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Low Temperature Adhesive Bonding-Based Fabrication of an Air-Borne Flexible Piezoelectric Micromachined Ultrasonic Transducer

Sensors (Basel). 2020 Jun 11;20(11):3333. doi: 10.3390/s20113333.

Abstract

This paper presents the development of a flexible piezoelectric micromachined ultrasonic transducer (PMUT) that can conform to flat, concave, and convex surfaces and work in air. The PMUT consists of an Ag-coated polyvinylidene fluoride (PVDF) film mounted onto a laser-manipulated polymer substrate. A low temperature (<100 °C) adhesive bonding technique is adopted in the fabrication process. Finite element analysis (FEA) is implemented to confirm the capability of predicting the resonant frequency of composite diaphragms and optimizing the device. The manufactured PMUT exhibits a center frequency of 198 kHz with a wide operational bandwidth. Its acoustic performance is demonstrated by transmitting and receiving ultrasound in air on curved surface. The conclusions from this study indicate the proposed PMUT has great potential in ultrasonic and wearable devices applications.

Keywords: air; flexible; low temperature adhesive bonding; piezoelectric micromachined ultrasonic transducer (PMUT); time of flight (TOF).