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32nd Hot Chips Symposium 2020: Palo Alto, CA, USA
- IEEE Hot Chips 32 Symposium, HCS 2020, Palo Alto, CA, USA, August 16-18, 2020. IEEE 2020, ISBN 978-1-7281-7129-6
- Dan Belov:
AI Research at Scale-Opportunities on the Road Ahead. 1-88 - Sonu Arora, Dan Bouvier, Chris Weaver:
AMD Next Generation 7NM Ryzen™ 4000 APU "Renoir". 1-30 - Allan Skillman, Tomas Edsö:
A Technical Overview of Cortex-M55 and Ethos-U55: Arm's Most Capable Processors for Endpoint AI. 1-20 - Rabin Sugumar:
ThunderX3 Next-Generation Arm-Based Server. 1-19 - Irma Esmer Papazian:
New 3rd Gen Intel® Xeon® Scalable Processor (Codename: Ice Lake-SP). 1-22 - Xavier Vera:
Inside Tiger Lake: Intel's Next Generation Mobile Client CPU. 1-26 - Xiantao Zxt, Zhengxiao Zx, Justin Song:
High-density Multi-tenant Bare-metal Cloud with Memory Expansion SoC and Power Management. 1-18 - Florian Zaruba, Fabian Schuiki, Luca Benini:
A 4096-core RISC-V Chiplet Architecture for Ultra-efficient Floating-point Computing. 1-24 - Anthony Saporito:
The IBM z15 processor chip set. 1-17 - Carl Ramey:
Silicon Photonics for Artificial Intelligence Acceleration : HotChips 32. 1-26 - Jeff Andrews, Mark Grossman:
Xbox Series X System Architecture. 1-29 - Ilya K. Ganusov, Mahesh A. Iyer
, Ning Cheng, Alon Meisler:
Agilex™ Generation of Intel® FPGAs. 1-26 - David Blythe:
The Xe GPU Architecture. 1-27 - William J. Starke, Brian W. Thompto:
IBM's POWER10 Processor. 1-43 - Yang Jiao, Liang Han, Xin Long:
Hanguang 800 NPU - The Ultimate AI Inference Solution for Data Centers. 1-29 - Jack Choquette, Wish Gandhi:
NVIDIA A100 GPU: Performance & Innovation for GPU Computing. 1-43 - Francis Matus:
Distributed Services Architecture. 1-17 - Chen Chen, Xiaoyan Xiang, Chang Liu, Yunhai Shang
Xuantie-910: Innovating Cloud and Edge Computing by RISC-V. 1-19 - Anurag Agrawal, Changhoon Kim:
Intel Tofino2 - A 12.9Tbps P4-Programmable Ethernet Switch. 1-32 - Jian Ouyang, Mijung Noh, Yong Wang, Wei Qi, Yin Ma, Canghai Gu, SoonGon Kim, Ki-il Hong, Wang-Keun Bae, Zhibiao Zhao, Jing Wang, Peng Wu, Xiaozhang Gong, Jiaxin Shi, Hefei Zhu, Xueliang Du
Baidu Kunlun An AI processor for diversified workloads. 1-18 - Martin Voogel, Yohan Frans, Matt Ouellette, Jason Coppens, Sagheer Ahmad, Jaideep Dastidar, Ehab Mohsen, Faisal Dada, Mike Thompson, Ralph Wittig, Trevor Bauer, Gaurav Singh:
Xilinx Versal™ Premium. 1-46 - Glenn G. Ko, Yuji Chai, Marco Donato, Paul N. Whatmough, Thierry Tambe
A Scalable Bayesian Inference Accelerator for Unsupervised Learning. 1-27 - Ljubisa Bajic, Jasmina Vasiljevic:
Compute substrate for Software 2.0. 1-31 - Thomas Norrie, Nishant Patil, Doe Hyun Yoon, George Kurian, Sheng Li, James Laudon, Cliff Young, Norman P. Jouppi, David A. Patterson:
Google's Training Chips Revealed: TPUv2 and TPUv3. 1-70 - Hot Chips 2020 Posters. 1-159
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