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"Impacts of different shapes of through-silicon-via core on 3D IC performance."

Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury (2017)

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DOI: 10.1109/ISCAS.2017.8050434

access: closed

type: Conference or Workshop Paper

metadata version: 2017-10-07

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  dblp key:
  - conf/iscas/YousufHC17
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Abdul Hamid Bin Yousuf, Nahid M. Hossain, Masud H. Chowdhury:
Impacts of different shapes of through-silicon-via core on 3D IC performance. ISCAS 2017: 1-4

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