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WO2016061889A1 - 晶圆真空键合机及键合方法 - Google Patents

晶圆真空键合机及键合方法 Download PDF

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Publication number
WO2016061889A1
WO2016061889A1 PCT/CN2014/094300 CN2014094300W WO2016061889A1 WO 2016061889 A1 WO2016061889 A1 WO 2016061889A1 CN 2014094300 W CN2014094300 W CN 2014094300W WO 2016061889 A1 WO2016061889 A1 WO 2016061889A1
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WO
WIPO (PCT)
Prior art keywords
wafer
cover
clamp
tray
support frame
Prior art date
Application number
PCT/CN2014/094300
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English (en)
French (fr)
Inventor
尹明
唐昊
Original Assignee
浙江中纳晶微电子科技有限公司
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Application filed by 浙江中纳晶微电子科技有限公司 filed Critical 浙江中纳晶微电子科技有限公司
Publication of WO2016061889A1 publication Critical patent/WO2016061889A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

Definitions

  • the invention relates to the field of microelectronics, in particular to a wafer vacuum bonding machine and a bonding method.
  • Wafer bonding refers to the close contact of two wafers so that they can be firmly bonded together.
  • Current wafer bonding technology requires a special wafer bonding system. Due to the material requirements of the wafer itself, the wafer bonding requirements are very high, requiring two wafers to be perfectly bonded without bubbles. If wafer bonding is required without bubbles, then it must be vacuum The bonding is completed in the environment, but the wafer bonding process requires two wafers to be perfectly matched.
  • the existing wafer bonding system generally uses a robot to realize the positional correspondence of the two wafers in a vacuum environment. Complex and costly.
  • the technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a wafer vacuum bonding machine which is simple in positioning, low in cost, and capable of perfectly bonding two wafers.
  • the present invention provides a wafer vacuum bonding machine, which comprises a box body, a vacuum generator is arranged in the box body, and the box body is provided with an internal closed press, the pressure
  • the machine comprises a clamp disposed on the box body and a cover disposed on the clamp and closed inside when the cover is closed, the cover is provided with a pressure plate, and the lower surface of the pressure plate is provided with a heating plate, the pressure plate and the heating plate
  • An insulating layer is disposed between the tray, and a tray for placing a wafer is disposed in the fixture, and a heating device is disposed under the tray, and a plurality of positioning blocks moving in a diameter direction are disposed around the tray, Each of the positioning blocks is driven by a cylinder disposed on the outer wall of the clamp, and the head of each of the positioning blocks is further provided with a bracket.
  • the two wafers are perfectly matched by two advance and retreat of the positioning block, and then the two wafers are bonded by pressing down the pressing plate, and the first wafer and the second wafer are in the Contact in a vacuum state, so there is no bubble between the two, and then the two wafer positions are correspondingly operated by operating the positioning block.
  • the operation of the positioning block is completed by the cylinder, the structure is simple, the operation is convenient, the cost is low, and the wafer can be realized. The perfect bond.
  • the bracket is made by bending a wire connected to the head of the positioning block outward.
  • a plurality of equal height limit blocks perpendicular to the bottom of the clamp are also disposed in the clamp.
  • the limiting block can be abutted against the pressing plate on the cover, so that the pressing plate can reach the set position when pressing, thereby ensuring the distance between the two wafers when the two wafers are bonded. The bonding effect is better.
  • the position of the wafer on the tray can be positioned by using three positioning blocks, and the structure is simple and the cost is low.
  • the box body is provided with at least one "C" shaped chuck driven by a pushing mechanism.
  • the chuck is pushed inwardly to clamp the edge of the clamp and the cover, so that the clamp and the cover Clamping.
  • the cover is connected to the box body through a support frame.
  • the box body is provided with a support seat.
  • One end of the support frame is hinged with the support base, and the other end of the support frame is hinged with the middle of the outer side of the cover to make the cover relatively Rotate on the support frame.
  • the cover is hinged to the support frame, and the support frame is provided with a rotating hole and a pin hole.
  • the cover is connected to the support frame through a rotating shaft through a rotating shaft and can rotate relative to the support frame, and the cover passes through a pin.
  • the pin hole is connected to the support frame.
  • the rotating hole is a waist hole
  • the rotating shaft is movable left and right in the waist hole
  • the clamp is provided with a guiding groove
  • the cover is provided with a guiding protrusion matched with the guiding groove, the cover cover
  • the guide projections are embedded in the guide grooves.
  • the invention also provides a wafer bonding method, which comprises the following steps:
  • the set value of the degree of vacuum is 5 to 15 Pa
  • the time t of the pressing in the step S6 is 2 to 10 minutes
  • the heating temperature in the step S7 is 200 to 300 degrees. It is 5 to 15 minutes.
  • the present invention has the following advantages: the present invention defines the position of the first wafer after the first positioning block advances, and then places the second wafer, and then vacuums, and the positioning block is returned.
  • the second wafer is written in a vacuum state, it is dropped onto the first wafer, and then the position of the second wafer and the first wafer is simultaneously defined by the advancement of the positioning block, and then pressed.
  • the positioning block is retracted, so that the position of the two wafers is perfectly matched when the pressing is performed, that is, the two wafers coincide on the plane, and there is no bubble between the two wafers. After pressing, it is heated and solidified.
  • 1 is a schematic structural view of a wafer bonding machine
  • FIG. 2 is a schematic structural view of a press
  • Figure 3 is an enlarged schematic view of a portion A of Figure 1.
  • FIG. 4 is a schematic structural view of another embodiment of a wafer bonding machine
  • FIG. 5 is a schematic structural view showing an open state of a cover of another embodiment of a wafer bonding machine
  • FIG. 6 is a schematic view showing a connection structure of a cover and a jig in a wafer bonding machine.
  • the present invention provides a wafer vacuum bonding machine, which comprises a box body 1 in which a vacuum generator is disposed, and the box body 1 is provided with an internal closed pressure.
  • the press 2 includes a clamp 2.2 disposed on the casing 1 and a cover 2.1 disposed on the clamp 2.2 and closing the interior when the cover is closed.
  • the cover 2.1 is provided with a pressure plate 7 therein.
  • a heating plate 9 is disposed on the lower surface thereof, and a heat insulating layer 8 is disposed between the pressing plate 7 and the heating plate 9.
  • the tray 2 is provided with a tray 3 for placing a wafer, and the tray 3 is provided with heating under the tray 3.
  • a plurality of positioning blocks 4 that are diametrically moved around the tray 3, each of the positioning blocks 4 being driven by a cylinder 5 disposed on an outer wall of the clamp 2.2, the head of each positioning block 4
  • the press 2 has an inner closed chamber, the chamber is connected to a vacuum generator, the vacuum generator can evacuate the chamber, and the outer side of the upper cover of the press 2 is provided with a press cylinder 10, and the press cylinder 10
  • the output shaft is connected to the pressure plate of the press 2 to drive the platen to move down.
  • the cover 2.1 is connected to the clamp 2.2 by two cylinders, and when the cover 2.1 is placed on the clamp 2.2, the closed space inside the press 2 is formed.
  • the tray 3 is circular, and a heating device is disposed under the tray 3 to heat the tray 3. After the pressing plate 7 presses down the wafer, the heating plate on the pressing plate 7 and the tray 3 simultaneously perform wafer processing on the wafer. heating.
  • the positioning block 4 is driven by the cylinder 5 provided on the outer wall of the clamp 2.2, and can move toward the tray or away from the tray along the diameter direction of the tray 3. By setting the stroke of the cylinder 5, the positioning block 4 is advanced. Can be positioned against the edge of the wafer to position the wafer.
  • the positioning of the circular wafer can be achieved by using three positioning blocks.
  • the head of the positioning block is provided with a bracket, and the bracket 4.1 is disposed at the upper end of the positioning block.
  • the positioning block below the bracket is opposite to the wafer, and the bracket is provided with a distance between the wafer and the wafer.
  • the bracket 4.1 is formed by bending a wire connected to the head of the positioning block 4 outward.
  • the wire is bent into an arc shape. Since the wafer has a bonding glue at the time of bonding, in order to maintain the bonding effect, the positioning block 4 needs to be periodically cleaned during use, in this embodiment.
  • the wire is pressed on the positioning block 4 by the pressing plate, and the removal is convenient when cleaning.
  • the positioning block may also be 4, 5 or more, but it is still within the protection scope of the present application.
  • a plurality of equal height limit blocks perpendicular to the bottom of the clamp are also disposed in the clamp.
  • the thickness of the bonding glue needs to be controlled, that is to say, after the two wafers are bonded, the distance between the two needs to be within the set range.
  • the pressing plate is pressed.
  • the pressure is stopped when the limit block is reached, so that the distance between the two wafers is determined.
  • the limit blocks of different heights need to be replaced.
  • the limiting block 6 is disposed on the outer side of the tray and has a columnar shape.
  • the limiting block is disposed on the outer circumference of the upper surface of the tray and has a sheet shape.
  • the box body 1 is provided with at least one "C" shaped chuck 12 driven by the pushing mechanism 11.
  • the pushing mechanism is a cylinder, and may also be a linear motion mechanism driven by a motor, or other linear motion mechanism.
  • the cover 2.1 is connected to the box body 1 through a support frame 13.
  • the box body 1 is provided with a support base 14, one end of the support frame 13 is hinged with the support base 14, and the other end of the support frame 13 and the cover 2.1
  • the outer middle hinge is hinged such that the cover 2.1 can be rotated relative to the support frame 13.
  • the support frame 13 is provided with a rotating hole 13.1 and a pin hole 13.2.
  • the cover 2.1 is connected to the support frame 13 through a rotating shaft 13.1 and is rotatable relative to the support frame 13.
  • the cover 2.1 passes through a pin hole through a pin.
  • 13.2 is connected to the support frame 13. When the pin is inserted, the cover does not rotate relative to the support frame, and when the pin is removed, the cover can be rotated relative to the support frame.
  • the rotating hole 13.1 is a waist hole, and the rotating shaft can move left and right in the waist hole.
  • the clamp 2.2 is provided with a guiding groove 16, and the cover 2.1 is provided with a guiding protrusion matched with the guiding groove 16. 17.
  • the guide projection 17 is fitted into the guide groove 16.
  • the lower end surface of the cover is provided with a guiding protrusion, and the outer side of the upper end surface of the clamp is provided with a guiding groove, and when the guiding protrusion enters the guiding groove downward, the center line of the cover and the clamp can be ensured. Ensure the accuracy of the matching of the upper and lower wafers when the press moves downward.
  • the invention also provides a wafer bonding method, which comprises the following steps:
  • the set value of the degree of vacuum is 5 to 15 Pa
  • the time t of the pressing in the step S6 is 2 to 10 minutes
  • the heating temperature in the step S7 is 200 to 300 degrees. It is 5 to 15 minutes.
  • Embodiment In this embodiment, two wafers having a thickness of 0.3 mm or more and a diameter of 200 mm are used, and the bonding steps are as follows:
  • the heating temperature is 300 degrees
  • the heating time is 10 minutes

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

一种晶圆真空键合机以及键合方法，它在第一次定位块前进后将第一块晶圆的位置进行限定，然后放入第二块晶圆，再抽真空，定位块退回时，第二块晶圆在真空的状态下降落到第一块晶圆上，然后再通过定位块的前进将第二块晶圆和第一块晶圆的位置同时限定，再进行压合，压合后撤回定位块，结构简单、操作方便、成本较低，而且能够实现晶圆的完美键合。

Description

晶圆真空键合机及键合方法 技术领域
本发明涉及微电子技术领域，具体讲是一种晶圆真空键合机及键合方法。
背景技术
晶圆键合是指将两片晶圆接触的足够紧密，使得他们能够牢固的结合在一起，目前的晶圆键合技术都需要专门的晶圆键合系统来实现。由于晶圆本身的材料要求，对晶圆键合的要求很高，要求两片晶圆能够无气泡的完美的贴合在一起，如果要求晶圆键合时无气泡，那么就必须要在真空环境下完成键合，但是晶圆键合的过程中又要求两块晶圆能够完美对应，现有的晶圆键合系统一般是在真空环境中采用机械手实现两块晶圆的位置对应，结构复杂，成本较高。
发明内容
本发明所要解决的技术问题是，克服了现有技术的缺陷，提供了一种定位简单、成本较低，而且能够使两块晶圆完美键合的晶圆真空键合机。
为解决上述技术问题，本发明提出一种晶圆真空键合机，它包括箱体，所述箱体内设有真空发生器，所述箱体上设有内部封闭的压机，所述压机包括设于箱体上的夹具以及设在夹具上并在盖上时使内部封闭的盖子，所述盖子内设有压板，所述压板的下表面设有加热板，所述压板和加热板之间设有隔热层，所述夹具内设有用于放置晶圆的托盘，所述托盘的下方设有加热装置，所述托盘的周围设有多个在直径方向移动的定位块，所述每个定位块由设置在夹具外壁上的气缸带动，所述每个定位块的头部还设有支架。
采用上述结构后，通过定位块的两次前进和后退，使两块晶圆完美对应，然后通过压板向下压使两块晶圆键合，第一块晶圆和第二块晶圆是在真空状态下接触，因此两者之间无气泡，然后通过操作定位块使两块晶圆位置对应，定位块的操作通过气缸来完成，结构简单，操作方便、成本较低，而且能够实现晶圆的完美键合。
所述支架为连接在定位块头部的金属丝向外弯曲制成。采用这种结构，支架的制作比较简单，而且与晶圆的摩擦力较小，晶圆降落时，位置不会发生大的变动，使得后续的操作比较简单，而且由于结构简单，便于后面的清洗或者更换的工作。
所述夹具内还设有垂直于夹具底部的多个等高的限位块。采用这种结构，限位块能够与盖子上的压板相抵，使压板在压合时能够到达设定位置，从而保证了两块晶圆在键合时的两块晶圆之间的距离一致，键合效果较好。
所述定位块有三个，所述三个定位块在托盘周围均匀布置。采用三个定位块就可以将晶圆在托盘上的位置进行定位，结构简单，成本较低。
所述箱体上至少设有一个由推动机构带动的“C”形夹头，当盖子盖在夹具上时，所述夹头在向内推动能够夹住夹具和盖子的边缘，使夹具和盖子夹紧。采用这种结构，在盖子盖在夹具上时，可以使盖子和夹具之间进行密封，采用夹头夹紧，可以保证连接强度，以及压机内部的密封度，从而可使压机内部保持真空。
所述盖子通过一支撑架连接在箱体上，所述箱体上设有一支撑座，所述支撑架的一端与支撑座铰接，支撑架的另一端与盖子的外侧的中部铰接使盖子可以相对于支撑架转动。采用这种结构，当盖子相对于夹具转动开来时，可以再次转动盖子，从而使盖子可以相对于夹具转动较大的角度，甚至可以转动朝上，那么可以更好地接触空气，散热效果更好。
所述盖子与支撑架铰接是指，所述支撑架上设有转动孔和销孔，盖子通过一转轴穿过转动孔与支撑架连接并可相对于支撑架转动，盖子通过一销子穿过销孔与支撑架连接。采用这种结构，当销子插上时，盖子不会相对于支撑架转动，当销子拿掉时，盖子才会相对于支撑架转动，防止在盖子盖在夹具上压紧时，盖子转动。
所述转动孔为腰型孔，所述转轴在腰型孔中可左右移动，所述夹具上设有导向槽，所述盖子上设有与该导向槽配合的导向凸起，所述盖子盖在夹具上时，导向凸起嵌入导向槽内。采用这种结构，用导向凸起和导向槽配合，可以保证盖子盖在夹具上时的对中，对中的精度非常高，从而使晶圆在键合时的对齐效果非常好，保证晶圆键合的质量。
本发明还提供一种晶圆键合方法，它包括以下步骤：
S1、将上面涂键合胶的第一块晶圆放到托盘上；
S2、通过气缸控制多个定位块向托盘方向前进，将第一块晶圆定位；
S3、在定位块支架上放置第二块晶圆，然后盖上盖子封闭压机，并抽真空；
S4，当真空度到达设定值时，控制多个定位块后退，第二块晶圆从定位块支架上降落到第一块晶圆上面；
S5，通过气缸控制多个定位块再次向托盘方向前进，对两块晶圆进行定位；
S6、通过压机控制压板向下，使第一块晶圆和第二块晶圆压合，维持t分钟；
S7、控制多个定位块再次后退，然后控制加热板和加热装置进行加热使键合胶固化；
S8、键合完成后，打开压机，将键合后的晶圆取出。
所述步骤S4中，真空度的设定值为：5～15帕，所述步骤S6中压合的时间t为2～10分钟，所述步骤S7中加热温度为：200～300度，时间为5～15分钟。采用上述参数，晶圆键合的效果更好，效率更高。
采用上述方法后，本发明具有以下优点：本发明在第一次定位块前进后就将第一块晶圆的位置进行限定，然后放入第二块晶圆，然后再抽真空，定位块退回时，第二块晶圆就在真空的状态写降落到第一块晶圆上，然后再通过定位块的前进使第二块晶圆和第一块晶圆的位置同时限定，然后再进行压合，压合后再撤回定位块，这样能够保证在压合时，两块晶圆的位置是完美对应的，即两块晶圆在平面上重合，而且两块晶圆之间也没有气泡，压合之后再进行加温固化。采用上述方法，步骤简单，可以采用PLC进行自动控制，而且键合效果较好，成本较低，效率较高。
附图说明
图1为晶圆键合机的结构示意图；
图2为压机的结构示意图；
图3为图1中A部分的放大示意图。
图4为晶圆键合机另一实施例的结构示意图；
图5为晶圆键合机另一实施例的盖子打开状态的结构示意图；
图6为晶圆键合机中盖子与夹具的连接结构示意图。
如图所示：1、箱体，2、压机，2.1、盖子，2.2、夹具，3、托盘，4、定位 块，5、气缸，6、限位块，7、压板，8、隔热层，9、加热板，10、压机气缸，11、推动机构，12、夹头，13、支撑架，13.1、转动孔，13.2、销孔，14、支撑座，15、转轴，16、导向槽，17、导向凸起。
具体实施方式
下面结合附图和具体实施方式对本发明作进一步详细的说明：
如图1-3所示：本发明提出一种晶圆真空键合机，它包括箱体1，所述箱体1内设有真空发生器，所述箱体1上设有内部封闭的压机2，所述压机2包括设于箱体1上的夹具2.2以及设在夹具2.2上并在盖上时使内部封闭的盖子2.1，所述盖子2.1内设有压板7，所述压板7的下表面设有加热板9，所述压板7和加热板9之间设有隔热层8，所述夹具2.2内设有用于放置晶圆的托盘3，所述托盘3的下方设有加热装置，所述托盘3的周围设有多个在直径方向移动的定位块4，所述每个定位块4由设置在夹具2.2外壁上的气缸5带动，所述每个定位块4的头部还设有支架4.1。
所述压机2具有内部封闭的腔室，腔室与真空发生器连接，真空发生器可对腔室内抽真空，压机2的上盖的外侧设有压机气缸10，压机气缸10的输出轴与与压机2的压板连接，带动压板上下移动，所述盖子2.1通过两个气缸连接在夹具2.2上，在盖子2.1盖在夹具2.2上时，构成了压机2内部的封闭空间，本实施例中托盘3为圆形，托盘3的下方设有加热装置可对托盘3进行加热，在压板7向下压紧晶圆之后，压板7上的加热板和托盘3同时对晶圆进行加热。所述定位块4由设在夹具2.2外壁上的气缸5带动，沿着托盘3的直径方向上，可朝向托盘或者远离托盘的方向移动，通过设定气缸5的行程使定位块4在前进后能够与晶圆的边相抵，从而对晶圆的位置进行定位。采用三个定位块就可以实现圆形晶圆的定位。定位块的头部设有支架，支架4.1设在定位块的上端的位置，支架下方的定位块与晶圆相抵，支架与晶圆之间设有距离。本实施例中支架4.1为连接在定位块4头部的金属丝向外弯曲制成。本实施例中金属丝弯曲成弧形，由于晶圆在键合时有键合胶的存在，因此为保持键合的效果，定位块4在使用的过程中需要定时进行清洗，本实施例中通过压板使金属丝压在定位块4上，清洗时拆除比较方便。当然所述定位块也可以为4个、5个或者更多，但其仍在本申请保护范围之内。
所述夹具内还设有垂直于夹具底部的多个等高的限位块。在晶圆键合的过程中，键合胶的厚度需要控制，也就是说两块晶圆在键合后，两者之间的距离需要在设定范围之内，采用这种结构，压板压合时，抵到限位块就停止压合，使两块晶圆之间的距离得到确定。对于不同要求的晶圆键合，只需要更换不同高度的限位块即可。在图1所示的实施例中，所述限位块6设在托盘的外侧，为柱状。在图5所示的实施例中，所述限位块，设在托盘的上表面的外周，为片状，上述两个实施例的限位块虽为不同形状，但都是限位块，其目的都是为了控制键合胶的厚度。
如图4、图5所示，所述箱体1上至少设有一个由推动机构11带动的“C”形夹头12，当盖子2.1盖在夹具2.2上时，所述夹头12在向内推动能够夹住夹具2.2和盖子2.1的边缘，使夹具2.2和盖子2.1夹紧。所述推动机构在本实施例中为气缸，也可以为由电机带动的直线运动机构，或者其它直线运动机构。
所述盖子2.1通过一支撑架13连接在箱体1上，所述箱体1上设有一支撑座14，所述支撑架13的一端与支撑座14铰接，支撑架13的另一端与盖子2.1的外侧的中部铰接使盖子2.1可以相对于支撑架13转动。所述支撑架13上设有转动孔13.1和销孔13.2，盖子2.1通过一转轴穿过转动孔13.1与支撑架13连接并可相对于支撑架13转动，盖子2.1通过一销子穿过销孔13.2与支撑架13连接。当销子插着时，盖子不会相对于支撑架转动，当销子拔掉时，盖子可以相对于支撑架转动。
所述转动孔13.1为腰型孔，所述转轴在腰型孔中可左右移动，所述夹具2.2上设有导向槽16，所述盖子2.1上设有与该导向槽16配合的导向凸起17，所述盖子2.1盖在夹具2.2上时，导向凸起17嵌入导向槽16内。如图6所示，盖子的下端面上设有导向凸起，夹具的上端面的外侧设有导向槽，导向凸起向下进入导向槽时，可以保证盖子和夹具的中心线对齐。保证压机向下运动时，上、下两块晶圆的对合精度。
本发明还提供一种晶圆键合方法，它包括以下步骤：
S1、将上面涂键合胶的第一块晶圆放到托盘上；
S2、通过气缸控制多个定位块向托盘方向前进，将第一块晶圆定位；
S3、在定位块支架上放置第二块晶圆，然后盖上盖子封闭压机，并抽真空；
S4，当真空度到达设定值时，控制多个定位块后退，第二块晶圆从定位块支架上降落到第一块晶圆上面；
S5，通过气缸控制多个定位块再次向托盘方向前进，对两块晶圆进行定位；
S6、通过压机控制压板向下，使第一块晶圆和第二块晶圆压合，维持t分钟；
S7、控制多个定位块再次后退，然后控制加热板和加热装置进行加热使键合胶固化；
S8、键合完成后，打开压机，将键合后的晶圆取出。
所述步骤S4中，真空度的设定值为：5～15帕，所述步骤S6中压合的时间t为2～10分钟，所述步骤S7中加热温度为：200～300度，时间为5～15分钟。
实施例：本实施例中采用两片厚度在0.3mm以上，直径为200mm的晶圆，其键合步骤如下：
S1、将上面涂键合胶的第一块晶圆放到托盘上；
S2、通过气缸控制多个定位块向托盘方向前进，将第一块晶圆定位在中心位置；
S3、在定位块支架上放置第二块晶圆，然后盖上盖子封闭压机，并抽真空；
S4，当真空度到达10帕时，控制多个定位块后退，第二块晶圆从定位块支架上降落到第一块晶圆上面；
S5，通过气缸控制多个定位块再次向托盘方向前进，对两块晶圆进行定位将两块晶圆的边缘处完全重合；
S6、通过压机控制压板向下，使第一块晶圆和第二块晶圆压合，维持15分钟；
S7、通过控制多个定位块再次后退，然后控制加热板和加热装置进行加热使键合胶固化，加热温度为300度，加热时间为10分钟；
S8、键合完成后，打开压机，将键合后的晶圆取出。

Claims (10)

  1. 一种晶圆真空键合机，其特征在于：它包括箱体(1)，所述箱体(1)内设有真空发生器，所述箱体(1)上设有内部封闭的压机(2)，所述压机(2)包括设于箱体(1)上的夹具(2.2)以及设在夹具(2.2)上并在盖上时使内部封闭的盖子(2.1)，所述盖子(2.1)内设有压板(7)，所述压板(7)的下表面设有加热板(9)，所述压板(7)和加热板(9)之间设有隔热层(8)，所述夹具(2.2)内设有用于放置晶圆的托盘(3)，所述托盘(3)的下方设有加热装置，所述托盘(3)的周围设有多个在直径方向移动的定位块(4)，所述每个定位块(4)由设置在夹具(2.2)外壁上的气缸(5)带动，所述每个定位块(4)的头部还设有支架(4.1)。
  2. 根据权利要求1所述的晶圆真空键合机，其特征在于：所述支架(4.1)为连接在定位块(4)头部的金属丝向外弯曲制成。
  3. 根据权利要求1所述的晶圆真空键合机，其特征在于：所述夹具(2.2)内还设有垂直于夹具(2.2)底部的多个等高的限位块(6)。
  4. 根据权利要求1所述的晶圆真空键合机，其特征在于：所述定位块(4)有三个，所述三个定位块(4)在托盘(3)周围均匀布置。
  5. 根据权利要求1所述的晶圆真空键合机，其特征在于：所述箱体(1)上至少设有一个由推动机构(11)带动的“C”形夹头(12)，当盖子(2.1)盖在夹具(2.2)上时，所述夹头(12)在向内推动能够夹住夹具(2.2)和盖子(2.1)的边缘，使夹具(2.2)和盖子(2.1)夹紧。
  6. 根据权利要求1所述的晶圆真空键合机，其特征在于：所述盖子(2.1)通过一支撑架(13)连接在箱体(1)上，所述箱体(1)上设有一支撑座(14)，所述支撑架(13)的一端与支撑座(14)铰接，支撑架(13)的另一端与盖子(2.1)的外侧的中部铰接使盖子(2.1)可以相对于支撑架(13)转动。
  7. 根据权利要求6所述的晶圆真空键合机，其特征在于：所述盖子(2.1)与支撑架(13)铰接是指，所述支撑架(13)上设有转动孔(13.1)和销孔(13.2)，盖子(2.1)通过一转轴(15)穿过转动孔(13.1)与支撑架(13)连接并可相对于支撑架(13)转动，盖子(2.1)通过一销子穿过销孔(13.2)与支撑架(13)连接。
  8. 根据权利要求6所述的晶圆真空键合机，其特征在于：所述转动孔(13.1)为腰型孔，所述转轴(15)在腰型孔中可左右移动，所述夹具(2.2)上设有导向槽(16)，所述盖子(2.1)上设有与该导向槽(16)配合的导向凸起(17)，所述盖子(2.1)盖在夹具(2.2)上时，导向凸起(17)嵌入导向槽(16)内。
  9. 一种晶圆键合方法，其特征在于：它包括以下步骤：
    S1、将上面涂键合胶的第一块晶圆放到托盘上；
    S2、通过气缸控制多个定位块向托盘方向前进，将第一块晶圆定位；
    S3、在定位块支架上放置第二块晶圆，然后盖上盖子封闭压机，并抽真空；
    S4，当真空度到达设定值时，控制多个定位块后退，第二块晶圆从定位块支架上降落到第一块晶圆上面；
    S5，通过气缸控制多个定位块再次向托盘方向前进，对两块晶圆进行定位；
    S6、通过压机控制压板向下，使第一块晶圆和第二块晶圆压合，维持t分钟；
    S7、控制多个定位块再次后退，然后控制加热板和加热装置进行加热使键合胶固化；
    S8、键合完成后，打开压机，将键合后的晶圆取出。
  10. 根据权利要求9所述的晶圆键合方法，其特征在于：所述步骤S4中，真空度的设定值为：5～15帕，所述步骤S6中压合的时间t为2～10分钟，所述步骤S7中加热温度为：200～300度，时间为5～15分钟。
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