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ZA892266B - Process for preparing photocured coatings - Google Patents

Process for preparing photocured coatings

Info

Publication number
ZA892266B
ZA892266B ZA892266A ZA892266A ZA892266B ZA 892266 B ZA892266 B ZA 892266B ZA 892266 A ZA892266 A ZA 892266A ZA 892266 A ZA892266 A ZA 892266A ZA 892266 B ZA892266 B ZA 892266B
Authority
ZA
South Africa
Prior art keywords
preparing
photocured coatings
photocured
coatings
preparing photocured
Prior art date
Application number
ZA892266A
Other languages
English (en)
Inventor
Charles Edward Warburton Jr
Edward Warburton Charles Jr
Nicholas Andrew Rounds
Andrew Rounds Nicholas
Original Assignee
Rohm & Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas filed Critical Rohm & Haas
Publication of ZA892266B publication Critical patent/ZA892266B/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G03F7/0955—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer one of the photosensitive systems comprising a non-macromolecular photopolymerisable compound having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Paints Or Removers (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Epoxy Resins (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Polymerisation Methods In General (AREA)
ZA892266A 1988-03-29 1989-03-28 Process for preparing photocured coatings ZA892266B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17457988A 1988-03-29 1988-03-29

Publications (1)

Publication Number Publication Date
ZA892266B true ZA892266B (en) 1989-11-29

Family

ID=22636685

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA892266A ZA892266B (en) 1988-03-29 1989-03-28 Process for preparing photocured coatings

Country Status (14)

Country Link
EP (1) EP0335629A3 (xx)
JP (1) JPH029480A (xx)
KR (1) KR890014180A (xx)
CN (1) CN1037041A (xx)
AU (1) AU607318B2 (xx)
BR (1) BR8901395A (xx)
DK (1) DK149489A (xx)
FI (1) FI891480A7 (xx)
IL (1) IL89775A0 (xx)
MX (1) MX169037B (xx)
MY (1) MY103987A (xx)
NO (1) NO891226L (xx)
PH (1) PH26033A (xx)
ZA (1) ZA892266B (xx)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2604438B2 (ja) * 1988-09-19 1997-04-30 旭電化工業株式会社 樹脂の光学的造形方法
JP2632961B2 (ja) * 1988-09-13 1997-07-23 旭電化工業株式会社 樹脂の光学的造形方法
JP3347142B2 (ja) * 1990-04-23 2002-11-20 ミネソタ マイニング アンド マニュファクチャリング カンパニー 感圧接着剤組成物およびそれを光重合するための多重光開始方法
US5238744A (en) * 1990-08-16 1993-08-24 Minnesota Mining And Manufacturing Company Tough polymeric mixtures
US5102924A (en) * 1990-08-16 1992-04-07 Minnesota Mining And Manufacturing Company Polymeric mixtures and process therefor
CA2048232A1 (en) * 1990-09-05 1992-03-06 Jerry W. Williams Energy curable pressure-sensitive compositions
EP0487086B2 (en) * 1990-11-22 2008-08-13 Canon Kabushiki Kaisha Method of preparing volume type phase hologram member using a photosensitive recording medium
JP2849021B2 (ja) * 1993-04-12 1999-01-20 日本ペイント株式会社 体積ホログラム記録用感光性組成物
JPH0732696U (ja) * 1993-11-25 1995-06-16 防衛庁技術研究本部長 水中吸音材ユニット
IT1274039B (it) * 1994-09-02 1997-07-14 Atohaas C V Ora Atohaas Holdin Processo per la preparazione di articoli formati a base di polimeri acrilici rivestiti con un film antigraffio e antiabrasione
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures
CA2348398C (en) * 1999-09-22 2007-11-20 Surmodics, Inc. Water-soluble coating agents bearing initiator groups and coating process
JP4967656B2 (ja) * 2004-06-17 2012-07-04 株式会社スリーボンド 光カチオン重合性組成物及びそれを用いたオプトエレクトロニクス部品
CN100399138C (zh) * 2006-06-26 2008-07-02 友达光电股份有限公司 液晶面板及其制造方法
JP5163602B2 (ja) * 2009-07-06 2013-03-13 大日本印刷株式会社 高低パターン層形成体の製造方法
CN102844106B (zh) * 2010-02-13 2015-02-04 麦卡利斯特技术有限责任公司 具有再辐射表面的化学反应器以及相关的系统和方法
JP5607486B2 (ja) * 2010-10-08 2014-10-15 サーモディクス，インコーポレイティド 開始剤基を有する水溶性コーティング剤およびコーティング方法
CN102566285B (zh) * 2010-12-09 2014-05-28 远东新世纪股份有限公司 制造微结构的方法及该微结构
DE102011077612A1 (de) * 2011-06-16 2012-12-20 Evonik Röhm Gmbh Verfahren zur kontinuierlichen inline Herstellung von beschichteten polymeren Substraten oder Laminaten
JP5855899B2 (ja) 2011-10-27 2016-02-09 日立オートモティブシステムズ株式会社 Ｄｃ−ｄｃコンバータ及び電力変換装置
US11845885B2 (en) * 2015-12-30 2023-12-19 3M Innovative Properties Company Dual stage structural bonding adhesive
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
CN109467385B (zh) * 2018-01-15 2021-09-03 杭州创屹机电科技有限公司 一种抗菌环保3d打印陶瓷材料及其制备方法
CN109485436A (zh) * 2018-01-15 2019-03-19 杭州创屹机电科技有限公司 一种3d打印陶瓷材料两步光固化成型方法
CN109467387A (zh) * 2018-01-15 2019-03-15 杭州创屹机电科技有限公司 一种低孔隙率3d打印陶瓷制品及其制备方法
JP2019137721A (ja) * 2018-02-06 2019-08-22 スリーエム イノベイティブ プロパティズ カンパニー 樹脂組成物、隙間充填用接着剤、隙間充填用接着剤の製造方法及び隙間充填方法
CN114641145A (zh) * 2020-12-16 2022-06-17 深南电路股份有限公司 一种线路板及其线路板阻焊层的制作方法
CN114721229B (zh) * 2022-03-18 2023-07-28 浙江鑫柔科技有限公司 一种新型非对称性紫外曝光方法
CN117255495A (zh) * 2022-06-09 2023-12-19 庆鼎精密电子（淮安）有限公司 降低防焊层表面离子含量的方法、背光模组及其制造方法
CN116535636B (zh) 2023-05-17 2024-04-16 浙江皇马科技股份有限公司 一种低粘度密封胶用硅烷封端树脂及其制备方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH678897A5 (xx) * 1986-05-10 1991-11-15 Ciba Geigy Ag
GB8715435D0 (en) * 1987-07-01 1987-08-05 Ciba Geigy Ag Forming images

Also Published As

Publication number Publication date
JPH029480A (ja) 1990-01-12
MY103987A (en) 1993-10-30
AU607318B2 (en) 1991-02-28
PH26033A (en) 1992-01-29
FI891480A0 (fi) 1989-03-28
FI891480L (fi) 1989-09-30
IL89775A0 (en) 1989-09-28
NO891226L (no) 1989-10-02
DK149489D0 (da) 1989-03-28
EP0335629A2 (en) 1989-10-04
NO891226D0 (no) 1989-03-21
CN1037041A (zh) 1989-11-08
EP0335629A3 (en) 1991-10-09
MX169037B (es) 1993-06-17
FI891480A7 (fi) 1989-09-30
BR8901395A (pt) 1989-11-07
DK149489A (da) 1989-09-30
KR890014180A (ko) 1989-10-23
AU3174889A (en) 1989-10-05

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