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"Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and ..."

Taigon Song et al. (2015)

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DOI: 10.1109/ICCAD.2015.7372645

access: closed

type: Conference or Workshop Paper

metadata version: 2022-10-02

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  - conf/iccad/SongPCL15
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  - https://dblp.org/rec/conf/iccad/SongPCL15
Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim:
Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection. ICCAD 2015: 752-757

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