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9th EMC Compo 2013: Nara, Japan
- 9th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC Compo 2013, Nara, Japan, December 15-18, 2013. IEEE 2013
- Osami Wada:
Chair's welcome. 1 - Tomohiro Kinoshita, Shoichi Hara, Eiji Takahashi, Kazuhide Uriu:
A technique for estimating signal waveforms at inaccessible points in high speed digital circuits. 1-4 - Heegon Kim, Jonghyun Cho, Daniel H. Jung, Jonghoon J. Kim, Sumin Choi, Joungho Kim, Junho Lee, Kunwoo Park:
Design and measurement of a compact on-interposer passive equalizer for chip-to-chip high-speed differential signaling. 5-9 - Etienne Sicard, Jianfei Wu, Jiancheng Li:
Signal integrity and EMC performance enhancement using 3D integrated circuits - A case study. 10-14 - Sjoerd Op't Land, Richard Perdriau, Mohammed Ramdani, Olivier Maurice
, M'hamed Drissi:
Kron simulation of field-to-line coupling using a meshed and a modified Taylor cell. 15-20 - Umberto Paoletti
Extraction of deterministic and random LSI noise models with the printed reverberation board. 21-26 - Renaud Gillon
Broadband detection of radiating moments using the TEM-cell and a phase-calibrated oscilloscope. 27-32 - Atsushi Nakamura, Masaaki Maeda, Tohlu Matsushima
Substrate noise reduction based on impedance balance using tunable resistances. 33-36 - Makoto Nagata
Measurement-based diagnosis of wireless communication performance in the presence of in-band interferers in RF ICs. 37-41 - Naoya Azuma, Shunsuke Shimazaki, Noriyuki Miura, Makoto Nagata
Measurements and simulation of substrate noise coupling in RF ICs with CMOS digital noise emulator. 42-46 - Sho Muroga
In-band spurious attenuation in LTE-class RFIC chip using a soft magnetic thin film. 47-52 - Siham Hairoud, Tristan Dubois
Conducted immunity of three Op-Amps using the DPI measurement technique and VHDL-AMS modeling. 53-58 - Tohlu Matsushima
Improvement of reproducibility of DPI method to quantify RF conducted immunity of LDO regulator. 59-62 - Sergey Miropolsky, Alexander Sapadinsky, Stephan Frei
A generalized accurate modelling method for automotive bulk current injection (BCI) test setups up to 1 GHz. 63-68 - Tvrtko Mandic, Renaud Gillon
IC-Stripline design optimization using response surface methodology. 69-73 - L. Guibert, P. Millot, Xavier Ferrières, Etienne Sicard:
Study of radiated immunity of an electronic system in a reverberating chamber. 74-77 - Yu-ichi Hayashi, Naofumi Homma, Takafumi Aoki, Yuichiro Okugawa, Yoshiharu Akiyama:
Transient analysis of EM radiation associated with information leakage from cryptographic ICs. 78-82 - KyungSoo Kim, Wansoo Nah, SoYoung Kim:
Noise-immune design of Schmitt trigger logic gate using DTMOS for sub-threshold circuits. 83-88 - C. Oliveira, Juliano Benfica, Letícia Maria Bolzani Poehls, Fabian Vargas, José Lipovetzky
Reliability analysis of an on-chip watchdog for embedded systems exposed to radiation and EMI. 89-94 - Jérémy Raoult, A. Blain, Sylvie Jarrix:
An optimizing technique to lower both phase noise and susceptibility of a voltage controlled oscillator. 95-100 - Alexis Schindler, Benno Koeppl, Bernhard Wicht:
EMC analysis of current source gate drivers. 101-106 - Philipp Schröter, Stefan Jahn, Frank Klotz, Fabio Ballarin, Fabio Gini, Marco Piselli:
EMI resisting LDO voltage regulator with integrated current monitor. 107-112 - Tsuyoshi Funaki:
A study on gate voltage fluctuation of MOSFET induced by switching operation of adjacent MOSFET in high voltage power conversion circuit. 113-118 - Wei-li Sun, Feng-Chang Chuang, Yu-Lin Song
Active magnetic field canceling system. 119-122 - Bernd Deutschmann
Spread spectrum clocking for emission reduction of charge pump applications. 123-128 - Marco Cazzaniga
Evaluating the impact of substrate noise on conducted EMI in automotive microcontrollers. 129-133 - Masaaki Maeda, Tohlu Matsushima
Impedance balance control for suppression of fluctuation on ground voltage in LSI package. 134-137 - Shih-Yi Yuan
Automatic conducted-EMI microcontroller model building. 138-141 - Haruya Fujita, Hiroki Takatani, Yosuke Tanaka, Shohei Kawaguchi, Masaomi Sato, Toshio Sudo:
Evaluation of PDN impedance and power supply noise for different on-chip decoupling structures. 142-146 - Néstor Berbel, Raúl Fernández-García, Ignacio Gil
Characterization of conducted emission at high frequency under different temperature. 147-151 - André Durier
Using the EM simulation tools to predict the Conducted Emissions level of a DC/DC boost converter: Introducing EBEM-CE model. 152-157 - Jonghoon J. Kim, Heegon Kim, Sukjin Kim, Bumhee Bae, Daniel H. Jung, Sunkyu Kong, Joungho Kim, Junho Lee, Kunwoo Park:
Design of contactless wafer-level TSV connectivity testing structure using capacitive coupling. 158-162 - Daniel H. Jung, Heegon Kim, Jonghoon J. Kim, Joungho Kim, Hyun-Cheol Bae, Kwang-Seong Choi:
Modeling and analysis of open defect in through silicon via (TSV) channel. 163-166 - Yin-Cheng Chang, Shawn S. H. Hsu, Yen-Tang Chang, Chiu-Kuo Chen, Hsu-Chen Cheng, Da-Chiang Chang:
The direct RF power injection method up to 18 GHz for investigating IC's susceptibility. 167-170 - Wataru Ichimura, Sho Kiyoshige, Masahiro Terasaki, Ryota Kobayashi, Genki Kubo, Hiroki Otsuka, Toshio Sudo:
Anti-resonance peak frequency control by variable on-die capacitance. 171-174 - Kengo Iokibe, Yoshitaka Toyota:
Estimation of data-dependent power voltage variations of FPGA by equivalent circuit modeling from on-board measurements. 175-179 - Thomas Steinecke:
Microcontroller emission simulation based on power consumption and clock system. 180-185 - Shih-Yi Yuan
A microcontrller conducted EMI model building for software-level effect. 186-189 - Alexandre Boyer, Sonia Ben Dhia:
Characterization and modeling of electrical stresses on digital integrated circuits power integrity and conducted emission. 190-195 - Thomas Steinecke, Markus Unger, Stanislav Scheier, Stephan Frei
System-ESD validation of a microcontroller with external RC-filter. 196-201 - Bertrand Vrignon, P. Caunegre, John Shepherd, Jianfei Wu:
Automatic verification of EMC immunity by simulation. 202-207 - Sonia Ben Dhia, Alexandre Boyer:
Electro-magnetic robustness of integrated circuits: from statement to prediction. 208-213 - Hermann Nzalli, Wolfgang Wilkening, Rolf H. Jansen:
EMC immunity of integrated smart power transistors in a non-50Ω environment. 214-219 - Sylvie Jarrix, Jérémy Raoult, Adrien Doridant, Clovis Pouant, Patrick Hoffmann:
Discrete low-frequency transistors subjected to high-frequency CW and pulse-modulated sine signals. 220-225 - Akitaka Murata, Shuji Agatsuma, Daisaku Ikoma, Kouji Ichikawa, Takahiro Tsuda, Makoto Nagata
Noise analysis using on-chip waveform monitor in bandgap voltage references. 226-231 - Kumpei Yoshikawa, Yuji Harada, Noriyuki Miura, Noriaki Takeda, Yoshiyuki Saito, Makoto Nagata
Immunity evaluation of inverter chains against RF power on power delivery network. 232-237 - Bumhee Bae, Sunkyu Kong, Jonghoon J. Kim, Sukjin Kim, Joungho Kim:
Magnetic field coupling on analog-to-digital converter from wireless power transfer system in automotive environment. 238-242 - Yosuke Kondo, Kei Tsunada, Norimasa Oka, Masato Izumichi:
Immunity simulation method for automotive power module using electromagnetic analysis. 243-248 - Hugo Pues, Ben Brike, Celina Gazda, Peter Teichmann, Kristof Stijnen, Christian Peeters, André Durier, Dries Vande Ginste:
Translation of automotive module RF immunity test limits into equivalent IC test limits using S-parameter IC models. 249-253
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