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"Comprehensive 300 mm process for Silicon spin qubits with modular integration."

A. Elsayed et al. (2023)

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DOI: 10.23919/VLSITECHNOLOGYANDCIR57934.2023.10185272

access: closed

type: Conference or Workshop Paper

metadata version: 2024-11-22

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A. Elsayed, Clement Godfrin, Nard I. Dumoulin Stuyck, M. M. K. Shehata, Stefan Kubicek, S. Massar, Yann Canvel, Julien Jussot, Andriy Hikavyy, Roger Loo, George Simion, Massimo Mongillo, D. Wan, Bogdan Govoreanu, Ruoyu Li, Iuliana P. Radu, Pol Van Dorpe, Kristiaan De Greve:
Comprehensive 300 mm process for Silicon spin qubits with modular integration. VLSI Technology and Circuits 2023: 1-2

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