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WO2022214040A1 - 耳机 - Google Patents

耳机 Download PDF

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Publication number
WO2022214040A1
WO2022214040A1 PCT/CN2022/085642 CN2022085642W WO2022214040A1 WO 2022214040 A1 WO2022214040 A1 WO 2022214040A1 CN 2022085642 W CN2022085642 W CN 2022085642W WO 2022214040 A1 WO2022214040 A1 WO 2022214040A1
Authority
WO
WIPO (PCT)
Prior art keywords
strain
earphone
pressure
area
strain structure
Prior art date
Application number
PCT/CN2022/085642
Other languages
English (en)
French (fr)
Inventor
李辰龙
姚超
Original Assignee
荣耀终端有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202110873176.8A external-priority patent/CN115209291A/zh
Application filed by 荣耀终端有限公司 filed Critical 荣耀终端有限公司
Priority to EP22784106.1A priority Critical patent/EP4203500A4/en
Priority to KR1020237017047A priority patent/KR20230091972A/ko
Priority to JP2023532617A priority patent/JP2023551846A/ja
Priority to US18/029,801 priority patent/US20230370761A1/en
Publication of WO2022214040A1 publication Critical patent/WO2022214040A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041—Mechanical or electronic switches, or control elements
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/96—Touch switches
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/965—Switches controlled by moving an element forming part of the switch
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1016—Earpieces of the intra-aural type
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1091—Details not provided for in groups H04R1/1008 - H04R1/1083
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K2217/00—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00
    • H03K2217/94—Indexing scheme related to electronic switching or gating, i.e. not by contact-making or -breaking covered by H03K17/00 characterised by the way in which the control signal is generated
    • H03K2217/965—Switches controlled by moving an element forming part of the switch
    • H03K2217/9651—Switches controlled by moving an element forming part of the switch the moving element acting on a force, e.g. pressure sensitive element
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2430/00—Signal processing covered by H04R, not provided for in its groups
    • H04R2430/01—Aspects of volume control, not necessarily automatic, in sound systems

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to an earphone.
  • the headset will be equipped with function buttons to trigger operations such as power-on, power-off, pause, playback, and recording.
  • function buttons to trigger operations such as power-on, power-off, pause, playback, and recording.
  • wireless earphones a solution currently adopted in the industry is to set a strain sensing module in a cavity formed by a casing of an earphone handle.
  • the strain sensing module needs to fit inside the shell of the earphone stem.
  • it is usually realized by adding a plane auxiliary positioning area on the shell of the earphone handle, or increasing the number of strain detection units of the strain sensing module, so that the space area occupied by the earphone handle shell is large, so that the The shape and space of the stem is limited.
  • the embodiments of the present application provide an earphone, which can solve the problem of large space occupied by a strain sensing module implementing function buttons in the earphone, so as to realize the function buttons of the earphone by pressing in multiple directions and reduce the overall size of the earphone.
  • An embodiment of the present application provides an earphone.
  • the headset includes a housing.
  • a pressure strain structure is also arranged in the cavity formed by the shell. Both ends of the pressure strain structure are in stable contact with the inner wall of the housing.
  • a strain sensor is arranged on the pressure strain structure. In the case of extruding the housing, the pressure strain structure produces strain, and the strain sensor is used to sense the strain produced by the pressure strain structure.
  • both ends of the pressure strain structure are in stable contact with the inner wall of the casing, so that the pressure strain structure can be strained when subjected to the pressing force of the casing.
  • the strain refers to the relative deformation of the compressive strain structure under the pressure of the casing.
  • the pressure strain structure is subjected to the bidirectional pressing force of the casing to generate linear strain.
  • the inner side of the pressure-strained structure ie, the concave surface of the pressure-strained structure
  • the outer side of the pressure-strained structure ie, the convex surface of the pressure-strained structure
  • the earphone can trigger the earphone to perform corresponding operations (such as power-on, power-off, pause, play, etc.) according to the strain generated by the pressure-strain structure.
  • the earphone provided by the embodiment of the present application does not need to attach the strain sensing module to the casing, does not need to set an auxiliary positioning and pressing area on the casing, and does not need to add a strain detection unit, and only needs to connect the two ends of the pressure strain structure to the outer casing.
  • the inner wall of the shell is in stable contact, so that the pressure strain structure adapts to the cavity space formed by the shell, so that the pressure strain structure can make full use of the cavity space formed by the shell, thereby reducing the space area occupied by the earphone shell and reducing the overall size of the earphone .
  • the strain sensor is arranged on the first side of the pressure strain structure (ie the outer side of the pressure strain structure) and/or the second side of the pressure strain structure (ie the inner side of the pressure strain structure).
  • the strain sensor arranged on the outer side of the pressure strain structure is used to sense the positive strain generated by the outer side of the pressure strain structure;
  • the strain sensor on the inner side of the strained structure is used to sense the negative strain generated on the inner side of the pressure-strained structure.
  • the pressure strain structure includes a bottom plate and side plates connected to both sides of the bottom plate. There is an included angle between the side plate and the bottom plate. The end of the side plate remote from the bottom plate is in stable contact with the inner wall of the housing.
  • the side plate and the bottom plate can be integrally formed, and can also be connected by welding or the like.
  • the strain sensor is arranged on the first surface of the bottom plate (ie the outer side of the bottom plate) and/or the second surface of the bottom plate (ie the inner side of the bottom plate). It should be understood that the strain generated by the above-mentioned pressure-strain structure is mainly reflected on the bottom plate of the pressure-strain structure, so the strain sensor is arranged on the bottom plate to improve the accuracy of strain sensing.
  • the strain sensor is used to sense the first strain generated by the pressure-strain structure when the contact parts between the casing and the two ends of the pressure-strain structure are squeezed.
  • a processor is provided in the cavity formed by the casing, and the strain sensor is electrically connected to the processor through a measurement circuit.
  • a measurement circuit is configured to output a first signal to the processor based on the first strain.
  • the first signal is used to instruct the earphone to perform the first operation.
  • the first operation includes one of power-on, power-off, pause, playback, and recording. In this way, the user can realize a function, such as one of power-on, power-off, pause, playback, and recording, by squeezing the contact parts between the shell and the two ends of the pressure strain structure.
  • the strain sensor when the non-contact part of the casing and the pressure-strain structure is squeezed, the strain sensor is used to sense the second strain generated by the pressure-strain structure.
  • a processor is provided in the cavity formed by the casing, and the strain sensor is electrically connected to the processor through a measurement circuit.
  • a measurement circuit is configured to output a second signal to the processor based on the second strain.
  • the second signal is used to instruct the earphone to perform the second operation.
  • the second operation includes one of power-on, power-off, pause, playback, and recording. In this way, the user can achieve another function, such as one of power-on, power-off, pause, playback, and recording, by squeezing the non-contact parts at both ends of the casing and the pressure-straining structure.
  • the strain generated by the pressure strain structure is different when different parts of the extrusion shell are extruded.
  • the inner side of the pressure strain structure generates negative strain
  • the outer side of the pressure strain structure generates positive strain (ie, the first strain).
  • positive strain is generated on the inner side of the pressure strain structure
  • negative strain ie, the second strain
  • the cavity formed by the housing may further include a printed circuit board.
  • the processor is provided on the printed circuit board.
  • the strain sensor is electrically connected to the printed circuit board through the flexible board so that the strain sensor is electrically connected to the processor.
  • the housing includes an earphone head casing and an earphone handle casing.
  • the pressure strain structure is arranged in the cavity formed by the earphone handle shell, and both ends of the pressure strain structure are in stable contact with the inner wall of the earphone handle case. In this way, the user's operation can be facilitated.
  • a plane positioning area is provided on the outer surface of the earphone handle housing near the contact portion between the earphone handle housing and the pressure strain structure. In this way, the user can quickly find the squeezed position of the function key.
  • the housing includes an earphone head housing.
  • the pressure strain structure is arranged in the cavity formed by the earphone head shell, and both ends of the pressure strain structure are in stable contact with the inner wall of the headphone head shell. In this way, the volume is smaller and more convenient for users to carry.
  • a capacitance-assisted detection scheme can be added to the pressure-strain structure, and the force and direction of the extrusion can be assisted in determining the strength and direction of extrusion through changes in capacitance at different locations in the pressure-strain structure during the extrusion process.
  • the first surface of the pressure-strained structure (eg, the outer side of the pressure-strained structure) includes a first region (eg, C region) and a second region (eg, D region).
  • the first area and the second area are respectively close to the contact parts of the two ends of the pressure strain structure and the housing.
  • the first area is attached with a first capacitance detection contact piece (such as a copper skin network), and the first capacitance detection contact piece can be electrically connected to the processor through a flexible board.
  • a second capacitance detection contact piece (eg, a copper network) is attached to the second area, and the second capacitance detection contact piece can be electrically connected to the processor through a flexible board.
  • the first capacitance detection contact piece is used for detecting the capacitance generated in the first area
  • the second capacitance detection contact piece is used for detecting the capacitance generated in the second area.
  • the capacitances of the C-regions and D-regions of the pressure-strained structure are significantly changed due to the fingers approaching and touching the housing.
  • the capacitance of the C area and the D area does not change significantly. In this way, the force and direction of the extrusion can be assisted by the change of the capacitance of the C area and the D area of the pressure strain structure.
  • the first surface (eg, the outer surface) of the pressure strain structure further includes a third region.
  • a third region (eg, region B) is located between the first region and the second region.
  • the third area is attached with a third capacitance detection contact piece (eg, a copper network).
  • the third capacitance detection contact piece may be electrically connected to the processor through the flexible board.
  • the third capacitance detection contact piece is used to detect the capacitance generated by the third area.
  • the capacitance of the C area and the D area of the pressure strain structure changes obviously due to the fingers approaching and touching the casing, and the capacitance of the B area changes. smaller.
  • a position opposite to the third area is a fourth area (eg, area A);
  • Four capacitance detection contact pieces such as copper skin network); the fourth capacitance detection contact piece can be electrically connected with the processor through the soft board; when the casing is squeezed, the fourth capacitance detection contact piece is used to detect the capacitance generated in the fourth area .
  • the amount of change in the A area is also smaller due to the fingers approaching and touching the casing; when the user squeezes the non-contact area between the casing and the pressure strain structure, The amount of variation in the A area may also be larger.
  • the C area and the D area can also be combined to assist in judging the strength and direction of the extrusion, so as to improve the accuracy of the auxiliary judgment.
  • capacitance detection can assist in judging the direction of extrusion (that is, the direction of stress generation), so that according to the difference in stress direction and capacitance change caused by different extrusion directions, the headphone shell can be adjusted in different directions.
  • the way of squeezing is configured as different button functions to realize the expansion of button functions and improve user experience.
  • the above-mentioned pressure-strain structure can also be used for slip detection.
  • the first capacitance detection contact piece is also used to detect the capacitance generated in the first area (eg, the C area).
  • the second capacitance detection contact piece is also used to detect the capacitance generated in the second area (eg, the D area).
  • the third capacitance detection contact piece is also used to detect the capacitance generated in the third region (eg, the B region).
  • the finger when the user's finger slides in a direction passing through the C area, the B area, and the D area in sequence, the finger first approaches the C area, then the B area, and finally the D area.
  • the change time of the capacitance in the C region, the B region, and the D region is different.
  • the capacitance change characteristics of the B area, the C area and the D area, and combined with the strain sensor in the pressure strain structure it can be set when the surface of the earphone shell slides to realize some kind of earphone. functions (such as volume adjustment).
  • FIG. 1A is a schematic structural diagram of a wireless headset in the prior art
  • FIG. 1B is a schematic structural diagram of a strain sensing module in an earphone in the prior art
  • FIG. 2 is a schematic structural diagram of a wireless headset according to an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an earphone body according to an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram 1 of a setting position of a strain sensor according to an embodiment of the present application.
  • FIG. 5 is a second structural schematic diagram of a setting position of a strain sensor according to an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a squeeze scene provided by an embodiment of the present application.
  • FIG. 7 is a schematic structural diagram of a pressure strain structure provided by an embodiment of the present application.
  • FIG. 8A is a schematic structural diagram of another earphone body provided by an embodiment of the present application.
  • FIG. 8B is a schematic structural diagram of another earphone body provided by an embodiment of the present application.
  • FIG. 9 is a schematic structural diagram of a pressure strain structure provided in an embodiment of the application provided in an earphone handle;
  • FIG. 10 is a schematic structural diagram of setting a capacitance sensing region on a pressure-strain structure according to an embodiment of the present application.
  • FIG. 11 is a schematic structural diagram of a squeeze scene provided by an embodiment of the present application.
  • FIG. 12 is a schematic structural diagram of another extrusion scene provided by an embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a sliding scene provided by an embodiment of the present application.
  • connection should be understood in a broad sense.
  • connection may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary.
  • connection may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary.
  • the terms “coupled” or “coupled” may be the manner in which electrical connections are effected for signal transmission.
  • connection may be a fixed connection, a detachable connection, or an integrated body; it may be directly connected, or Can be indirectly connected through an intermediary.
  • coupled or “coupled” may be the manner in which electrical connections are effected for signal transmission.
  • Headphones can be used in conjunction with electronic devices such as mobile phones, notebook computers, and watches to process audio services such as media and calls of electronic devices, as well as other data services.
  • the audio service may include media services such as playing music, recordings, sounds in video files, background music in games, and incoming call prompts for users; , voice assistant and other call business scenarios, play the peer's voice data for the user, or collect the user's voice data and send it to the peer.
  • the headset will be equipped with function buttons.
  • the function buttons on the headset connection line can be used to pause or resume playing music, and can also be used to answer and hang up calls.
  • the function buttons on the wireless earphones can be used to control the power on of the wireless earphones, in addition to being used to pause or resume playback when playing music, and to answer and hang up calls. or shut down.
  • the above wireless earphones may be true wireless stereo earphones (true wireless stereo, TWS).
  • TWS headsets are usually implemented based on Bluetooth chips. When the TWS headset is in use, the electronic device is connected to the main headset, and then the main headset is quickly connected to the secondary headset wirelessly, so as to achieve true wireless separation of the left and right channels of Bluetooth.
  • the TWS earphone 100 includes an earphone head 101 (also referred to as an earplug), and an earphone stem 102 connected with the earphone head 101 .
  • the cavity formed by the shell of the earphone head 101 is provided with an audio module, which can be used to manage audio data and realize the input and output of audio signals through the earphone, so that the user can make calls and play music through the wireless earphone.
  • a strain sensing module 104 is disposed in the cavity formed by the casing of the earphone handle 102 .
  • the above-mentioned strain sensing module 104 usually adopts a resistance bridge pressure detection method that directly contacts and squeezes to generate strain to realize strain sensing. Therefore, the strain sensing module 104 needs to be disposed in close contact with the casing of the earphone handle 102 .
  • the strain sensing module 104 In order to make the strain sensing module 104 fit the casing, so that the strain sensing module 104 can accurately sense when the user presses the casing of the earphone handle 102 , there are generally two processing methods as follows:
  • a plane pressing area 103 is provided outside the shell of the earphone handle 102 , which is used for the auxiliary positioning of the user when pressing the strain sensing module 104 .
  • the housing of the earphone stem 102 needs to be designed with a flat area, so that the shape of the earphone stem 102 is limited.
  • the strain sensing module 104 includes a connector 1041 coupled to the processor, and at least two sets of strain detection units 1042 (two sets are shown in the figure, three sets or even more can be provided) to increase the strain sensing area.
  • the length of the strain sensing module 104 will increase, which will not only increase the manufacturing cost of the strain sensing module 104, but also increase the strain sensing module 104 in the earphone handle 102.
  • the inner space in the cavity formed by the shell makes the shell of the earphone handle longer, so that the shell of the earphone occupies a large space.
  • the implementation of the function keys of the headset in the prior art may cause the shell of the headset to have a plane auxiliary positioning area, or the shell of the headset occupies a large space area, so that the shape and size of the shell of the headset are affected. limit.
  • the function keys of the earphones are realized by the resistance bridge pressing detection method that directly contacts the pinching pressure to generate strain, so that the strain sensing module 104 senses the pressing action, and the pressing force mainly depends on the shell of the earphone handle 102 . It is transmitted to the part that is attached to the strain sensing module 104 , so the strain sensing module 104 can only sense a single pressing action, and the functions of the case that can be realized are too single.
  • the housing of the earphone in the prior art occupies a large area, the earphone may be unfavorable for the user to carry or wear.
  • the function keys of the earphones in the prior art can only be sensed by a single pressing action, and the user must press a specific position of the earphone to be able to sense, which makes the user's operation inconvenient and the user experience is poor.
  • an embodiment of the present application provides an earphone.
  • the earphone can realize the corresponding functions of the function keys by means of multi-directional pressing, which can reduce the space occupied by the earphone handle shell, thereby reducing the overall size of the earphone.
  • the earphone provided by the embodiment of the present application is described in detail below by taking a wireless earphone as an example.
  • the multi-directional pressing means that the user can squeeze the casing of the earphone in two opposite directions, for example, the user uses two fingers to squeeze the casing of the earphone.
  • the multi-directional pressing may also mean that the user squeezes different positions of the earphone housing along different directions, for example, the user uses two fingers to squeeze any position of the earphone.
  • FIG. 2 shows a schematic structural diagram of a wireless headset 200 provided by an embodiment of the present application.
  • the wireless headset 200 may include at least one processor 201, at least one memory 202, a wireless communication module 203, an audio module 204, a power module 205, an input/output interface 206, and the like.
  • the processor 201 may include one or more interfaces for connecting with other components of the wireless headset 200 .
  • the memory 202 can be used to store program codes, such as program codes for charging the wireless headset 200, wireless pairing and connection between the wireless headset 200 and other electronic devices, or wireless communication between the wireless headset 200 and the electronic device, etc.; It can be used to record the user's posture and user habits (such as the pressing force on the function keys of the earphone) to realize the key-triggered operations such as power-on, power-off, pause, playback, recording, start charging, and stop charging.
  • program codes such as program codes for charging the wireless headset 200, wireless pairing and connection between the wireless headset 200 and other electronic devices, or wireless communication between the wireless headset 200 and the electronic device, etc.
  • It can be used to record the user's posture and user habits (such as the pressing force on the function keys of the earphone) to realize the key-triggered operations such as power-on, power-off, pause, playback, recording, start charging, and stop charging.
  • the processor 201 may be configured to execute the above-mentioned application code, and call relevant modules to implement the functions of the wireless headset 200 in the embodiment of the present application. For example, the charging function of the wireless earphone 200, the wireless communication function, the audio data playback function, and the like are realized.
  • the processor 201 may include one or more processing units, and different processing units may be independent devices or may be integrated into one or more processors 201 .
  • the processor 201 may specifically be an integrated control chip, or may be composed of a circuit including various active and/or passive components, and the circuit is configured to perform the functions belonging to the processor 201 described in the embodiments of this application.
  • the wireless communication module 203 can be used to support the connection between the wireless earphone 200 and other electronic devices or earphone boxes, including Bluetooth (bluetooth, BT), global navigation satellite system (GNSS), wireless local area networks (wireless local area networks, WLAN) (such as wireless fidelity (Wi-Fi) network), frequency modulation (FM), near field communication (NFC), infrared technology (infrared, IR) and other wireless communication data exchange.
  • the wireless communication module 203 may be a Bluetooth chip.
  • the wireless headset 200 can be paired with the Bluetooth chips of other electronic devices through the Bluetooth chip and establish a wireless connection, so as to realize wireless communication between the wireless headset 200 and other electronic devices through the wireless connection.
  • the wireless communication module 203 may further include an antenna.
  • the wireless communication module 203 receives electromagnetic waves via the antenna, frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 201 .
  • the wireless communication module 203 can also receive the signal to be sent from the processor 201, perform frequency modulation on it, amplify it, and then convert it into an electromagnetic wave for radiation through the antenna.
  • the audio module 204 can be used to process audio data, and realize the input and output of audio signals from the wireless earphone 200 .
  • the audio module 204 can acquire audio signals from the wireless communication module 203, or transmit audio signals to the wireless communication module 203, so as to make calls, play music, enable/disable the voice assistant of the electronic device connected to the headset, receive /Send the user's voice data and other functions.
  • the audio module 204 may include a speaker (or earpiece, receiver) component for outputting audio signals, a microphone (or a microphone, a microphone), a microphone pickup circuit matched with the microphone, and the like. Speakers can be used to convert audio electrical signals into sound signals and play them back. Microphones can be used to convert sound signals into audio electrical signals. It should be understood that the above-mentioned audio module 204 may also be separately provided outside the processor 201 or integrated inside the processor 201 for implementation.
  • the power supply module 205 can supply power for each module of the wireless earphone 200; support the wireless earphone 200 to receive charging input and the like.
  • the power module 205 may include a power management unit (PMU) and a battery.
  • the power management unit may include a charging circuit, a voltage drop regulating circuit, a protection circuit, a power measuring circuit, and the like.
  • the charging circuit can receive external charging input.
  • the voltage drop adjustment circuit can transform the electrical signal input by the charging circuit and output it to the battery to complete charging the battery. Protection circuits can be used to prevent battery overcharge, overdischarge, short circuit or overcurrent.
  • the power module 205 may further include a wireless charging coil for wirelessly charging the wireless earphone 200 .
  • the power management unit can also be used to monitor battery capacity, battery cycle times, battery health status (leakage, impedance) and other parameters.
  • a plurality of input/output interfaces 206 may be used to provide a wired connection between the wireless earphone 200 and the earphone box for charging or communication.
  • the input/output interface 206 may include a headphone electrical connector for conducting and transmitting electrical current.
  • the wireless earphone 200 can establish an electrical connection with the electrical connector in the earphone box through the earphone electrical connector (eg, the earphone electrical connector is in direct contact with the electrical connector in the earphone box).
  • the earphone box can charge the battery in the wireless earphone 200 through the electrical current transfer function of the earphone electrical connector and the electrical connector in the earphone box.
  • the headphone electrical connector may be a pogo pin, a pogo pin, a shrapnel, a conductive block, a conductive patch, a conductive sheet, a pin, a plug, a contact pad, a jack or a socket, etc.
  • the specific type is not limited.
  • the wireless earphone 200 may include a pair of earphone bodies for use with the user's left and right ears, and each earphone body may include two earphone electrical connectors.
  • the earphone body When the earphone body is placed in the earphone box, the earphone body can establish an electrical connection with the two correspondingly arranged electrical connectors in the earphone box through the two earphone electrical connectors. After the electrical connection is established, the earphone box can charge the battery in the earphone body.
  • the wireless earphone 200 can also perform data communication with the earphone box, for example, can receive a pairing instruction from the earphone box.
  • the wireless headset 200 may also include a sensor 207 .
  • the sensor 207 may be a distance sensor or a proximity light sensor and may be used to determine whether the wireless headset 200 is being worn by the user.
  • the wireless earphone 200 may use a distance sensor to detect whether there is an object near the wireless earphone 200, so as to determine whether the wireless earphone 200 is worn by the user. When it is determined that the wireless earphone 200 is worn, the wireless earphone 200 may turn on the speaker.
  • the wireless earphone 200 may further include a bone conduction sensor in combination with a bone conduction earphone. Using the bone conduction sensor, the wireless earphone 200 can acquire the vibration signal of the vibrating bone mass of the voice part, analyze the voice signal, and realize the voice function.
  • the outer surface of the wireless headset 200 may further include: a touch sensor for detecting a user's touch operation; a fingerprint sensor for detecting a user's fingerprint and identifying a user's identity; and some other sensors, such as a capacitive sensor, for detecting Changes in capacitance, adaptively adjust some parameters (such as volume).
  • a touch sensor for detecting a user's touch operation
  • a fingerprint sensor for detecting a user's fingerprint and identifying a user's identity
  • some other sensors such as a capacitive sensor, for detecting Changes in capacitance, adaptively adjust some parameters (such as volume).
  • the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the wireless earphone 200 . It may have more or fewer components than shown in Figure 2, may combine two or more components, or may have a different configuration of components.
  • the outer surface of the wireless earphone 200 may further include buttons 208, indicator lights (which can indicate the status of power, incoming/outgoing calls, pairing mode, etc.), a display screen (which can prompt the user for relevant information), and a dust filter (which can be matched with the earpiece). use) and other components.
  • the key 208 may be a physical key or a touch key (used in conjunction with a touch sensor), etc., for triggering operations such as power-on, power-off, pause, play, record, start charging, and stop charging.
  • the earphone provided by the embodiment of the present application includes an earphone body.
  • FIG. 3 a schematic structural diagram of an earphone body 300 provided in an embodiment of the present application.
  • the earphone body 300 includes a casing 301 and internal components.
  • the internal components are disposed within the cavity formed by the housing 301 .
  • the internal components may include components in modules such as the processor 201 , the wireless communication module 203 , the audio module 204 , and the power module 205 in the wireless headset shown in FIG. 2 .
  • the cavity formed by the casing 301 is also provided with a pressure strain structure 302 , and the two ends of the pressure strain structure 302 (the first end 3021 and the second end 3022 as shown in (a) in FIG. 3 ) are connected to the inner wall of the casing 301
  • the stable contact may be, for example, a spring contact method or a welding contact method, which is not particularly limited in the embodiment of the present application.
  • the strain refers to the relative deformation of the pressure-strain structure 302 under the condition of being subjected to the pressing force of the casing 301 .
  • the pressure The strain structure 302 is subjected to the bidirectional extrusion force of the casing 301 to generate linear strain, the inner side 3023 of the pressure strain structure 302 forms compressive deformation, and generates negative strain; the outer side 3024 of the pressure strain structure 302 forms tensile deformation, and generates positive strain .
  • the pressure-strain structure 302 is provided with a strain sensor 303 .
  • the strain sensor 303 can be electrically connected to the processor of the earphone, and is used for sending the strain generated by the pressure strain structure 302 to the processor, so that the processor can trigger the earphone to perform power-on and shutdown according to the strain generated by the pressure-strain structure 302 , pause, play, record and other operations.
  • the strain sensor 303 is used to sense the strain generated by the pressure-strain structure 302, so that the processor performs a corresponding functional operation (such as pause or play) according to the strain sensed by the strain sensor 303.
  • the above-mentioned strain sensor 303 can be a resistance strain gauge, and the resistance strain gauge can convert the change of the strain on the mechanical component into the change of the resistance.
  • Resistance strain gauges include sensitive grid resistance elements and leads.
  • the sensitive grid resistance element can be made of a high resistivity filament with a diameter of 0.01 mm to 0.05 mm bent into a grid shape, as a sensitive part of the resistance strain gauge sensing mechanical member.
  • the lead wire can be made of metal wire such as copper wire, and the lead wire is electrically connected with the sensitive grid resistance element for connecting the sensitive grid resistance element with the measurement circuit.
  • the resistance strain gauge needs to be pasted on the surface of the pressure strain structure 302 through an adhesive.
  • the pressure strain structure 302 is subjected to the pressing force of the casing 301 .
  • the pressure strain structure 302 is strained.
  • the sensitive grid resistance element in the resistance strain gauge also generates strain, so that the resistance value of the sensitive grid resistance element changes. By measuring the change in the resistance of the resistance strain gauge by the measuring circuit, it can be known whether the pressure strain structure 302 is squeezed.
  • strain sensor 303 is attached to the surface of the pressure-strain structure 302, and the strain sensor 303 can be coupled and connected to the processor through a flexible board, that is, a flexible printed circuit (FPC).
  • FPC flexible printed circuit
  • a measurement circuit for measuring a change in the resistance value of the strain sensor 303 may be provided on the FPC.
  • the strain sensing module (ie the pressure strain structure 302 and the strain sensor 303 as shown in FIG. 3 ) does not need to be attached to the casing, and does not need to be installed on the casing 301 of the earphone body 300 .
  • Setting the auxiliary positioning pressing area does not require adding multiple sets of strain detection units, and only needs to stably contact the two ends of the pressure strain structure 302 with the inner wall of the housing 301 .
  • the pressure strain structure 302 can be strained, and the strain generated by the pressure strain structure 302 can be sensed by the strain sensor 303, so as to realize the corresponding function of the function button of the earphone (such as pause or play).
  • the pressure strain structure 302 is arranged, and the pressure strain structure 302 can be set to fit the cavity space formed by the shell 301 , so that the cavity formed by the shell 301 can be fully utilized. space, thereby reducing the space area occupied by the earphone shell, so as to reduce the overall size of the earphone.
  • the above-mentioned strain sensor 303 may be disposed on the inner side surface 3023 of the pressure strain structure 302 , as shown in FIG. 4 .
  • the above-mentioned strain sensor 303 may also be disposed on the outer side surface 3024 of the pressure strain structure 302, as shown in (a) of FIG. 5 .
  • the above-mentioned strain sensor 303 can also be arranged on both the inner side surface 3023 and the outer side surface 3024 of the above-mentioned pressure strain structure 302, as shown in (b) of FIG. on the strain sensor 303).
  • the strain sensor 303 detects the strain generated by the pressure-strain structure 302 by means of differential detection. That is to say, the strain generated by the pressure-strain structure 302 received by the processor is: the strain value sensed by the strain sensor 303 on the inner side 3023 of the pressure-strain structure 302 and the strain value sensed by the strain sensor 303 on the outer side 3024 Difference between strain values. In this way, the detection accuracy can be improved.
  • the pressure strain structure 302 is subjected to the pressing force of the housing 301 to generate strain.
  • the strain sensor 303 mounted on the inner side surface 3023 of the pressure strain structure 302 can be used to sense the negative strain generated by the inner side surface 3024 of the pressure strain structure 302 .
  • the strain sensor 303 mounted on the outer side surface 3024 of the pressure strain structure 302 can be used to sense the normal strain generated by the outer side surface 3024 of the pressure strain structure 302 .
  • the above-mentioned measurement circuit can sense the negative strain according to the strain sensor 303 mounted on the inner side 3023 of the pressure strain structure 302 or the strain sensor 303 mounted on the outer side 3024 of the pressure strain structure 302
  • an instruction signal ie, a first signal
  • the processor to instruct the earphone to perform operations such as turning on, turning off, pausing, playing, and recording.
  • the indication signal is generally a voltage signal.
  • the pressure strain structure 302 can also generate linear strain under the extrusion force of the casing 301 .
  • the inner side 3023 of the pressure-strain structure 302 forms tensile deformation to generate positive strain
  • the outer side 3024 of the pressure-strain structure 302 forms compressive deformation to generate negative strain.
  • the strain sensor 303 mounted on the inner side surface 3023 of the pressure-strain structure 302 can be used to sense the positive strain generated by the inner side surface 3024 of the pressure-strain structure 302 .
  • the strain sensor 303 mounted on the outer side surface 3024 of the pressure-strain structure 302 can be used to sense the negative strain generated by the outer side surface 3024 of the pressure-strain structure 302 .
  • the above-mentioned measurement circuit can sense the positive strain sensed by the strain sensor 303 mounted on the inner side surface 3023 of the pressure strain structure 302 , or sense the strain sensor 303 mounted on the outer side surface 3024 of the pressure strain structure 302 .
  • an indication signal (ie, a second signal) is output to the processor to instruct the earphone to perform operations such as turning on, turning off, pausing, playing, and recording.
  • the indication signal is generally a voltage signal.
  • the pressure strain structure 302 can be strained by squeezing the casing 301 without aligning the contact part between the casing 301 and the pressure strain structure 302, and the non-contact part of the casing 301 and the pressure strain structure 302 can also be squeezed to make the pressure strain structure 302 produces strain, that is, the user can use two fingers to pinch any position of the earphone (ie, multi-directional pressing), so that the way to realize the function keys of the earphone is more flexible, such as pressing the contact between the shell 301 and the pressure strain structure 302
  • One of the functional buttons of the earphone such as pausing or playing music, can be realized by pressing the non-contact part of the casing 301 and the pressure strain structure 302 to realize another functional button of the earphone, such as turning on or off.
  • the indication signal (such as the first signal or the second signal) output by the above-mentioned strain sensor 303 to the processor through the measuring circuit is related to the force with which the user squeezes the casing, and the first signal or the second signal can instruct the earphone to perform
  • the operation of the headset can be different, and the headset can be set according to the user's usage habits. Therefore, the embodiment of the present application does not specifically limit the function corresponding to the position where the user presses the casing.
  • FIG. 7 it is a schematic structural diagram of a pressure strain structure 302 in an earphone provided by an embodiment of the present application.
  • the pressure strain structure 302 includes a bottom plate 701 and side plates 702 connected to two sides of the bottom plate 701 . An angle is formed between the side plate 702 and the bottom plate 701 to form a groove structure.
  • the side plate 702 and the bottom plate 701 may be integrally formed, or may be connected by welding or the like.
  • the pressure strain structure 302 When the non-contact area between the casing 301 and the pressure strain structure 302 is squeezed (ie, the direction of the arrow shown in FIG. 6 ), the pressure strain structure 302 is also stretched as a whole, and the side plates 702 on both sides of the pressure strain structure 302 are squeezed by the casing 301 The pressures move away from each other, thereby driving the inner side surface 7011 of the bottom plate 701 to produce tensile deformation to generate positive strain, and driving the outer side surface 7012 of the bottom plate 701 to generate compressive deformation to generate negative strain.
  • the strain direction generated by the pressure strain structure 302 is related to the part where the user squeezes the casing 301 .
  • the user squeezes the contact part or non-contact part between the shell 301 of the earphone body and the pressure strain structure 302 to generate different strain directions, so that the earphone body 300 can set different functions of the function keys according to the different extrusion directions.
  • the pressure-strain structure 302 is not limited to the groove-like structure shown in FIG. 7 , but can also be any other shape with two ends, such as an irregular groove structure, an arc groove structure, and the like.
  • the material of the pressure-strain structure 302 may be SUS301 stainless steel, or other high-strength elastic materials, which are not specifically limited in the embodiment of the present application.
  • the strain sensor 303 is disposed on the base plate 701 to improve the accuracy of strain sensing.
  • the strain sensor 303 can be arranged on the inner side surface 7011 of the bottom plate 701 , can also be arranged on the outer side surface 7012 of the bottom plate 701 , or the strain sensor 303 can be arranged on both the inner side surface 7011 and the outer side surface 7012 of the bottom plate 701 .
  • the embodiments of the present application do not make special limitations.
  • FIG. 8A shows a schematic structural diagram of an earphone body 800 .
  • the earphone body 800 may include an earphone handle 801 and an earphone head 802 connected to the top of the earphone handle 801 .
  • the interior of the cavity formed by the earphone handle 801 and the earphone head 802 may include internal components such as a circuit board 804 .
  • the circuit boards 804 may be printed circuit boards (PCBs).
  • the circuit board 804 may include various components such as a processor, a memory, and a charging circuit, so as to realize various functions such as the wireless communication module 203 , the audio module 204 , and the power module 205 shown in FIG. 2 .
  • the power module 205 may be disposed inside the cavity formed in the earphone stem 801 .
  • the speaker assembly in the audio module 204 may be disposed inside the cavity formed by the earphone head 802 .
  • a sound signal can be heard from the speaker component formed inside the cavity of the earphone head 802, so as to realize functions such as playing music, answering/calling and the like for the user.
  • the pressure strain structure 803 is disposed inside the cavity formed by the earphone handle 801 .
  • the earphone handle 801 is generally used by the user to wear the earphone body 800 into the user's ear hole.
  • the earphone handle 801 is generally designed as a smooth cylindrical rod structure.
  • the pressure strain structure 803 ie the pressure strain structure 302 as shown in FIG. 7
  • the pressure strain structure 803 can be arranged in the cavity formed by the earphone handle 801 . tail of the body.
  • the power module 205 of the earphone as shown in FIG. 2 is disposed in the cavity formed by the earphone handle 801 at a position close to the tail of the earphone handle 801 .
  • the power module 205 can be coupled and connected to the earphone electrical connector for charging the earphone provided at the end of the earphone handle 205, so that when the wireless earphone is placed in the earphone box, the wireless earphone can be connected to the earphone box through the earphone electrical connector.
  • the electrical connector in the device establishes an electrical connection to charge the wireless headset.
  • the pressure strain structure 803 can be disposed in the cavity formed by the earphone stem 801 and disposed close to the power module 205 .
  • the shape of the earphone handle 801 is not limited to a cylindrical shape, and may also be other shapes, such as a long bar, a hexagonal prism, etc.
  • the embodiment of the present application does not specifically limit the shape of the earphone handle 801 .
  • the strain sensor arranged on the pressure strain structure 803 can be coupled and connected to the above-mentioned circuit board 804 through a flexible board, that is, FPC, so that the strain sensor can be connected with the processor Coupling connection.
  • the earphone 800 provided by the embodiment of the present application may not have the earphone handle 801, for example, the earphone shown in FIG. 8B (components such as a processor are not shown in the figure). That is to say, the pressure strain structure 803 and the processor of the earphone are all arranged in the earphone head 802 of the earphone, and the function keys of the earphone can also be realized by the above-mentioned multi-directional pressing method of the pressure strain structure in the earphone. For details, please refer to The descriptions of the above embodiments are not repeated here.
  • the pressure strain structure 803 is provided with positioning holes 8031 , and the pressure strain structure 803 can be fixed on the circuit board 804 through the positioning holes 8031 on the pressure strain structure 803 .
  • the pressure-strain structure 803 can be fixed on the circuit board 804 by means of connection and fixing such as welding, heat fusion, or screws.
  • the casing of the earphone handle 801 is a smooth cylindrical rod structure, and the interior of the casing of the earphone handle 801 is also a circular arc surface.
  • the two side plates 8031 in the pressure strain structure 803 can be disposed toward both sides of the casing of the earphone handle 801 , and the ends 8032 of the side plates 8031 are in stable contact with the inner wall of the casing of the earphone handle 801 .
  • the outer diameter of the earphone handle 801 is subjected to local plane processing at the contact area between the shell of the earphone handle 801 and the end 8032 of the side plate 8031 of the pressure strain structure 803. , a plane positioning area 8011 is formed, as shown in (b) of FIG. 9 .
  • the user squeezes the shell of the earphone handle 801 to use the function keys he only needs to find the plane positioning area 8011 and squeeze, thereby increasing the sense of positioning and improving the user experience.
  • the addition of the plane positioning area 8011 can enable the user to accurately pinpoint the position of the function button for pressing, so that when the user presses the pressure-strain structure 803 in both directions, the detection accuracy of the strain sensor in the pressure-strain structure 803 can be improved. And detection stability, improve the overall performance of the headset.
  • the contact area between the pressure strain structure 803 in the earphone body 800 and the shell of the earphone handle 801 is located on both sides of the earphone body 800 (taking FIG. 8A as an example, the earphone body
  • the two sides of 800 refer to the front and rear sides of the housing of the earphone stem 801 shown in FIG. 8A ).
  • the function keys of the earphone are used in a squeezing manner, and the problem of accidental touch may occur during the user's use.
  • a capacitance-assisted detection scheme can be added to the pressure-strain structure 803 shown in FIG. 8A .
  • the change in volume assists in judging the strength and direction of the extrusion.
  • the pressure strain structure 803 can be divided into four regions, namely A region 1001 , B region 1002 , C region 1003 and D region 1004 .
  • the inner side 7011 of the bottom plate 701 is the area A 1001
  • the outer side 7012 of the bottom plate 701 is the area B 1002
  • the backs of the two side plates 702 are the area C 1003 and the area D 1004 respectively.
  • a copper skin network is respectively provided on the A region 1001 , B region 1002 , C region 1003 and D region 1004 of the pressure strain structure 302 , and the copper skin network is coupled and connected to the capacitive sensing channel through a flexible board (eg, FPC).
  • a flexible board eg, FPC
  • the pressure strain structure 302 is also coupled and connected to the capacitive sensing channel through a flexible board (eg, FPC), and serves as a reference terminal during capacitive detection.
  • a flexible board eg, FPC
  • the above-mentioned capacitive sensing channel can be provided on the circuit board 804 as shown in FIG. 8A , and is coupled and connected with the processor on the circuit board 804 .
  • the user can squeeze the outer casing of the earphone in the direction of the arrow shown in (a) in FIG. In the direction of the arrow shown, squeeze the contact area between the shell of the earphone stem 801 and the pressure strain structure 302 .
  • the capacitance of the area on the side plate 702 in the pressure strain structure 203 ie, the C area 1003 and the D area 1004 shown in FIG. 10
  • the capacitance change of the area on the bottom plate 701 of the pressure-strain structure 203 ie the area A 1001 and the area B 1002 shown in FIG. 10
  • the area on the opposite side plate 702 ie the area C 1003 and D area 1004) is less.
  • the above four regions ie, the A region 1001, the B region 1002, the C region 1003, and the D region 1004 have obvious differences.
  • the capacitance of the C area 1003 changes significantly, and the capacitance change amount larger; the capacitance variation of the D region 1014 is smaller, and the capacitance variation of the A region and the B region is also smaller.
  • the processor in the earphone can assist in judging the strength and direction of the squeeze by analyzing the capacitance changes of the A area 1001, the B area 1002, the C area 1003 and the D area 1004 as shown in Figure 10.
  • the strain sensor 303 in the pressure-strain structure 302 it can be determined whether the user actively squeezes the earphone shell (such as the shell of the earphone handle 801) in order to achieve the purpose of pause or play, thereby improving stress detection. accuracy.
  • the above four capacitance detection areas can be flexibly configured according to actual conditions.
  • only the B area 1002 , the C area 1003 and the D area 1004 may be provided, or only the B area 1002 and the C area 1003 or the B area 1002 and the D area 1004 may be provided.
  • the user can also squeeze the shell of the earphone in the direction of the arrow shown in (a) in FIG. 12 , that is, in the direction of the arrow shown in (b) in FIG. 12 , squeeze the non-contact between the shell and the pressure strain structure area.
  • the casing of the earphone ie, the casing of the earphone handle 801
  • the inner area of the casing of the earphone handle 801 is in contact with the human skin (such as the skin of the auricle or the cheek).
  • the outer area of the housing of the earphone handle 801 is in contact with the user's finger.
  • the area A 1001 and the area B 1002 shown in FIG. 10 in the pressure strain structure 302 are closer to the human body contact area, the capacitance changes of the A area 1001 and the B area 1002 are more obvious, and the capacitance change is larger; the C area 1003 and D regions 1004 are farther from the human body contact region, so the capacitance changes of C regions 1003 and D regions 1004 are small.
  • capacitance detection can assist in judging the direction of extrusion (that is, the direction of stress generation), so that according to the difference in stress direction and capacitance change caused by different extrusion directions, the headphone shell can be adjusted in different directions.
  • the way of squeezing is configured as different button functions to realize the expansion of button functions and improve user experience.
  • the pressure strain structure 302 remains in the initial position.
  • a region 1001, B region 1002, C region 1003, and D region 1004 shown in FIG. 10 maintain the initial capacitance state.
  • the pressure-strain structure 302 described above can also be used for slip detection.
  • the user can gently slide along the tube wall of the housing of the earphone handle 801 , in the direction of the arrow shown in (a) of FIG. 13 .
  • the shell of the earphone handle 801 has no obvious pressing force, and the strain generated by the pressure strain structure 302 is not obvious.
  • the user's finger slides along the outer wall of the housing of the earphone stem 801 in the direction of the arrow as shown in (b) of FIG. 13 .
  • the finger skin gradually approaches the C region 1003 in the pressure strain structure 302 as shown in FIG. 10 , and then gradually moves away from the C region 1003 .
  • the finger skin gradually approaches the B area 1002 of the pressure strain structure 302 , and then gradually moves away from the B area 1002 .
  • the finger skin gradually approaches the D area 1004 of the pressure strain structure 302 , and then gradually moves away from the D area 1004 .
  • the capacitance change of the B region 1002 of the pressure strain structure gradually increases and then gradually decreases, then the capacitance of the C region 1003 gradually increases and then gradually decreases, and then the capacitance of the D region 1004 gradually increases and then decreases. That is to say, during the sliding process, the capacitance of the B region 1002 changes first, then the capacitance of the C region 1003 changes, and finally the capacitance of the D region 1004 changes.
  • the strain sensor can be arranged on the shell of the earphone (such as the earphone handle 801 ).
  • the headset such as volume adjustment
  • the interaction between the headset and an electronic device (such as a mobile phone) will be illustrated as an example.
  • the headset can listen to the music played by the mobile phone. For example, if the user wants to pause playing music, the user can squeeze the casing of the earphone in the direction shown in (a) of FIG. 11 .
  • the earphone sends a first instruction to the mobile phone in response to the user's pressing operation on the earphone shell.
  • the mobile phone receives the first instruction sent by the headset and controls the mobile phone to stop playing music.
  • the user wants to record, the user can squeeze the casing of the earphone in the direction shown in (a) in FIG.
  • the mobile phone receives the second instruction sent by the headset, and controls the mobile phone to perform a recording operation.
  • the user can slide on the casing of the earphone in the direction shown in (a) in FIG.
  • the mobile phone receives the third instruction sent by the headset, and controls the mobile phone to adjust the volume (such as increasing the volume or decreasing the volume).
  • Each functional unit in each of the embodiments of the embodiments of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit.
  • the above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.
  • the integrated unit if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium.
  • a computer-readable storage medium includes several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) or a processor to execute all or part of the steps of the methods described in the various embodiments of the present application.
  • the aforementioned storage medium includes: flash memory, removable hard disk, read-only memory, random access memory, magnetic disk or optical disk and other media that can store program codes.

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Abstract

本申请提供一种耳机，能够解决目前耳机内实现功能按键的应变感应模块占用空间面积大的问题，以通过多向按压的方式实现耳机的功能按键并降低耳机的整体大小。该耳机包括外壳以及在外壳形成的腔体内设置的压力应变结构。压力应变结构的两端部均与外壳的内壁稳定接触。压力应变结构上设置有应变感应器。在挤压外壳的情况下，压力应变结构产生应变，应变感应器用于感应压力应变结构产生的应变。

Description

耳机
本申请要求于2021年4月8日提交国家知识产权局、申请号为202110379581.4、申请名称为“一种管式终端的双翼型多向按键、电容和滑动检测方法”的中国专利申请的优先权，以及于2021年7月30日提交国家知识产权局、申请号为202110873176.8、申请名称为“耳机”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子设备技术领域，尤其涉及一种耳机。
背景技术
通常情况下，为便于用户操作，耳机会设置功能按键，用于触发开机、关机、暂停、播放、录音等操作。以无线耳机为例，目前业界所采用的方案是：在耳机柄的壳体形成的腔体内设置应变感应模块。该应变感应模块需要贴合耳机柄的壳体内侧。为了提高应变感应模块的感应能力，通常采用在耳机柄的壳体上增加平面辅助定位区域，或者增加应变感应模块的应变检测单元的数量实现，使得耳机柄壳体占用的空间面积大，从而使得耳机柄的形状和空间大小受到限制。
发明内容
本申请实施例提供一种耳机，能够解决目前耳机内实现功能按键的应变感应模块占用空间面积大的问题，以通过多向按压的方式实现耳机的功能按键并降低耳机的整体大小。
为达到上述目的，本申请采用如下技术方案：
本申请实施例提供一种耳机。该耳机包括外壳。外壳形成的腔体内还设置有压力应变结构。压力应变结构的两端部均与外壳的内壁稳定接触。压力应变结构上设置有应变感应器。在挤压外壳的情况下，压力应变结构产生应变，应变感应器用于感应压力应变结构产生的应变。
应理解，压力应变结构的两端部均与外壳的内壁稳定接触，可以使得压力应变结构受到外壳的挤压力时产生应变。其中，应变是指压力应变结构在受到外壳的挤压力的情况下的相对变形。示例性地，当用户挤压外壳与压力应变结构两端的接触部位时，压力应变结构受到外壳的双向挤压力可以产生线应变。具体地，压力应变结构的内侧面(即压力应变结构的凹面)形成压缩形变，而产生负应变；压力应变结构的外侧面(即压力应变结构的凸面)形成拉伸形变，而产生正应变。耳机可以根据压力应变结构产生的应变触发耳机执行相应的操作(如开机、关机、暂停、播放等)。
如此一来，本申请实施例提供的耳机，无需将应变感应模块贴合外壳设置，无需在外壳上设置辅助定位按压区域，也无需增加应变检测单元，只需要将压力应变结构的两端部与外壳的内壁稳定接触，使得压力应变结构适应外壳形成的腔体空间设置，从而使压力应变结构可以充分利用外壳形成的腔体空间，进而降低耳机外壳占用的空间面积，以减小耳机的整体大小。
在一种可能的实现方式中，应变感应器设置于压力应变结构的第一面(即压力应变结构的外侧面)和/或压力应变结构的第二面(即压力应变结构的内侧面)。示例性地，依然以用户挤压外壳与压力应变结构两端的接触部位为例，设置于压力应变结构外侧面的应变感应器，用于感应压力应变结构的外侧面产生的正应变；设置于压力应变结构内侧面的应变感应器，用于感应压力应变结构的内侧面产生的负应变。
在一种可能的实现方式中，压力应变结构包括底板和连接于底板两侧边上的侧板。侧板与底板之间具有夹角。侧板远离底板的端部与外壳的内壁稳定接触。其中，侧板与底板可以一体成型，也可以通过焊接等方式进行连接。当挤压外壳与压力应变结构的稳定接触区域时，压力应变结构整体受到压缩，压力应变结构两侧的侧板受到外壳的挤压相互靠近，从而带动底板的内侧面产生压缩形变而产生负应变，并且带动底板的外侧面产生拉伸形变而产生正应变。
在一种可能的实现方式中，应变感应器设置于底板的第一面(即底板的外侧面)和/或底板的第二面(即底板的内侧面)上。应理解，上述压力应变结构产生的应变主要体现在压力应变结构的底板上，因此应变感应器设置在底板上可以提高应变感应的精确度。
在一种可能的实现方式中，当挤压外壳与压力应变结构两端的接触部位时，应变感应器用于感应压力应变结构产生的第一应变。
在一种可能的实现方式中，外壳形成的腔体内设置有处理器，应变感应器通过测量电路与处理器电连接。测量电路用于根据所述第一应变，向所述处理器输出第一信号。第一信号用于指示所述耳机执行第一操作。其中，第一操作包括开机、关机、暂停、播放、录音中的一种。如此，用户可以通过挤压外壳与压力应变结构两端的接触部位，实现一种功能，如开机、关机、暂停、播放、录音中的一种。
在一种可能的实现方式中，当挤压外壳与压力应变结构的非接触部位时，应变感应器用于感应压力应变结构产生的第二应变。
在一种可能的实现方式中，外壳形成的腔体内设置有处理器，应变感应器通过测量电路与处理器电连接。测量电路用于根据所述第二应变，向处理器输出第二信号。第二信号用于指示耳机执行第二操作。其中，第二操作包括开机、关机、暂停、播放、录音中的一种。如此，用户可以通过挤压外壳与压力应变结构两端的非接触部位，实现另一种功能，如开机、关机、暂停、播放、录音中的一种。
需要说明的是，挤压外壳的不同部位，压力应变结构产生的应变不同。示例性地，当用户挤压外壳与压力应变结构两端的接触部位时，压力应变结构的内侧面产生负应变，压力应变结构的外侧面产生正应变(即第一应变)。然而，当用户挤压外壳与压力应变结构两端的非接触部位时，压力应变结构的内侧面产生正应变，压力应变结构的外侧面产生负应变(即第二应变)。
由此可见，挤压外壳使压力应变结构产生应变，可以无需对准外壳与压力应变结构的接触部位，挤压外壳与压力应变结构的非接触部位也可以使压力应变结构产生应变，实现耳机的功能按键的方式更加灵活。
在一种可能的实现方式中，外壳形成的腔体内还可以包括印刷电路板。处理器设置在印刷电路板上。应变感应器通过软板与印刷电路板电连接，以使应变感应器与处 理器电连接。
在一种可能的实现方式中，外壳包括耳机头壳体和耳机柄壳体。压力应变结构设置于耳机柄壳体形成的腔体内，并且压力应变结构的两端部与耳机柄壳体的内壁稳定接触。如此，可以方便用户操作。
在一种可能的实现方式中，耳机柄壳体的外表面靠近耳机柄壳体与压力应变结构的接触部位处，设置有平面定位区。如此，可以使用户能够快速找到功能按键的挤压位置。
在一种可能的实现方式中，外壳包括耳机头壳体。压力应变结构设置于耳机头壳体形成的腔体内，并且压力应变结构的两端部与耳机头壳体的内壁稳定接触。如此，体积更小，更便于用户携带。
在一种可能的实现方式中，压力应变结构中可增加电容辅助检测方案，通过挤压过程中压力应变结构中不同区域位置电容量的变化辅助判断挤压的力度和方向。
具体而言，压力应变结构的第一面(如压力应变结构的外侧面)包括第一区域(如C区域)和第二区域(如D区域)。第一区域和第二区域分别靠近压力应变结构的两端与外壳的接触部位。第一区域贴合有第一电容检测接触片(如铜皮网络)，第一电容检测接触片可以通过软板与处理器电连接。和/或，第二区域贴合有第二电容检测接触片(如铜皮网络)，第二电容检测接触片可以通过软板与处理器电连接。
当挤压外壳时，第一电容检测接触片用于检测第一区域产生的电容量，第二电容检测接触片用于检测第二区域产生的电容量。示例性地，当用户挤压外壳与压力应变结构的接触区域时，由于手指接近并触碰外壳，使得压力应变结构的C区域和D区域的电容量产生明显的变化。当用户挤压外壳与压力应变结构的非接触区域时，由于手指距离C区域和D区域可能较远，因而C区域和D区域的电容量变化不明显。如此便可以通过压力应变结构C区域和D区域的电容量的变化，辅助判断挤压的力度和方向。
在一种可能的实现方式中，压力应变结构的第一面(如外侧面)还包括第三区域。第三区域(如B区域)位于第一区域和第二区域之间。第三区域贴合有第三电容检测接触片(如铜皮网络)。第三电容检测接触片可以通过软板与处理器电连接。当挤压外壳时，第三电容检测接触片用于检测第三区域产生的电容量。示例性地，当用户挤压外壳与压力应变结构的接触区域时，由于手指接近并触碰外壳，使得压力应变结构的C区域和D区域的电容量产生明显的变化，B区域的电容量变化较小。当用户挤压外壳与压力应变结构的非接触区域时，由于手指距离C区域和D区域可能较远，因而C区域和D区域的电容量变化较小，B区域的电容量变化更大。如此可以进一步通过压力应变结构C区域和D区域的电容量的变化，辅助判断挤压的力度和方向，提高辅助判断的准确性。
在一种可能的实现方式中，在压力应变结构的第二面(如内侧面)上，与第三区域相对的位置处为第四区域(如A区域)；所第四区域贴合有第四电容检测接触片(如铜皮网络)；第四电容检测接触片可以通过软板与处理器电连接；当挤压外壳时，第四电容检测接触片用于检测第四区域产生的电容量。示例性地，当用户挤压外壳与压力应变结构的接触区域时，由于手指接近并触碰外壳，A区域的变化量也较 小；当用户挤压外壳与压力应变结构的非接触区域时，A区域的变化量也可能较大。在此情况下，也可以结合C区域和D区域，辅助判断挤压的力度和方向，提高辅助判断的准确性。
如此一来，通过电容检测可以辅助判断挤压的方向(即应力产生的方向)，从而可以根据不同挤压方向带来的应力方向差异和电容变化差异，可以将对耳机外壳的以不同方向进行挤压的方式，配置为不同的按键功能，实现按键功能的扩展，提高用户体验。
在一种可能的实现方式中，上述压力应变结构还可以用于滑动检测。具体地，当沿外壳的外壁滑动时，第一电容检测接触片还用于检测第一区域(如C区域)产生的电容量。第二电容检测接触片还用于检测第二区域(如D区域)产生的电容量。第三电容检测接触片还用于检测第三区域(如B区域)产生的电容量。示例性地，用户的手指沿着依次经过C区域、B区域、D区域的方向滑动时，手指先靠近C区域，然后再靠近B区域，最后靠近D区域。因而C区域、B区域、D区域中电容量的变化时间不同。如此一来，可以根据B区域、C区域以及D区域的电容量变化特征，并结合压力应变结构中应变感应器对应变大小的感应，可以设置在耳机的外壳表面滑动时，实现耳机的某种功能(如音量大小的调节)。
附图说明
图1A为现有技术中一种无线耳机的结构示意图；
图1B为现有技术中一种耳机中的应变感应模块的结构示意图；
图2为本申请实施例提供的一种无线耳机的架构示意图；
图3为本申请实施例提供的一种耳机本体的结构示意图；
图4为本申请实施例提供的应变感应器设置位置的结构示意图一；
图5为本申请实施例提供的应变感应器设置位置的结构示意图二；
图6为本申请实施例提供的一种挤压场景的结构示意图；
图7为本申请实施例提供的一种压力应变结构的结构示意图；
图8A为本申请实施例提供的另一种耳机本体的结构示意图；
图8B为本申请实施例提供的又一种耳机本体的结构示意图；
图9为本申请实施例提供的压力应变结构设置在耳机柄内的结构示意图；
图10为本申请实施例提供的一种在压力应变结构上设置电容感应区域的结构示意图；
图11为本申请实施例提供的一种挤压场景的结构示意图；
图12为本申请实施例提供的另一种挤压场景的结构示意图；
图13为本申请实施例提供的一种滑动场景的结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非 另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“竖向”、“横向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连。此外，术语“耦接”或“耦合”可以是实现信号传输的电性连接的方式。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
耳机可以与手机、笔记本电脑、手表等电子设备配合使用，处理电子设备的媒体、通话等音频业务，以及其他一些数据业务。例如，该音频业务可以包括为用户播放音乐、录音、视频文件中的声音、游戏中的背景音乐、来电提示音等媒体业务；还可以包括在电话、微信语音消息、音频通话、视频通话、游戏、语音助手等通话业务场景下，为用户播放对端的语音数据，或采集用户的语音数据发送给对端等。
通常情况下，为便于用户操作，耳机会设置功能按键。例如，对于有线耳机来说，耳机连接线上的功能按键，可以用于在播放音乐时暂停或继续播放，还可以用于接听电话和挂断电话。对于无线耳机(如蓝牙耳机)来说，无线耳机上的功能按键，除了可以用于在播放音乐时暂停或继续播放，以及用于接听电话和挂断电话外，还可以用于控制无线耳机开机或关机。
上述无线耳机可以是真正无线立体声耳机(true wireless stereo，TWS)。TWS耳机通常是基于蓝牙芯片实现的。TWS耳机在使用时，电子设备通过连接主耳机，再由主耳机通过无线方式快速连接副耳机，从而实现真正的蓝牙左右声道无线分离使用。
如图1A所示，为现有技术中一种TWS耳机100的结构示意图。请参考图1A中的(a)和图1A中的(b)，TWS耳机100包括耳机头101(也可以称为耳塞)，以及与耳机头101连接的耳机柄102。其中，耳机头101的壳体形成的腔体内设置有音频模块，可以用于管理音频数据，实现耳机输入和输出音频信号，以便用户通过无线耳机接打电话、播放音乐等。耳机柄102的壳体形成的腔体内设置有应变感应模块104。上述应变感应模块104通常采用直接接触捏压产生应变的电阻桥按压检测方式实现应变感应，因此应变感应模块104需要贴合耳机柄102的壳体设置。为了使应变感应模块104能够贴合外壳，使用户按压耳机柄102的壳体时，应变感应模块104能够准确感应，通常具有如下两种处理方式：
第一种，如图1A中的(a)和图1A中的(b)所示，在耳机柄102的壳体外部设置平面按压区域103，用于用户在按压应变感应模块104时的辅助定位。在此情况下，耳机柄102的壳体需要设计平面区域，使得耳机柄102的形状受到限制。
第二种，若不在耳机柄102的壳体外部增加平面按压区域作为辅助定位，则应变感应模块103中需要增加应变感应区域。如图1B所示，应变感应模块104包括与处 理器耦合连接的连接器1041，以及至少两组应变检测单元1042(图示为两组，也可以设置三组，甚至更多)，以增加应变感应区域。在此情况下，若应变感应模块104中应变检测单元的数量增加，会使得应变感应模块104的长度增加，不仅会增加应变感应模块104的制作成本，还会增加应变感应模块104在耳机柄102的壳体形成的腔体内的内部空间，从而使得耳机柄的壳体较长，使得耳机的壳体占用空间大。
由此可见，现有技术中耳机的功能按键实现方式，可能会导致耳机的壳体具有平面辅助定位区域，或者耳机的壳体占用的空间面积大，从而使得耳机的壳体形状和空间大小受到限制。此外，现有技术中耳机的功能按键采用的是直接接触捏压产生应变的电阻桥按压检测方式实现，使应变感应模块104感应按压动作来实现的，按压的力量主要靠耳机柄102的壳体与应变感应模块104的相贴合的部位传递，因此应变感应模块104只能感应单一的按压动作，能够实现的案件的功能过于单一。
此外，由于现有技术的耳机的壳体占用空间面积较大，可能使得耳机不利于用户携带或佩戴。并且，现有技术的耳机的功能按键只能靠感应单一的按压动作，用户必须按压耳机特定的位置才能够感应，从而使用户操作不便，用户体验较差。
为解决上述问题，本申请实施例提供了一种耳机。该耳机可以采用多向按压的方式实现功能按键的相应功能，可以减小耳机柄壳体占用的空间大小，从而降低耳机的整体大小。下面以无线耳机为例详细描述本申请实施例提供的耳机。其中，多向按压是指用户可以分别朝相反的两个方向对耳机的外壳进行挤压，例如，用户使用两个手指对耳机的外壳进行捏压。多向按压还可以指用户沿着不同的方向捏压耳机外壳的不同位置，例如，用户使用两个手指捏压耳机的任意位置。
示例性的，图2示出了本申请实施例提供的一种无线耳机200的架构示意图。该无线耳机200可以包括至少一个处理器201、至少一个存储器202、无线通信模块203、音频模块204、电源模块205以及输入/输出接口206等。该处理器201可以包括一个或多个接口，用于与无线耳机200的其他部件相连。
其中，存储器202可以用于存储程序代码，如用于无线耳机200进行充电，无线耳机200与其他电子设备进行无线配对连接，或无线耳机200与电子设备进行无线通信的程序代码等；或者，还可以用于记录用户的姿势、用户习惯(如对耳机功能按键的按压力度)实现按键触发开机、关机、暂停、播放、录音、开始充电、停止充电等操作。
处理器201可以用于执行上述应用程序代码，调用相关模块以实现本申请实施例中无线耳机200的功能。例如，实现无线耳机200的充电功能，无线通信功能和音频数据播放功能等。处理器201可以包括一个或多个处理单元，不同的处理单元可以是独立的器件，也可以集成在一个或多个处理器201中。处理器201具体可以是集成的控制芯片，也可以由包括各种有源和/或无源部件的电路组成，且该电路被配置为执行本申请实施例描述的属于处理器201的功能。
无线通信模块203可以用于，支持无线耳机200与其他电子设备或耳机盒之间包括蓝牙(bluetooth，BT)，全球导航卫星系统(global navigation satellite system，GNSS)，无线局域网(wireless local area networks，WLAN)(如无线保真(wireless fidelity，Wi-Fi)网络)，调频(frequency modulation，FM)，近距离无线通信技术(near  field communication，NFC)，红外技术(infrared，IR)等无线通信的数据交换。在一些实施例中，该无线通信模块203可以为蓝牙芯片。无线耳机200可以通过该蓝牙芯片与其他电子设备的蓝牙芯片之间进行配对并建立无线连接，以通过该无线连接实现无线耳机200和其他电子设备之间的无线通信。
另外，无线通信模块203还可以包括天线，无线通信模块203经由天线接收电磁波，将电磁波信号调频以及滤波处理，将处理后的信号发送到处理器201。无线通信模块203还可以从处理器201接收待发送的信号，对其进行调频，放大，经天线转为电磁波辐射出去。
音频模块204可以用于处理音频数据，实现无线耳机200输入和输出音频信号。例如，音频模块204可以从无线通信模块203获取音频信号，或者向无线通信模块203传递音频信号，实现通过无线耳机接打电话、播放音乐、启动/关闭与耳机连接的电子设备的语音助手、接收/发送用户的语音数据等功能。音频模块204可以包括用于输出音频信号的扬声器(或称听筒、受话器)组件，麦克风(或称话筒，传声器)，与麦克风相配合的麦克风收音电路等。扬声器可以用于将音频电信号转换成声音信号并播放。麦克风可以用于将声音信号转换为音频电信号。应理解，上述音频模块204也可以单独设置在处理器201的外部，也可以集成在处理器201的内部实现。
电源模块205，可为无线耳机200各模块供电；支持无线耳机200接收充电输入等。电源模块205可以包括电源管理单元(power management unit，PMU)和电池。其中，电源管理单元可以包括充电电路、压降调节电路、保护电路、电量测量电路等。充电电路可以接收外部的充电输入。压降调节电路可以将充电电路输入的电信号变压后输出给电池以完成对电池充电，还可以将电池输入的电信号变压后输出给音频模块204、无线通信模块203等其他模块。保护电路可以用于防止电池过充、过放、短路或过流等。在一些实施例中，电源模块205还可以包括无线充电线圈，用于对无线耳机200进行无线充电。另外，电源管理单元还可以用于监测电池容量，电池循环次数，电池健康状态(漏电，阻抗)等参数。
多个输入/输出接口206，可以用于提供无线耳机200与耳机盒之间进行充电或通信的有线连接。在一些实施例中，输入/输出接口206可以包括耳机电连接器，该耳机电连接器用于导通和传输电流。当无线耳机200放置于耳机盒中时，无线耳机200可以通过耳机电连接器与耳机盒中的电连接器建立电连接(例如耳机电连接器与耳机盒中的电连接器直接接触)。在该电连接建立后，耳机盒可以通过耳机电连接器和耳机盒中的电连接器的电流传输功能为无线耳机200中的电池充电。例如，该耳机电连接器可以为pogo pin、弹簧针、弹片、导电块、导电贴片、导电片、插针、插头、接触垫、插孔或插座等，本申请实施例对电连接器的具体类型不予限定。
具体的，无线耳机200可以包括配合用户左、右耳使用的一对耳机本体，每个耳机本体可以包括两个耳机电连接器。当耳机本体放置于耳机盒中时，耳机本体可以通过两个耳机电连接器与耳机盒中对应设置的两个电连接器建立电连接。在建立该电连接后，耳机盒可以为耳机本体中的电池充电。
在另一些实施例中，在该电连接建立后，无线耳机200还可以与耳机盒进行数据通信，例如可以接收来自耳机盒的配对指令。
另外，无线耳机200还可以包括传感器207。例如，该传感器207可以是距离传感器或接近光传感器，可以用于确定无线耳机200是否被用户佩戴。示例性的，无线耳机200可以利用距离传感器来检测无线耳机200附近是否有物体，从而确定无线耳机200是否被用户佩戴。在确定无线耳机200被佩戴时，无线耳机200可以打开扬声器。在一些实施例中，该无线耳机200还可以包括骨传导传感器，结合成骨传导耳机。利用该骨传导传感器，无线耳机200可以获取声部振动骨块的振动信号，解析出语音信号，实现语音功能。
再例如，无线耳机200的外表面还可以包括：触摸传感器，用于检测用户的触摸操作；指纹传感器，用于检测用户指纹，识别用户身份等；以及其他一些传感器，如电容传感器，用于检测电容量的变化，自适应调节一些参数(如音量大小)。
可以理解的是，本申请实施例示意的结构并不构成对无线耳机200的具体限定。其可以具有比图2示出的更多的或者更少的部件，可以组合两个或更多的部件，或者可以具有不同的部件配置。例如，在无线耳机200的外表面还可以包括按键208、指示灯(可以指示电量、呼入/呼出、配对模式等状态)、显示屏(可以提示用户相关信息)、防尘网(可以配合听筒使用)等部件。其中，该按键208可以是物理按键或触摸按键(与触摸传感器配合使用)等，用于触发开机、关机、暂停、播放、录音、开始充电、停止充电等操作。
图2示出的各种部件可以在包括一个或多个信号处理或专用集成电路在内的硬件、软件、或硬件和软件的组合中实现。
为实现耳机的功能按键的多向按压，本申请实施例提供的耳机包括耳机本体。示例性地，如图3所示，为本申请实施例提供的一种耳机本体300的结构示意图。其中，耳机本体300包括外壳301和内部部件。内部部件设置于外壳301形成的腔体内。内部部件可以包括上述图2所示的无线耳机中的处理器201、无线通信模块203、音频模块204和电源模块205等模块中的器件。
外壳301形成的腔体内还设置有压力应变结构302，该压力应变结构302的两端部(如图3中的(a)所示的第一端3021和第二端3022)与外壳301的内壁稳定接触，例如可以是弹接接触方式、也可以是焊接接触方式，本申请实施例不做特殊限定。当用户双向挤压外壳(即用户使用两个手指对外壳进行捏压)时，压力应变结构302受到外壳301的挤压力时会产生应变。其中，应变是指压力应变结构302在受到外壳301的挤压力的情况下的相对变形。以图3所示的耳机本体300为例，当用户挤压外壳301与压力应变结构302两端的接触部位(即按照如图3所示的(b)中的箭头方向双向挤压)时，压力应变结构302受到外壳301的双向挤压力可以产生线应变，压力应变结构302的内侧面3023形成压缩形变，而产生负应变；压力应变结构302的外侧面3024形成拉伸形变，而产生正应变。
为感应压力应变结构302产生的应变，如图4所示，上述压力应变结构302上设置有应变感应器303。该应变感应器303可以与耳机的处理器电连接，用于将压力应变结构302产生的应变大小发送至处理器，以使处理器根据压力应变结构302产生的应变大小，触发耳机执行开机、关机、暂停、播放、录音等操作。当用户挤压外壳301时，应变感应器303用于感应压力应变结构302产生的应变，从而使处理器根据 应变感应器303感应到的应变执行相应的功能操作(如暂停或播放)。
上述应变感应器303可以为电阻应变片，电阻应变片可以将机械构件上应变的变化转换为电阻的变化。电阻应变片包括敏感栅电阻元件和引线。敏感栅电阻元件可以由直径为0.01毫米至0.05毫米的高电阻系数的细丝弯曲成栅状制成，作为电阻应变片感应机械构件的敏感部分。引线可以由铜线等金属丝线制成，并且引线与敏感栅电阻元件电连接，用于将敏感栅电阻元件与测量电路连接。
在安装时需将电阻应变片通过粘合剂粘贴在压力应变结构302的表面上。在压力应变结构302在受到外壳301的挤压力的情况下，压力应变结构302产生应变。在压力应变结构302产生应变的情况下，电阻应变片中敏感栅电阻元件也会产生应变，使得敏感栅电阻元件的电阻值发生变化。通过测量电路测量电阻应变片电阻的变化，可以知道压力应变结构302是否受到挤压。
应理解，应变感应器303贴合于压力应变结构302的表面上，应变感应器303可以通过软板，即柔性印刷电路板(flexible printed circuit，FPC)与处理器耦合连接。FPC上可以设置用于测量应变感应器303电阻值的变化的测量电路。
如此一来，本申请实施例中的耳机中，无需将应变感应模块(即如图3所示的压力应变结构302以及应变感应器303)贴合外壳设置，无需在耳机本体300的外壳301上设置辅助定位按压区域，也无需增加多组应变检测单元，只需要将压力应变结构302的两端部与外壳301的内壁稳定接触。这样，当双向挤压外壳时可以使压力应变结构302产生应变，并且通过应变感应器303可以感应压力应变结构302产生的应变，从而实现耳机的功能按键的相应功能(如暂停或播放)。在本申请实施例中的耳机本体300的外壳301形成的腔体内，设置压力应变结构302，可以将压力应变结构302适应外壳301形成的腔体空间设置，从而可以充分利用外壳301形成的腔体空间，进而降低耳机外壳占用的空间面积，以减小耳机的整体大小。
应理解，上述应变感应器303可以设置于压力应变结构302的内侧面3023上，如图4所示。上述应变感应器303也可以设置于压力应变结构302的外侧面3024上，如图5中的(a)所示。上述应变感应器303也可以在上述压力应变结构302的内侧面3023和外侧面3024上均设置，如图5中的(b)所示(其中，图中的三个圆圈表示设置在内侧面3023上的应变感应器303)。
当应变感应器303在压力应变结构302的内侧面3023和外侧面3024上均设置时，应变感应器303采用差分检测的方式对压力应变结构302产生的应变进行检测。也就是说，处理器接收到压力应变结构302产生的应变是：压力应变结构302的内侧面3023上的应变感应器303感应到的应变值，与外侧面3024上的应变感应器303感应到的应变值之间的差分值。这样一来，可以提高检测的准确度。
示例性地，当以图3中的(b)所示的方向挤压外壳301与压力应变结构302的接触部位时，压力应变结构302受到外壳301的挤压力产生应变。此时，贴装在压力应变结构302的内侧面3023的应变感应器303，可以用于感应压力应变结构302的内侧面3024产生的负应变。贴装在压力应变结构302的外侧面3024的应变感应器303，可以用于感应压力应变结构302的外侧面3024产生的正应变。在此情况下，上述测量电路可以根据贴装在压力应变结构302的内侧面3023的应变感应器303感应 到的负应变，或者贴装在压力应变结构302的外侧面3024的应变感应器303感应到的正应变，向处理器输出指示信号(即第一信号)，以指示耳机执行开机、关机、暂停、播放、录音等操作。应理解，指示信号一般为电压信号。
还需要说明的是，在上述图3所示的耳机本体300中，当用户挤压外壳301与压力应变结构302的非接触部位(例如即按照如图6所示的箭头方向双向挤压)时，压力应变结构302受到外壳301的挤压力也可以产生线应变。此时，压力应变结构302的内侧面3023形成拉伸形变，而产生正应变；压力应变结构302的外侧面3024形成压缩形变，而产生负应变。
此时，贴装在压力应变结构302的内侧面3023的应变感应器303，可以用于感应压力应变结构302的内侧面3024产生的正应变。贴装在压力应变结构302的外侧面3024的应变感应器303，可以用于感应压力应变结构302的外侧面3024产生的负应变。在此情况下，上述测量电路可以根据贴装在压力应变结构302的内侧面3023的应变感应器303感应到的正应变，或者贴装在压力应变结构302的外侧面3024的应变感应器303感应到的负应变，向处理器输出指示信号(即第二信号)，以指示耳机执行开机、关机、暂停、播放、录音等操作。应理解，指示信号一般为电压信号。
由此可见，挤压外壳301使压力应变结构302产生应变，可以无需对准外壳301与压力应变结构302的接触部位，挤压外壳301与压力应变结构302的非接触部位也可以使压力应变结构302产生应变，也就是说，用户可以使用两个手指捏压耳机的任意位置(即多向按压)，使得实现耳机的功能按键的方式更加灵活，例如挤压外壳301与压力应变结构302的接触部位可以实现耳机的其中一种功能按键，如暂停或播放音乐，挤压外壳301与压力应变结构302的非接触部位可以实现耳机的另一种功能按键，如开机或关机。
应理解，上述应变感应器303通过测量电路向处理器输出的指示信号(如第一信号或第二信号)与用户挤压外壳的力度有关系，并且第一信号或第二信号可以指示耳机执行的操作可以不同，耳机可以根据用户的使用习惯进行设置。因此，本申请实施例对用户对外壳的挤压位置所对应的功能不做特殊限定。
如图7所示，为本申请实施例提供的一种耳机中的压力应变结构302的结构示意图。请参考图7，该压力应变结构302包括底板701和连接于底板701两侧边上的侧板702。侧板702与底板701之间具有夹角并形成槽体结构。侧板702与底板701可以一体成型，也可以通过焊接等方式进行连接。当该压力应变结构302设置于如图3所示的耳机的外壳301形成的腔体内时，侧板702远离底板701的端部7021与耳机的外壳301形成的腔体内壁稳定接触。
如此一来，当挤压外壳301与压力应变结构302的接触区域(即图3中的(b)所示的箭头方向)时，压力应变结构302整体受到压缩，压力应变结构302两侧的侧板702受到外壳301的挤压相互靠近，从而带动底板701的内侧面7011产生压缩形变而产生负应变，并且带动底板701的外侧面7012产生拉伸形变而产生正应变。
当挤压外壳301与压力应变结构302的非接触区域(即图6所示的箭头方向)，压力应变结构302也整体受到拉伸，压力应变结构302两侧的侧板702受到外壳301的挤压相互远离，从而带动底板701的内侧面7011产生拉伸形变而产生正应变，并 且带动底板701的外侧面7012产生压缩形变而产生负应变。
由此可见，压力应变结构302产生的应变方向与用户挤压外壳301部位有关。用户挤压耳机本体的外壳301与压力应变结构302的接触部位或非接触部位，可以产生不同的应变方向，从而使得上述耳机本体300可以根据挤压方向的不同，设置功能按键的不同功能。
需要说明的是，上述压力应变结构302并不限于图7所示的槽状结构，也可以是其他具有两个端部的任意形状，例如不规则的凹槽结构、弧面凹槽结构等。压力应变结构302的材质可以选择SUS301不锈钢，也可以选择其他的高强度的弹性材料，本申请实施例不做特殊限定。
还应理解，在图7所示的压力应变结构302中，由于压力应变结构302产生的应变主要体现在底板701上，因此应变感应器303设置在底板701上，可以提高应变感应的精确度。例如，应变感应器303可以设置在底板701的内侧面7011上，也可以设置在底板701的外侧面7012上，也可以在底板701的内侧面7011和外侧面7012上均设置上述应变感应器303，本申请实施例不做特殊限定。
图8A示出了耳机本体800的一种结构示意图。该耳机本体800可以包括耳机柄801，以及与耳机柄801的顶端相连的耳机头802。耳机柄801和耳机头802形成的腔体内部可以包括电路板804等内部部件。电路板804可以为印刷电路板(printed circuit boards，PCB)。电路板804上可以包括处理器、存储器、充电电路等多种组件，以实现上述图2所示的无线通信模块203、音频模块204和电源模块205等各项功能。例如，电源模块205可以设置在耳机柄801的形成的腔体内部。音频模块204中的扬声器组件可以设置于耳机头802形成的腔体内部。当用户戴上耳机时，可以听到从耳机头802的形成腔体内部的扬声器组件发出的声音信号，从而为用户实现播放音乐、接/打电话等功能。
在图8A所示的耳机本体800中，压力应变结构803设置在耳机柄801形成的腔体内部，耳机柄801一般用于用户手持以便佩戴耳机本体800至用户的耳孔内。为使用户佩戴后更加舒适，体验感更好，耳机柄801一般设计为光滑的圆柱形杆体结构。考虑到用户挤压耳机的耳机柄801的壳体实现耳机的功能按键操作的方便性，一般可以将压力应变结构803(即如图7所示压力应变结构302)设置在耳机柄801形成的腔体的尾部。通常情况下，如图2所示的耳机的电源模块205设置于耳机柄801形成的腔体内靠近耳机柄801尾部的位置处。如此，可以使电源模块205与耳机柄205尾部设置的用于对耳机进行充电的耳机电连接器耦合连接，以便当无线耳机放置于耳机盒内时，无线耳机可以通过耳机电连接器与耳机盒中的电连接器建立电连接，以实现对无线耳机进行充电。因而，压力应变结构803可以设置在耳机柄801形成的腔体内，并且靠近电源模块205设置。
应理解，上述耳机柄801的形状并不限于圆柱形，也可以是其他形状，如长条形，六棱柱形等，本申请实施例对耳机柄801的形状不做特殊限定。
当压力应变结构803设置在耳机柄801形成的腔体内时，压力应变结构803上设置的应变感应器可以通过软板，即FPC与上述电路板804耦合连接，以使应变感应器可以与处理器耦合连接。
还应理解，本申请实施例提供的耳机800，可以没有耳机柄801，例如，如图8B所示的耳机(图中未示出处理器等部件)。也就是说，压力应变结构803以及耳机的处理器等模块均设置在耳机的耳机头802内，也可以通过上述对耳机中压力应变结构的多向按压方式实现耳机的功能按键，具体方式可参照上文实施例的描述，此处不再赘述。
为减少长期使用出现的结构位移，压力应变结构803上设置有定位孔8031，压力应变结构803可以通过压力应变结构803上的定位孔8031固定在电路板804上。例如可以通过焊接、热熔或者螺钉等连接固定方式将压力应变结构803固定在电路板804上。
为便于用户对耳机的外壳进行挤压操作，如图9中的(a)所示，耳机柄801的壳体为光滑的圆柱形杆体结构，耳机柄801的壳体内部也为圆形弧面。在此情况下，可以将压力应变结构803中的两个侧板8031朝向耳机柄801的壳体的两侧设置，并且侧板8031的端部8032与耳机柄801的壳体内壁稳定接触。
为了便于用户快速找到耳机本体900的功能按键挤压位置，在耳机柄801的壳体与压力应变结构803的侧板8031的端部8032的接触区域处，耳机柄801的外径进行局部平面处理，形成平面定位区8011，如图9中的(b)所示。用户挤压耳机柄801的壳体使用功能按键时，只需要找到平面定位区8011挤压即可，从而可以增加定位感，提高用户的使用体验。并且，增加平面定位区8011后可以使用户能够准确找准挤压使用功能按键的位置，以便用户对压力应变结构803进行双向挤压时，提高压力应变结构803中的应变感应器的检测精度，以及检测稳定性，提高耳机的整体使用性能。
需要说明的是，通常情况下，为方便用户操作，上述耳机本体800中的压力应变结构803与耳机柄801的壳体的接触区域位于耳机本体800的两侧(以图8A为例，耳机本体800的两侧是指图8A所示的耳机柄801壳体的前侧和后侧)。
此外，本申请实施例提供的耳机本体，采用挤压的方式使用耳机的功能按键，在用户使用的过程中，可能会发生误触的问题。
为降低误触的发生，示例性地，在一些实施例中，在上述图8A所示的压力应变结构803中可以增加电容辅助检测方案，通过挤压过程中压力应变结构803中不同区域位置电容量的变化辅助判断挤压的力度和方向。
以上述图7所示的压力应变结构302为例，可以将压力应变结构803分为四个区域，分别为A区域1001、B区域1002、C区域1003和D区域1004。其中，底板701的内侧面7011为A区域1001，底板701的外侧面7012为B区域1002，两侧板702的背面分别为C区域1003和D区域1004。在压力应变结构302的A区域1001、B区域1002、C区域1003和D区域1004上分别设置铜皮网络，铜皮网络通过软板(如FPC)与电容传感通道耦合连接。此外，压力应变结构302也通过软板(如FPC)与电容传感通道耦合连接，作为电容检测时的参考端。上述电容传感通道可以设置在如图8A所示的电路板804上，并且与电路板804上的处理器耦合连接。
以压力应变结构302设置在耳机柄801形成的腔体内部为例，用户可以以图11中的(a)所示的箭头方向挤压耳机的外壳，也即以图11中的(b)所示的箭头方 向，挤压耳机柄801的壳体与压力应变结构302的接触区域。由于手指接近并触碰耳机柄801的壳体，使得压力应变结构203中的侧板702上的区域(即如图10所示的C区域1003和D区域1004)的电容量产生明显的变化，压力应变结构203的底板701上的区域(即如图10所示的A区域1001和B区域1002)的电容变化量，相对侧板702上的区域(即如图10所示的C区域1003和D区域1004)较少。
应理解，当用户误挤压外壳时，上述如图10所示的四个电容区域A区域1001、B区域1002、C区域1003和D区域1004的电容变化量，与用户主动挤压耳机柄801的壳体时，上述四个区域(即A区域1001、B区域1002、C区域1003和D区域1004)是具有明显区别的。例如，用户误挤压耳机柄801的壳体与压力应变结构302的一侧的接触区域(例如图10所示的C区域1003的一侧)时，C区域1003的电容变化明显，电容变化量较大；D区域1014的电容变化量较小，A区域和B区域的电容变化量也较小。当用户误触耳机柄801的壳体与压力应变结构302的非接触区域时，可能会出现如图10所示的A区域1001、B区域1002、C区域1003和D区域1004的电容变化量均较小。
由此可见，耳机中的处理器通过分析如图10所示的A区域1001、B区域1002、C区域1003和D区域1004的电容变化量的大小，可以辅助判断受挤压的力度和方向，并结合压力应变结构302中应变感应器303对应变大小的感应，可以确定用户是否主动挤压耳机外壳(如耳机柄801的壳体)，以想要达到暂停或播放的目的，从而提高应力检测的准确性。
需要说明的是，上述四个电容检测区域，可以根据实际情况灵活配置。例如，可以仅设置B区域1002、C区域1003和D区域1004，也可以仅设置B区域1002、C区域1003或B区域1002、D区域1004。
此外，用户还可以以图12中的(a)所示的箭头方向挤压耳机的外壳，也即以图12中的(b)所示的箭头方向，挤压外壳与压力应变结构的非接触区域。在此情况下，用户从外侧向耳廓侧挤压耳机的外壳(即耳机柄801的壳体)时，耳机柄801的壳体靠内侧的区域与人体皮肤(如耳廓或脸颊的皮肤)接触，耳机柄801的壳体靠外侧的区域与用户的手指接触。此时，压力应变结构302中的如图10所示的A区域1001和B区域1002，更靠近人体接触区域，A区域1001和B区域1002的电容变化更加明显，电容变化量较大；C区域1003和D区域1004与人体接触区域较远，因此C区域1003和D区域1004的电容变化量较小。也就是说，在挤压耳机外壳与压力应变结构的非接触区域时，与挤压耳机外壳与压力应变结构302的接触区域时，上述四个区域(即A区域1001、B区域1002、C区域1003和D区域1004)的电容变化量存在较大的差异。
如此一来，通过电容检测可以辅助判断挤压的方向(即应力产生的方向)，从而可以根据不同挤压方向带来的应力方向差异和电容变化差异，可以将对耳机外壳的以不同方向进行挤压的方式，配置为不同的按键功能，实现按键功能的扩展，提高用户体验。
应理解，当耳机外壳(如耳机柄801的壳体)没有外力挤压的时候，压力应变结构302保持在初始的位置。如图10所示的A区域1001、B区域1002、C区域1003 和D区域1004维持初始的电容量状态。
此外，上述压力应变结构302还可以用于滑动检测。示例性地，在正常佩戴场景的情况下，用户可以沿着耳机柄801壳体的管壁轻轻滑动，如图13中的(a)所示的箭头方向。此时，耳机柄801的壳体没有明显的挤压力，压力应变结构302产生的应变不明显。
在此情况下，用户的手指会沿着如图13中的(b)所示的箭头方向，沿耳机柄801的壳体的外壁滑动。手指皮肤逐渐接近如图10所示的压力应变结构302中的C区域1003，然后逐渐远离C区域1003。在远离C区域1003的过程中，手指皮肤逐渐接近压力应变结构302的B区域1002，然后逐渐远离B区域1002。在远离B区域1002的过程中，手指皮肤逐渐接近压力应变结构302的D区域1004，然后逐渐远离D区域1004。因此，压力应变结构的B区域1002的电容量变化逐渐增加然后逐渐减少，接着C区域1003的电容量逐渐增加然后逐渐减小，然后D区域1004的电容量逐渐增加然后减小。也就是说，在滑动的过程中，先是B区域1002的电容量变化，然后是C区域1003的电容量变化，最后是D区域1004的电容量变化。
如此一来，可以根据B区域1002、C区域1003以及D区域1004的电容量变化特征，并结合压力应变结构302中应变感应器对应变大小的感应，可以设置在耳机的外壳(如耳机柄801的壳体)表面滑动时，实现耳机的某种功能(如音量大小的调节)。
需要说明的是，为实现检测的准确性，需要在滑动的过程中形成一定的位移，也就是说滑动的范围尽量大一点。
以下，以听音乐为例，对耳机与电子设备(如手机)进行交互进行举例说明。
当耳机与手机建立通信连接(如蓝牙连接)后，耳机可以收听手机播放的音乐。例如用户想要暂停播放音乐，用户可以以图11中的(a)所示的方向挤压耳机的外壳。耳机响应于用户对耳机外壳的挤压操作，耳机向手机发送第一指令。手机接收到耳机发送的第一指令，控制手机停止播放音乐。又例如，用户想要录音，用户可以以图12中的(a)所示的方向挤压耳机的外壳，耳机响应于用户对耳机外壳的挤压操作，耳机向手机发送第二指令。手机接收到耳机发送的第二指令，控制手机进行录音操作。再例如，用户想要调节音量大小，用户可以以图13中的(a)所示的方向在耳机的外壳上滑动，耳机响应于用户对耳机外壳滑动操作，耳机向手机发送第三指令。手机接收到耳机发送的第三指令，控制手机进行调节音量大小(如增加音量或者减小音量)。
以上仅描述了耳机与手机交互的部分场景，因此上述示例并不对耳机与手机交互的场景构成限定。
应理解，上述实施例是以无线耳机进行举例说明，通过上述压力应变结构实现耳机的功能按键并不限于应用于无线耳机，也可以应用于有线耳机，本申请实施例对耳机的类型不做特殊限定。
通过以上的实施方式的描述，所属领域的技术人员可以清楚地了解到，为描述的方便和简洁，仅以上述各功能模块的划分进行举例说明，实际应用中，可以根据需要而将上述功能分配由不同的功能模块完成，即将装置的内部结构划分成不同的功能模 块，以完成以上描述的全部或者部分功能。上述描述的系统，装置和单元的具体工作过程，可以参考前述方法实施例中的对应过程，在此不再赘述。
在本申请实施例各个实施例中的各功能单元可以集成在一个处理单元中，也可以是各个单元单独物理存在，也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现，也可以采用软件功能单元的形式实现。
所述集成的单元如果以软件功能单元的形式实现并作为独立的产品销售或使用时，可以存储在一个计算机可读取存储介质中。基于这样的理解，本申请实施例的技术方案本质上或者说对现有技术做出贡献的部分或者该技术方案的全部或部分可以以软件产品的形式体现出来，该计算机软件产品存储在一个存储介质中，包括若干指令用以使得一台计算机设备(可以是个人计算机，服务器，或者网络设备等)或处理器执行本申请各个实施例所述方法的全部或部分步骤。而前述的存储介质包括：快闪存储器、移动硬盘、只读存储器、随机存取存储器、磁碟或者光盘等各种可以存储程序代码的介质。
以上所述，仅为本申请实施例的具体实施方式，但本申请实施例的保护范围并不局限于此，任何在本申请实施例揭露的技术范围内的变化或替换，都应涵盖在本申请实施例的保护范围之内。因此，本申请实施例的保护范围应以所述权利要求的保护范围为准。

Claims (16)

  1. 一种耳机，其特征在于，包括外壳；
    所述外壳形成的腔体内还设置有压力应变结构；所述压力应变结构的两端部均与所述外壳的内壁稳定接触；
    所述压力应变结构上设置有应变感应器；
    在挤压所述外壳的情况下，所述压力应变结构产生应变，所述应变感应器用于感应所述压力应变结构产生的应变。
  2. 根据权利要求1所述的耳机，其特征在于，所述应变感应器设置于所述压力应变结构的第一面和/或所述压力应变结构的第二面。
  3. 根据权利要求1或2所述的耳机，其特征在于，所述压力应变结构包括底板和连接于所述底板两侧边上的侧板；所述侧板与所述底板之间具有夹角；所述侧板远离所述底板的端部与所述外壳的内壁稳定接触。
  4. 根据权利要求3所述的耳机，其特征在于，所述应变感应器设置于所述底板的第一面和/或所述底板的第二面上。
  5. 根据权利要求1至4任一项所述的耳机，其特征在于，当挤压所述外壳与所述压力应变结构两端的接触部位时，所述应变感应器用于感应所述压力应变结构产生的第一应变。
  6. 根据权利要求5所述的耳机，其特征在于，所述外壳形成的腔体内设置有处理器，所述应变感应器通过测量电路与所述处理器电连接；所述测量电路用于根据所述第一应变，向所述处理器输出第一信号；
    所述第一信号用于指示所述耳机执行第一操作；所述第一操作包括开机、关机、暂停、播放、录音中的一种。
  7. 根据权利要求1至5任一项所述的耳机，其特征在于，当挤压所述外壳与所述压力应变结构的非接触部位时，所述应变感应器用于感应所述压力应变结构产生的第二应变。
  8. 根据权利要求7所述的耳机，其特征在于，所述外壳形成的腔体内设置有处理器，所述应变感应器通过测量电路与所述处理器电连接；所述测量电路用于根据所述第二应变，向所述处理器输出第二信号；
    所述第二信号用于指示所述耳机执行第二操作；所述第二操作包括开机、关机、暂停、播放、录音中的一种。
  9. 根据权利要求6或8所述的耳机，其特征在于，所述外壳形成的腔体内还包括印刷电路板；所述处理器设置在所述印刷电路板上；所述应变感应器通过软板与所述印刷电路板电连接，以使所述应变感应器与所述处理器电连接。
  10. 根据权利要求1至9任一项所述的耳机，其特征在于，所述外壳包括耳机头壳体和耳机柄壳体；所述压力应变结构设置于所述耳机柄壳体形成的腔体内，并且所述压力应变结构的两端部与所述耳机柄壳体的内壁稳定接触。
  11. 根据权利要求10所述的耳机，其特征在于，所述耳机柄壳体的外表面靠近所述耳机柄壳体与压力应变结构的接触部位处，设置有平面定位区。
  12. 根据权利要求1至9任一项所述的耳机，其特征在于，所述外壳包括耳机头 壳体；所述压力应变结构设置于所述耳机头壳体形成的腔体内，并且所述压力应变结构的两端部与所述耳机头壳体的内壁稳定接触。
  13. 根据权利要求1至12任一项所述的耳机，其特征在于，所述压力应变结构的第一面包括第一区域和第二区域；所述第一区域和所述第二区域分别靠近所述压力应变结构的两端与所述外壳的接触部位；
    所述第一区域贴合有第一电容检测接触片；和/或，所述第二区域贴合有第二电容检测接触片；
    当挤压所述外壳时，所述第一电容检测接触片用于检测所述第一区域产生的电容量，所述第二电容检测接触片用于检测所述第二区域产生的电容量。
  14. 根据权利要求13所述的耳机，其特征在于，所述压力应变结构的第一面还包括第三区域；所述第三区域位于所述第一区域和所述第二区域之间；所述第三区域贴合有第三电容检测接触片；
    当挤压所述外壳时，所述第三电容检测接触片用于检测所述第三区域产生的电容量。
  15. 根据权利要求14所述的耳机，其特征在于，在所述压力应变结构的第二面上，与所述第三区域相对的位置处为第四区域；所第四区域贴合有第四电容检测接触片；
    当挤压所述外壳时，所述第四电容检测接触片用于检测所述第四区域产生的电容量。
  16. 根据权利要求14或15所述的耳机，其特征在于，当沿所述外壳的外壁滑动时，所述第一电容检测接触片还用于检测所述第一区域产生的电容量；所述第二电容检测接触片还用于检测所述第二区域产生的电容量；所述第三电容检测接触片还用于检测所述第三区域产生的电容量。
PCT/CN2022/085642 2021-04-08 2022-04-07 耳机 WO2022214040A1 (zh)

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