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"Reliability-constrained die stacking order in 3DICs under manufacturing ..."

Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li (2013)

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DOI: 10.1109/ISQED.2013.6523584

access: closed

type: Conference or Workshop Paper

metadata version: 2020-07-15

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Tuck-Boon Chan, Andrew B. Kahng, Jiajia Li:
Reliability-constrained die stacking order in 3DICs under manufacturing variability. ISQED 2013: 16-23

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