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A simulation-based cost modeling methodology for evaluation of interbay material handling in a semiconductor wafer fab

Authors:

Shari Murray,

Gerald T. Mackulak,

John W. Fowler,

Theron ColvinAuthors Info & Claims

WSC '00: Proceedings of the 32nd conference on Winter simulation

Pages 1510 - 1517

Published: 10 December 2000 Publication History

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Abstract

In the next generation of semiconductor wafer fabrication facilities, decisions concerning material handling systems will be a major factor in initial facility cost, operational cost, production cycle times, and possibly product yield percentages. The wafers will increase in diameter to 300 mm and a new front opening unified pod (FOUP) has been designed to carry them, both increasing the weight of a production lot. This increase requires substantial automation for ergonomic and quality reasons. As a result, semiconductor manufacturers are asking, "What level of automation is financially justifiable?"Automation suppliers have stated that automation saves money, but have as yet not produced a sufficiently detailed financial analysis proving their premise. In this paper, both a fully automated and a manual material handling system are simulated and compared in a thorough cost analysis. Sensitivity analysis is performed on inflation rate, interest rate, die price, wafer start rate, and yield percentage to validate the results of the analyses.

References

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Cited By

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Schmaler RHammel CSchubert C(2020)Static AMHS simulation based on planned product mixesProceedings of the Winter Simulation Conference10.5555/3466184.3466374(1688-1699)Online publication date: 14-Dec-2020
https://dl.acm.org/doi/10.5555/3466184.3466374
Ben-Salem AYugma CTroncet EPinaton J(2017)A simulation-based approach for an effective AMHS design in a legacy semiconductor manufacturing facilityProceedings of the 2017 Winter Simulation Conference10.5555/3242181.3242494(1-12)Online publication date: 3-Dec-2017
https://dl.acm.org/doi/10.5555/3242181.3242494
Kuhl MChristopher J(2004)Capacity analysis of automated material handling systems in semiconductor fabsProceedings of the 36th conference on Winter simulation10.5555/1161734.1162100(1962-1966)Online publication date: 5-Dec-2004
https://dl.acm.org/doi/10.5555/1161734.1162100
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A simulation-based cost modeling methodology for evaluation of interbay material handling in a semiconductor wafer fab
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Published In

WSC '00: Proceedings of the 32nd conference on Winter simulation

December 2000

2014 pages

ISBN:0780365828

Publisher

Society for Computer Simulation International

San Diego, CA, United States

Publication History

Published: 10 December 2000

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WSC00

Sponsor:

IIE
ASA
SIGSIM
IEEE/CS
NIST
INFORMS-CS
IEEE/SMCS
SCS

WSC00: Winter Simulation Conference

December 10 - 13, 2000

Florida, Orlando

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Cited By

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Schmaler RHammel CSchubert C(2020)Static AMHS simulation based on planned product mixesProceedings of the Winter Simulation Conference10.5555/3466184.3466374(1688-1699)Online publication date: 14-Dec-2020
https://dl.acm.org/doi/10.5555/3466184.3466374
Ben-Salem AYugma CTroncet EPinaton J(2017)A simulation-based approach for an effective AMHS design in a legacy semiconductor manufacturing facilityProceedings of the 2017 Winter Simulation Conference10.5555/3242181.3242494(1-12)Online publication date: 3-Dec-2017
https://dl.acm.org/doi/10.5555/3242181.3242494
Kuhl MChristopher J(2004)Capacity analysis of automated material handling systems in semiconductor fabsProceedings of the 36th conference on Winter simulation10.5555/1161734.1162100(1962-1966)Online publication date: 5-Dec-2004
https://dl.acm.org/doi/10.5555/1161734.1162100
McAllister CAltuntas BFrank MPotoradi JRohrer MMedeiros DGrabau M(2001)Implementation of response surface methodology using variance reduction techniques in semiconductor manufacturingProceedings of the 33nd conference on Winter simulation10.5555/564124.564301(1225-1230)Online publication date: 9-Dec-2001
https://dl.acm.org/doi/10.5555/564124.564301

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