for ultra-high performance DDR3 and DDR4 multi-rank server DIMMs. ISQED 2012: 437-444

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