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"Through-substrate via (TSV) with embedded capacitor as an on-chip energy ..."

Ye Lin, Chuan Seng Tan (2016)

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DOI: 10.1109/3DIC.2016.7970003

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Ye Lin, Chuan Seng Tan:
Through-substrate via (TSV) with embedded capacitor as an on-chip energy storage element. 3DIC 2016: 1-4

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