WO2009091068A1 - 太陽電池モジュールおよびその製造方法 - Google Patents
太陽電池モジュールおよびその製造方法 Download PDFInfo
- Publication number
- WO2009091068A1 WO2009091068A1 PCT/JP2009/050787 JP2009050787W WO2009091068A1 WO 2009091068 A1 WO2009091068 A1 WO 2009091068A1 JP 2009050787 W JP2009050787 W JP 2009050787W WO 2009091068 A1 WO2009091068 A1 WO 2009091068A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- filler
- solar cell
- substrate
- cell module
- silicone
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 37
- 238000000034 method Methods 0.000 title claims description 26
- 239000000758 substrate Substances 0.000 claims abstract description 177
- 239000011521 glass Substances 0.000 claims abstract description 49
- 239000007788 liquid Substances 0.000 claims abstract description 40
- 239000000565 sealant Substances 0.000 claims abstract description 30
- 238000006243 chemical reaction Methods 0.000 claims abstract description 27
- 238000004132 cross linking Methods 0.000 claims abstract description 27
- 239000000853 adhesive Substances 0.000 claims description 114
- 230000001070 adhesive effect Effects 0.000 claims description 114
- 239000000945 filler Substances 0.000 claims description 74
- 229920005989 resin Polymers 0.000 claims description 68
- 239000011347 resin Substances 0.000 claims description 68
- 229920001296 polysiloxane Polymers 0.000 claims description 51
- 239000013078 crystal Substances 0.000 claims description 49
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 claims description 44
- 238000007789 sealing Methods 0.000 claims description 44
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 42
- 239000010409 thin film Substances 0.000 claims description 40
- 229920002050 silicone resin Polymers 0.000 claims description 38
- 239000000126 substance Substances 0.000 claims description 38
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 230000002093 peripheral effect Effects 0.000 claims description 25
- 239000011344 liquid material Substances 0.000 claims description 23
- 238000003475 lamination Methods 0.000 claims description 20
- 238000006757 chemical reactions by type Methods 0.000 claims description 19
- 230000001681 protective effect Effects 0.000 claims description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 6
- 239000011737 fluorine Substances 0.000 claims description 6
- 229910052731 fluorine Inorganic materials 0.000 claims description 6
- 238000009824 pressure lamination Methods 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 12
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- 239000000499 gel Substances 0.000 description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 16
- 239000012530 fluid Substances 0.000 description 9
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 8
- 239000006096 absorbing agent Substances 0.000 description 7
- 239000005357 flat glass Substances 0.000 description 7
- 125000006850 spacer group Chemical group 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
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- 230000008859 change Effects 0.000 description 4
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- 239000010703 silicon Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000004800 polyvinyl chloride Substances 0.000 description 3
- 229920000915 polyvinyl chloride Polymers 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000010408 film Substances 0.000 description 2
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- 239000012943 hotmelt Substances 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 230000007774 longterm Effects 0.000 description 2
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- 239000000049 pigment Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920003216 poly(methylphenylsiloxane) Polymers 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
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- 239000007858 starting material Substances 0.000 description 2
- 239000005341 toughened glass Substances 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
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- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000008366 benzophenones Chemical class 0.000 description 1
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- 230000005540 biological transmission Effects 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
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- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- QHSJIZLJUFMIFP-UHFFFAOYSA-N ethene;1,1,2,2-tetrafluoroethene Chemical group C=C.FC(F)=C(F)F QHSJIZLJUFMIFP-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
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- 229910010272 inorganic material Inorganic materials 0.000 description 1
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- 238000007689 inspection Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- BKIMMITUMNQMOS-UHFFFAOYSA-N nonane Chemical compound CCCCCCCCC BKIMMITUMNQMOS-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
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- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- 230000002087 whitening effect Effects 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
- B32B17/10005—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing
- B32B17/1055—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer
- B32B17/10798—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin laminated safety glass or glazing characterized by the resin layer, i.e. interlayer containing silicone
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02002—Arrangements for conducting electric current to or from the device in operations
- H01L31/02005—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier
- H01L31/02008—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules
- H01L31/02013—Arrangements for conducting electric current to or from the device in operations for device characterised by at least one potential jump barrier or surface barrier for solar cells or solar cell modules comprising output lead wires elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module in which a solar cell element (photoelectric conversion element) is laminated between a transparent substrate, a back surface protection substrate, and a substrate via a filler.
- a solar cell element photoelectric conversion element
- solar cells are desired to have high conversion efficiency, high durability, and low cost.
- This conversion efficiency depends on the element characteristics of the solar cell, but its practical performance largely depends on the durability of the solar cell module.
- solar cell module that can be used semipermanently while maintaining the initial high conversion efficiency.
- Solar cell elements such as plate-like crystal elements, spherical crystal elements, and thin-film elements are basically stable members made of inorganic materials, although their characteristics change slightly due to solar radiation. Therefore, the present inventors paid attention to the durability of the material used for modularizing the element.
- EVA ethylene / vinyl acetate copolymer
- the cut EVA sheet is placed between the substrates together with the elements, heated and melted under vacuum, and then pressure-adhered, followed by additional heat treatment to cause a crosslinking reaction.
- problems have been pointed out, such as delays in production rate due to heat treatment under vacuum, generation of corrosive gas during heat treatment, removal of resin protruding from the edge, and moisture-proof treatment at the edge.
- Solar power generation CMC, Inc.
- the potting method is a technique in which a silicone-based liquid substance is poured into a concave box, gelled, and encapsulates a plate crystal element.
- a method of removing the protruding gel by laminating plate crystal elements between small substrates via a silicon-based liquid substance and then gelling them.
- the solar cell element is fixed to a glass substrate, a gap and an injection hole are provided, the opposite substrate is fixed with a double-sided adhesive tape, and then an acrylic liquid material is poured from the injection hole. Residues, lead wire lead-out, long-term durability, etc. are problems.
- Patent Document 1 Japanese Patent Laid-Open No. 2 0 0 3-1 0 1 0 5 8) proposes a module containing a liquid substance in a bag shape for easy recycling.
- the enveloping structure is taken and the substrate material is hermetically sealed by thermocompression bonding without any sealant.
- such sealing does not provide sufficient contact with the lead wire, which easily causes liquid leakage, resulting in durability problems.
- the liquid material wraps around during thermocompression bonding, and it is difficult to manufacture a module without generating bubbles.
- Patent Document 2 Japanese Patent Laid-Open No. 2 0 0 5-1 0 1 0 3 proposes to enclose a liquid substance as a filler between plastic substrates, with the goal of preventing breakage of the connector in the evening. .
- a liquid substance as a filler between plastic substrates, with the goal of preventing breakage of the connector in the evening.
- the sealing of the outermost part which is the most important for durability, no specific study has been made just by touching on the use of welding (thermocompression bonding) and adhesives.
- no consideration has been given to the method of laminating without bubbles and the treatment of lead wire lead-out portions, which are essential issues when using liquid substances as fillers.
- fluid paraffin, silicone oil, etc. as fillers
- Patent Document 3 Japanese Patent Laid-Open No. 8-8 8 3 8 8
- a solid film such as EVA
- thermocompression bonding a manufacturing method thereof.
- a two-step complex process is used here, in which the filler and sealant are separately thermocompressed, and it is difficult to stack without bubbles using the simple thermocompression method of the outer periphery used here.
- Patent Documents 1, 2, and 3 are basically different from the present invention in which ultra-high durability is a problem because a plastic plate is used as a substrate.
- it can be said that it is difficult to stack the filler in a bubble-free state, which is essential for electrical components.
- EVA electroactive polymer with ester bonds (hydrophilic functional groups), and has been improved by the addition of UV absorbers and antioxidants, but it has a long period of about 20 years.
- resin degradation such as peeling, whitening, and yellowing occurs, resulting in a decrease in solar light transmittance and a decrease in power generation efficiency year by year.
- thin film elements are mainly formed directly on a glass substrate, but they are easily affected by moisture, and the use of EVA as a filler is regarded as a problem.
- Polyvinyl petitals are also being studied, but there are concerns about durability issues as with EVA. Disclosure of the invention
- the present inventor again recognizes that the solar cell module is used under severe conditions in which it is exposed to sunlight for an extremely long time in an outdoor environment.
- the study was conducted on the assumption that it would be used.
- a liquid material was used as a filler or its starting material, and a method of high-speed lamination at room temperature was found, and an innovative solar cell module that could be used semipermanently and a manufacturing method thereof were completed. Is.
- an object of the present invention is to provide an ultra-durable solar cell module that can be used semi-permanently outdoors while maintaining the high conversion efficiency important for solar cells, and a method that can be manufactured at low cost. It is to provide.
- this invention consists of the following matters, for example.
- a photoelectric conversion thin film element or a crystal element is disposed between the transparent substrate and the back surface protection substrate, a filler is disposed around the element, and an outer periphery thereof is sealed with a sealant.
- a solar cell module wherein the transparent substrate is a glass substrate, the filler is a silicone-based liquid material, fluorine oil, or silicone gel, and the sealing agent is a cross-linking reaction type adhesive, Both substrates are bonded and fixed in contact with the outer periphery, and the portion of the lead wire extending from the element that penetrates the sealing agent disposed in the outer peripheral portion is brought into close contact with the sealing agent to contact between the substrates.
- a solar cell module wherein the solar cell module is fixedly attached, and the filler and the element are sealed between both substrates together with the sealant.
- the isobutylene-based resin adhesive is formed by placing the isobutylene-based resin adhesive in the vicinity of the crosslinking reaction type adhesive and then pressurizing and laminating, and further providing a layer of the isoptylene-based resin adhesive between the substrates. Manufacturing method for solar cell module.
- a solar cell module in which a photoelectric conversion crystal element is disposed between a transparent substrate and a back surface protection substrate, a filler is disposed around the element, and an outer periphery thereof is sealed with a sealant.
- the transparent substrate is a glass substrate
- the filler is a silicone gel
- the sealing agent is made of an isobutylene resin adhesive
- the both substrates are in close contact with and fixed to the outer periphery of the filler.
- a portion of the lead wire extending from the element that penetrates the sealing agent disposed on the outer peripheral portion is brought into close contact with the sealing agent to be closely fixed between the two substrates, and the filler and the element Is sealed between both substrates together with the sealing agent.
- a solar cell module in which a photoelectric conversion thin film element is disposed between a transparent substrate and a back surface protection substrate, a filler is disposed around the element, and an outer periphery thereof is sealed with a sealant.
- the transparent substrate is a glass substrate
- the filler is a silicone gel
- the sealing agent is made of an isobutylene resin adhesive
- the both substrates are in close contact with and fixed to the outer periphery of the filler.
- a portion of the lead wire extending from the element that penetrates the sealing agent disposed on the outer peripheral portion is brought into close contact with the sealing agent to be closely fixed between the two substrates, and the filler and the element Is sealed between the two substrates together with the sealing agent.
- an ultra-durable solar cell module that has high conversion efficiency and can be used semi-permanently outdoors can be provided at low cost.
- FIG. 1 is a cross-sectional view showing an example of a laminated structure and a lead wire lead-out portion in the solar cell module of the present invention.
- FIG. 2 is a cross-sectional view showing another example of the laminated structure in the solar cell module of the present invention.
- FIG. 3 is a cross-sectional view showing another example of the laminated structure in the solar cell module of the present invention.
- FIG. 4 is a cross-sectional view showing another example of the laminated structure in the solar cell module of the present invention.
- FIG. 5 is a cross-sectional view showing another example of the laminated structure in the solar cell module of the present invention.
- FIG. 6 is a cross-sectional view showing another example of the laminated structure in the solar cell module of the present invention.
- FIG. 7 is a cross-sectional view showing another example of the lead wire lead-out portion in the solar cell module of the present invention.
- FIG. 8 is a cross-sectional view showing another example of the lead wire lead-out portion in the solar cell module of the present invention.
- BEST MODE FOR CARRYING OUT THE INVENTION the present inventor has realized that it is essential that at least the transparent substrate, the solar cell element, and the filler are made of a material that can be used semipermanently. . If the transparent substrate is a glass substrate, it is stable.
- the solar cell element of the present invention is an inorganic substance such as a plate-like crystal element or a thin film element, and can basically be used for a long period of time although there are some differences inherent to the element.
- the present inventor has obtained a highly durable liquid substance (for example, silicone oil, silicone gel) with a robust sealing structure (for example, silicone resin adhesive).
- a method for sealing between substrates without bubbles and have completed a super-durable solar cell module.
- a glass substrate as the back surface protection substrate, we were able to obtain an innovative solar cell module with even higher durability. Providing such an ultra-durable solar cell module is extremely important in terms of energy recovery, resource saving, and economic efficiency.
- Crystal elements such as single crystal silicon elements and polycrystalline silicon elements (plate crystal elements, spherical crystal elements), amorphous silicon thin film elements, microcrystalline silicon thin film elements
- a thin film element in which an element is formed on a substrate such as a CIGS-based thin film element, and an eight-iblet type element in which a thin film element is laminated on the surface of a plate-like crystal element, which can be widely used in the present invention. it can.
- the plate crystal element and the thin film element will be described in detail, but the present invention includes a spherical crystal element.
- the present invention can solve all of the above-mentioned problems that have been regarded as improvements of the conventional EVA method.
- the present invention has been successful for the first time in the construction of a robust sealing structure that reliably prevents leakage of liquid substances, including the most difficult lead wire extraction site.
- a robust sealing structure that reliably prevents leakage of liquid substances, including the most difficult lead wire extraction site.
- Durable module was obtained.
- application of the sealant and filler is a simple application process, and it can easily cope with various sizes and shapes (eg, rectangle, triangle, trapezoid, circle, etc.) from small to very large.
- a sealing agent is placed on the outer periphery of the glass substrate, a plate-like crystal element (thin film element is already formed on the glass substrate surface) is placed, and it is also sealed on the upper side of the lead wire lead-out part Add the agent, drop the liquid material that will be the filler, place the spacer if necessary, and stack the back protective substrate to form a temporary laminate, and vacuum deaerate this temporary laminate with a vacuum laminator. Then, the laminate is made by press-contacting at room temperature.
- the main point of this method is that when pressurized under room temperature vacuum, the high-viscosity sealant is crushed while holding the position of the outer periphery where it is placed, and is in close contact between both substrates, at the same time a liquid substance It also functions as a bank to prevent liquid leakage. as a result,
- silicone oil will be described as a representative example of the liquid material, but the present invention is not limited to this.
- Silicone oil is fluid in a wide range of 70 ° C to 300 ° C and meets the requirements of transparency, heat resistance, cold resistance, water resistance, insulation and weather resistance.
- a non-fluid material such as a gel may be obtained by reacting a silicone-based liquid substance after lamination.
- gel in the present invention means a filler obtained by reacting a liquid substance after laminating into a non-fluid (eg, gel, elastomer, etc.).
- Sealing agents are required to have a bank function that prevents liquid substances from leaking during lamination and an adhesive function that stably fixes both substrates.
- one type of sealant has both functions and two types of sealant have different functions. There is a way to separate and hold.
- the liquid substance is cross-linked to form a gel after lamination, only the sealant having a bank function may be used. The reason is that the liquid substance becomes a non-fluid and does not leak.
- high durability is required especially for the bonding function.
- high-viscosity silicone resin adhesive crosslinking reaction type adhesive
- ultra-high viscosity isobutylene resin adhesive hot melt type adhesive
- solar cell elements include plate-like crystal elements and thin film elements, and the thicknesses of these elements differ greatly.
- a module comprising an element (plate crystal element and thin film element), a filler (silicone oil and silicone gel), a sealant (silicone resin adhesive and isobutylene resin adhesive), etc. The structure of is described.
- a glass substrate As the back surface protection substrate.
- a resin sheet, a resin plate, or the like can be used.
- the illustration of the spacer is omitted.
- FIG. 1 is a diagram showing a cross-sectional structure of a module in which thin film elements 8 formed on one surface of a glass substrate 3 are stacked. Silicone oil as the filler 5 is sealed by the silicone resin adhesive of the first seal 6 provided between the glass substrate 3 and the back protective substrate 4.
- the lead wire 10 is connected and drawn out at a joint portion 9 made of a thin film element 8 and a conductive bonding agent (for example, solder, silver paste, etc.).
- a silicon-based resin adhesive of the first seal 6 is also disposed on both the upper and lower surfaces of the lead wire 10 lead portion, and the glass substrate 3, the back surface protection substrate 4, and the lead wire 10 are bonded and fixed.
- silicone-based resin adhesive may be disposed and laminated so as to sufficiently cover the joint 9.
- the board spacing of this joint is the lead Line 10 makes it bulky.
- the thin film element 8 is disposed away from the outer peripheral region as shown in the figure so that the sealant can adhere and adhere well to the glass substrate 3. Further, after laminating, the liquid substance may react to change into a silicone gel.
- silicone resin adhesives have high weather resistance.
- a module in which the back surface protection substrate 4 is also a glass substrate can be used for windows, windows, atriums, etc. with high durability and design like conventional window glass. In addition, if a glass layer is added to provide a gas layer, it becomes a window glass with added heat insulation.
- FIG. 2 is a diagram showing a cross-sectional structure of a module in which thin film elements 8 are stacked.
- the thin film element 8 is easily affected by moisture, and the silicone resin adhesive of the first seal 6 may transmit water molecules. Therefore, providing the isobutylene resin adhesive layer of the second sealing 7 has a very low moisture permeability, which is advantageous for use in high-temperature and high-humidity areas.
- the first seal 6 may be placed outside or on both sides of the second seal 7, and may have a two-stage, four-layer seal structure. .
- both boards are made of glass, it will be extremely durable, and it can be used without an aluminum frame on the module, so it will be low cost, and will be excellent in preventing lightning strikes and garbage collection. This is particularly useful for large-scale solar power plants in the wilderness.
- FIG. 3 is a diagram showing a cross-sectional structure of a module in which the plate crystal elements 1 are stacked.
- the plate-like crystal element 1 is connected by the connector 2 and is filled with silicon oil (fluid) or silicone gel (non-flowing) between the glass substrate 3 which is the light receiving surface and the back surface protective substrate 4.
- the second seal 7 is an isobutylene-based resin adhesion agent that is super-highly viscous and adheres to the outer periphery to ensure a bank function that reliably prevents liquid leakage.
- it is necessary to bond and fix both boards. It is not strong and cannot hold the weight of silicone oil.
- the silicone resin adhesive of the first seal 6 disposed, it is possible to prevent liquid leakage due to the flow-down of the silicone oil, resulting in a good module.
- the liquid substance may react to change into a silicone gel after lamination.
- the isobutylene resin adhesive is moisture-proof and prevents electrode corrosion.
- FIG. 4 shows a cross-sectional structure of a module in which thin film elements 8 are stacked.
- This is a sealing structure in which the silicone resin adhesive composition of the first sealing 6 in Fig. 1 has been devised.
- Seal made of two types of silicone resin adhesives, which is a high-viscosity silicone resin adhesive with a higher viscosity of the silicone resin adhesive, placed as an additional first seal 6 'to obtain a bank function. It is.
- the positions of the first seal 6 and the additional first seal 6 ′ may be reversed. Although not particularly illustrated, this configuration can also be used for a module using the plate-like crystal element 1.
- FIG. 5 is a diagram showing a cross-sectional structure of a module in which the plate crystal elements 1 are stacked.
- the isobutylene resin adhesive in the second seal 7 adheres to the outer periphery so that it securely acts as a bank to prevent liquid leakage.
- the liquid material is reacted after lamination to react with the silicone gel (5) Non-fluid).
- a silicone resin adhesive is partially placed on the lead wire lead-out portion, and the lead wire and the board are adhered and fixed to fix the lead wire. It is possible to prevent wobble.
- FIG. 6 is a diagram showing a cross-sectional structure of a module in which thin film elements 8 are stacked.
- the second seal 7 is isobutylene resin dense.
- the filler 5 is a silicone gel.
- the lead wire 10 is fixed by being connected to the thin film element 8 and the joint 9 by solder or the like.
- Solar cell elements include a plate-like crystal element 1 and a thin film element 8.
- the plate-like crystal element 1 connected by the interconnector 2 is laminated between the glass substrate 3 and the back surface protection substrate 4 through the silicone oil of the filler 5 in a thin and air-free state.
- This module structure was made possible for the first time by the manufacturing method of the present invention in which silicone oil was sealed under vacuum.
- the board spacing of this module is thicker for the plate crystal element 1 and thinner for the thin film element 8.
- the plate crystal element 1 has a plate thickness of about 0.05 to 0.2 mm, and the thin film element 8 can be regarded as being very thin and integral with the glass substrate.
- the distance between the two substrates becomes thicker due to the connection with the interconnector 2, and the distance between the substrates may be about 0.1 mm to 3 mm, preferably 0.2 mm to 1 mm. About 5 mm, more preferably about 0.3 mm to 0.8 mm.
- it may be about 0.05 mm to 3 mm, preferably about 0.02 to 1 mm, and more preferably about 0.05 to 0.5 mm. There is no advantage of making this distance particularly thick. The thinner one is lighter and the amount of filler used is reduced, which is economical.
- the sealing width is about 2 mm to 50 mm for both the use of a silicone resin adhesive alone and the combined use of a silicone resin adhesive and an isoprene resin adhesive. It is preferably about 5 mm to 30 mm, more preferably about 8 mm to 20 mm. When isobutylene resin adhesive is used alone, it may be about 2 mm to 30 mm, preferably about 3 mm to 15 mm. More preferably, it may be about 5 mm to 1 O mm. As a matter of course, when the sealing width of the outer peripheral portion is increased, the light receiving area is reduced, which affects the amount of power generation.
- a flexible thin film element in which a thin film element is provided on a special sheet (for example, a polyimide sheet, a stainless steel sheet, etc.) It can be used for the module structure and manufacturing method as described above, and these aspects are also included in the present invention.
- a special sheet for example, a polyimide sheet, a stainless steel sheet, etc.
- the manufacturing method of the present invention will be described using the structure of FIG. 3 in which the plate crystal elements 1 are stacked as an example.
- Place a string-like isobutylene resin adhesive (which easily deforms like clay when pressed at room temperature and adheres closely to the substrate) on the outer periphery of the glass substrate 3 from the inner edge to about 3 mm inside.
- Place a two-component silicone resin adhesive (reaction-cured at room temperature to bond and fix both substrates) thinly in a line.
- silicone oil is dripped almost evenly, and the plate-like crystal element 1 connected by the interconnector 2 is placed thereon, and the isobutylene resin adhesive and silicone are also partially placed on the upper surface of the lead wire part.
- a resin adhesive is placed, and if necessary, silicone oil is dropped on the plate-like crystal element 1.
- the back protective substrate 4 is laminated to form a temporary laminate.
- This temporary laminate is put into a room temperature vacuum laminator, sufficiently degassed under reduced pressure, and lightly pressurized under vacuum (0.7 to 1. OT orr).
- the two substrates are brought into close contact with each other by the ultrahigh viscosity isobutylene resin adhesive in a short time.
- the sealant is crushed and flattened, and the low-viscosity silicone oil gradually It spreads throughout and flows into fine gaps and fills.
- the silicone resin adhesive is crushed while in contact with the isobutylene resin adhesive, and gradually crosslinks to bond and fix both substrates as shown in FIG.
- the plate crystal element 1 is sealed between the glass substrate 3 and the back surface protective substrate 4 via silicone oil. Further, as shown in FIG. 8, the upper and lower surfaces of the lead portion of the lead wire 10 are surely secured by the silicone resin adhesive of the first seal 6 and the isobutylene resin adhesive of the second seal 7. Sealed.
- a silicone resin adhesive is injected into the gap between the substrates after lamination. For example, a laminate with the outermost peripheral portion of about 5 mm is provided and the second seal 7 is provided, and then a silicone resin is injected into the gap between the substrates to cause a crosslinking reaction to form the first seal 6.
- a low-viscosity UV curable adhesive may be injected into the gap and then irradiated with light to be cured.
- this temporary laminate may be pressurized to room temperature and released to atmospheric pressure if the isobutylene resin adhesive comes into contact with and adheres to both substrates.
- the reason is that the inside becomes a vacuum state due to the sealing effect, and even if it is left under atmospheric pressure, the filler 5 naturally spreads throughout and is filled with details.
- the expensive vacuum laminating equipment can be constrained by a few minutes, resulting in high-speed production and a significant contribution to lower costs.
- Silicone oil may be placed on both the upper and lower sides of the plate-like crystal element 1 and can be soaked in even a small gap, so it may be placed only on one side of the plate-like crystal element 1, and it is necessary to be balanced on the substrate It is sufficient that the amount is arranged almost evenly.
- the filler is degassed and then dripped, or the coating amount is slightly larger than the theoretical amount necessary to fill the gap.
- the lead wire drawn from the outer periphery of the board can be easily connected to the terminal box even in large-area modules. Further, the lead wire may be drawn out from the outer peripheral portion of the hole provided by removing the inside of the back surface protection substrate 4 which is a conventional method and connected to the terminal box.
- a small module shown in Fig. 3 was fabricated and tested for durability. Both sides Prepare a polycrystalline plate-like crystal element 1 (25 x 50 x 0.15 mm, manufactured by Kyocera) with electrodes formed on a 3 1 x 2 x 0.1 mm thin copper plate. The resulting lead wire was connected with solder (4 mm). White plate glass (90 x 65 x 4 mm) is used as the glass substrate 3, and the string-like isobutylene resin adhesive (diameter 2 mm) that forms the second seal 7 about 2 mm inward from the end.
- a two-component mixed silicone resin adhesive (Toray 'Dauco) Nineteen SE 9 3 6) was applied in a thin line.
- dimethyl silicone oil viscosity: 10,000 CSZ 25 degrees
- filler 5 is applied in a line shape in the shape of a mouth on the outer periphery with a gap of about 5 mm, and in the form of small dots in the center. Two points were applied.
- a plate-like crystal element 1 with a lead wire was placed in the center of the coated substrate.
- An isobutylene resin adhesive and a silicone resin adhesive are additionally placed on the upper surface of the lead wire 10, and two small points of silicone oil are applied on the plate-like crystal element 1, and then the back surface protection substrate.
- a blue sheet glass (90 x 65 x 4 mm) to be 4 was placed to make a temporary laminate.
- the temporary laminate was put in a vacuum apparatus and degassed at room temperature (23 ° C.) for 60 seconds, and then lightly pressurized, and the isobutylene resin adhesive was brought into contact with both substrates and then released to atmospheric pressure.
- the isobutylene resin adhesive and the silicone resin adhesive were squeezed into place by atmospheric pressure, and the silicone oil gradually flowed into details.
- the lead wire 10 and both substrates were bonded and fixed with a silicone-based resin adhesive at room temperature. As a result, a bubble-free small module comprising a first seal 6 having a width of 4 mm and a second seal 7 having a width of 6 mm was obtained.
- the lead wire 10 pulled out is bent into a U shape, and the measurement terminal (4 mm) is turned on the surface of the back surface protection substrate 4, and a silicone resin adhesive is applied to the end surface of the substrate.
- the lead wires were covered with insulation, and fixed to the edge of the substrate.
- the metal halide lamp type super UV test (10 O m WZ cm 2 , Iwasaki Electric Eye Super UV Tester) was irradiated for 100 hours, temperature 85 degrees, relative humidity 85 % Of the samples were allowed to stand for 30 hours, and a temperature cycle test at 120 ° C. and 95 ° C. was conducted for a severe durability test consisting of 20 0 times.
- This sealing structure consists only of a silicone resin adhesive that becomes the first seal 6. Since the thickness of the thin film element 8 is negligibly thin, the distance between the substrates is very thin, and the bank function of the sealant is easily secured. Specifically, a silicone-based resin adhesive is arranged in a line on the outer periphery of the substrate provided with the thin film element 8 in which the lead wires are connected by solder. In addition, silicone resin adhesive is placed on the upper and lower surfaces of the lead-out part of the lead wire.
- low-viscosity silicone oil to be used as filler 5 is dripped several times in the shape of the mouth so that it is almost even over the entire surface, and then a glass bead spacer is sprayed.
- a back protective substrate 4 is stacked to form a temporary laminate.
- This temporary laminate is put into a room temperature vacuum laminator and pressurized in multiple stages under vacuum. As a result, both substrates are sealed in a short time. When this sealed laminate is released to atmospheric pressure, it is naturally pressurized at atmospheric pressure, and the silicone-based resin adhesive applied to the outer periphery is further crushed, and the silicone oil gradually and completely does not leak. Spread and filled with details. In addition, silicone tree The fat adhesive provides a robust seal by adhering and fixing both substrates as the crosslinking reaction proceeds.
- a method for manufacturing a module having the plate crystal element 1 shown in FIG. 5 will be described. Only the isobutylene resin adhesive of the second seal 7 is placed on the outer periphery as the sealant, but the other steps are the same as those of the module of FIG. However, the isoprene-based resin adhesion agent adheres to both substrates with an appropriate tackiness, but cannot fix both substrates. Therefore, it is necessary to react the liquid material of filler 5 after lamination to form a gel. This reaction may be slow and may be moderately heated to promote the reaction.
- FIG. 7 shows a cross-sectional view of the lead wire 10 drawn from the thin film element 8 in the module shown in FIG.
- the thin film element 8 and the lead wire 10 are connected by a conductive bonding agent (for example, solder, silver base, etc.) to form the joint 9.
- the isobutylene resin adhesive of the second seal 7 is in close contact with the upper and lower surfaces of the lead portion of the lead wire 10 to prevent liquid material from leaking during lamination. After lamination, a liquid substance is reacted to form a gel (non-fluid).
- the manufacturing method at room temperature has been mainly described.
- the temporary laminate is heated and sealed under vacuum, heated after the sealed lamination, and ultraviolet rays. It is also possible to use light irradiation such as.
- the glass substrate 3 can be widely used as long as it transmits light sufficiently, and examples thereof include white plate glass and blue plate glass.
- the glass substrate may be subjected to processing such as tempered glass, antireflection on the surface, template glass, and ultraviolet cut as required. In particular, in order to prevent surface reflection, processing that reduces reflection from the interface with the atmosphere and the filler is preferable.
- Conventionally used members can be widely used for the back surface protection substrate 4.
- a glass substrate for example, blue plate glass, tempered glass, template glass, etc.
- a resin sheet for example, hard polyvinyl chloride, polyester) Tell
- steel plate stainless steel plate, etc. Resin sheets are useful for reducing the weight of the module.
- the manufacturing temperature of the present invention may be room temperature, and hard polyvinyl chloride is a thin sheet of less than 0.1 to 1 mm (for example, vinyl resin foil of Mitsubishi resin). Thick plates of about 1 to 3 mm (for example, Shin-Etsu polymer panel) can be used according to the application.
- Hard polyvinyl chloride is very useful because it has good adhesion and adhesion to sealants (eg, silicone resin adhesives, isoprene resin adhesives, etc.), weather resistance, and economic efficiency. .
- Also useful are aluminum foil, polyethylene sheet with ethylene tetrafluoroethylene, etc., resin sheet with deposited silica (Techba U-LX, etc. from Mitsubishi Plastics), surface modified sheet with improved adhesion, etc.
- a thin film element since it dislikes moisture, a glass substrate, an aluminum foil lantern, a resin sheet on which silica is vapor-deposited, etc. are preferable.
- liquid material used as the filler 5 include silicone oils such as dimethyl silicone oil, methyl phenyl silicone oil, methyl octane silicone oil, alkyl-modified silicone oil, and polyester.
- silicone oils such as dimethyl silicone oil, methyl phenyl silicone oil, methyl octane silicone oil, alkyl-modified silicone oil, and polyester.
- modified silicone oils, alcohol-modified silicone oils, and fluorine oils such as fluorinated polyethers, Daikin Chemical Co., Ltd. demnam, and NOK fluids.
- Ultrafine powder silica or the like may be added to this liquid material to give thixotropy characteristics, thereby making it difficult to cause sagging and improving the coating performance.
- the processes from substrate cleaning, coating, and temporary stacking can be processed in an inclined state, and there are advantages such as reduced dust adhesion, easy coating, and easy substrate movement, especially in the production of thin-film device modules. Useful is there.
- liquid substance that is liquid at room temperature during lamination but reacts (thermal reaction or photoreaction) after lamination to become a gel
- thermo reaction or photoreaction a liquid substance that is liquid at room temperature during lamination but reacts (thermal reaction or photoreaction) after lamination to become a gel
- an ultraviolet absorber for example, benzophenone series, benzotriazole series, triazine series, etc.
- an ultraviolet absorber for example, benzophenone series, benzotriazole series, triazine series, etc.
- an ultraviolet absorber may be added to the liquid substance to improve the weather resistance. This also protects the resin sheet when used as 4.
- useful ultraviolet absorbers include SEES® RB—10 3 from Sipro Kasei Co., Ltd., TI NUV IN 3 2 8 from Ciba Specialty Chemicals, and TI NUV IN 400.
- the amount of addition may be about 0.1 to 5 W%, preferably about 0.2 to 3 W%, more preferably about 0.5 to 2 W%.
- methylphenyl silicone oil for example, SH550, SH700, SH700, manufactured by Toray Dow Co., Ltd.
- SH550, SH700, SH700, manufactured by Toray Dow Co., Ltd. makes it easy to dissolve the UV absorber due to the effect of the phenyl group.
- functional groups that have an affinity for fillers in UV absorbers for example, substances in which UV absorbers are bound to modified silicon
- those having low solubility may be uniformly dispersed as ultrafine particles.
- the sealant includes a crosslinking reaction type adhesive used for the first seal 6 and a hot melt type adhesive used for the second seal 7. These are pressurized at room temperature It is a substance that flows and deforms.
- crosslinking reaction type adhesive examples include a two-component mixed type crosslinking reaction type adhesive, a one-component type crosslinking reaction type adhesive by reaction with water molecules, and a crosslinking reaction type adhesive by ultraviolet irradiation.
- the viscosity is preferably a high-viscosity pace ridge that can be applied by extrusion and is not easily deformed by its own weight.
- a silicone resin adhesive having high weather resistance has good adhesion to a glass substrate and is very useful in the present invention, and can be used for both one-component and two-component mixtures.
- dealcohol-free silicone resin adhesive for example, SE 9 1 5 5, SE 9 1 7 5, SE 7 3 7, SE 9 5 0 0, SE 9 3 6 etc.
- Silicone resin adhesives are well known and will not be described here.
- weather resistance is inferior to that of silicone, there are sulfide, urethane, acrylic, isobutylene, acrylic urethane, epoxy, and acrylic epoxy.
- filler eg, powdered silica, ultrafine powdered silica, calcium carbonate, etc.
- antioxidant e.g., sodium citrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium tartrate, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium metabisulfite, sodium
- the viscosity of the crosslinking reaction type adhesive is preferably higher than that of the liquid material of the filler 5, preferably more than twice as high, and more preferably 10 times or more, so that it can be easily disposed at a predetermined position.
- cross-linking reaction type adhesion When forming a seal on the outer periphery only with the agent, a method of making it have a thixotropy characteristic to make it more viscous (not easily deformed by its own weight) (for example, addition of ultrafine powder silica, etc.) By reacting to increase viscosity (for example, modified silicone resin adhesive), heating to increase fluidity to facilitate application (for example, silicone reactive hot melt adhesive), etc. The viscosity can be adjusted.
- this silicone-reactive hot melt adhesive has both adhesiveness and bank function, so it is useful for the module of the plate-like crystal element 1 that is relatively resistant to moisture and has a large substrate spacing.
- the silicone resin adhesive is more chemically stable than the isobutylene resin adhesive. It is good to arrange inside like the 1st seal 6 of 3.
- silicone resin adhesives are stable and remain stable even when in contact with silicone oil, silicone gel, fluorine oil, and the like.
- Hot melt adhesives include, for example, isobutylene resins. These can be heated and continuously extruded into a string shape (cross-section: circular, semi-circular, fine circular, rectangular, etc.), and can be easily plastically deformed by room temperature pressurization without causing self-weight deformation at room temperature.
- an isobutylene resin adhesive will be described. Isobutylene resins can be used as detailed in the chapter on butyl rubber / polyisobutylene adhesives in Asakura Shoten's Adhesion Encyclopedia (H andbook of Adhesives / Third E dition from Van Nostrad Reinhold) It consists only of hydrocarbons with an isobutylene unit as the basic structure.
- This resin has a very low water vapor transmission rate due to the methyl group effect and hydrophobicity.
- it since it is an amorphous polymer, it has excellent flexibility, impact resistance, and permanent tackiness.
- the glass transition temperature is close to 160, so that it can maintain flexibility even at low temperatures below room temperature and has a high density. Shows wearing ability.
- polyisobutylene, isoprene-isoprene copolymer, etc., adhesion-imparting agent eg, epoxy resin, silane coupling agent, alkyl titanate agent, etc.
- adhesion-imparting agent eg, epoxy resin, silane coupling agent, alkyl titanate agent, etc.
- insulating filler eg, powdered silica, ultrafine, etc. Powdered silica, etc.
- antioxidants eg, UV absorbers, plasticizers, lubricants, pigments, etc.
- the isobutylene resin adhesive is very useful for preventing moisture from diffusing into the inside from the cross section of the outer periphery of the substrate.
- a sealing structure that uses a silicone resin adhesive at the same time rather than a single use, the filler is non-flowable. Even gels are preferred.
- the spacer may be used as necessary to maintain the substrate spacing, and the shape may be a bead shape, a rod shape, a planar shape, etc.
- the material part, the sealing part, etc.) may be appropriately selected.
- the arrangement of the spacers may be fixed at regular intervals, or may be randomly distributed and not fixed. Further, there is a method in which a spacer is added in advance to the filler and applied.
- the material can be widely selected from glass, ceramics, resin, rubber, metal and the like.
- the inventor in order to obtain a solar cell module that can be used semi-permanently, the inventor must at least include a transparent substrate, a solar cell element, and a filler made of an ultra-high durability material. I found out. Therefore, focusing on the use of highly durable liquid materials as fillers, we have established a manufacturing method that seals liquid materials in a bubble-free state at room temperature under vacuum. As a result, liquid substances must be sealed with a robust sealing structure. Led to a highly durable module. This high durability has an essential meaning in energy recovery, resource saving, and economic efficiency. Naturally, we were able to obtain a module that was completely free of air bubbles (a fatal defect in electrical components) and liquid leakage (defective products).
- the sealant and liquid material are applied directly to the substrate, it can be quickly applied to modules of various sizes and shapes, including ultra-large sizes, and is suitable for continuous mass production.
- it is economical and provides lightning protection because it can ensure high moisture resistance and durability without having an aluminum frame on the module. Therefore, the present invention is very useful for a photovoltaic power plant in which an ultra-large module is constructed on a large scale. Also, in urban areas, it is installed on the roof, etc. Considering the replacement cost, semi-permanent durability has significant economic significance, and expensive crystal elements can be easily removed from the substrate. Because it can be used, it has excellent recyclability.
- the internal stress can be kept small because the filler 5 is a liquid material or a flexible gel even under a large temperature difference. Therefore, even elements that are expected to be put to practical use, such as ultra-thin plate crystal elements, heterostructure elements having a high conversion rate, and multi-junction elements, are effective in preventing element damage, interface peeling, electrode peeling, etc. There are fruits. Industrial applicability
- the present invention can provide an ultra-high durability solar cell module at a low cost, and thus is extremely useful industrially.
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Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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EP09702907.8A EP2234172A4 (en) | 2008-01-15 | 2009-01-14 | Solar cell module and method for manufacturing the same |
US12/811,894 US20100275992A1 (en) | 2008-01-15 | 2009-01-14 | Solar Cell Module and Process for its Production |
JP2009550082A JP4869408B2 (ja) | 2008-01-15 | 2009-01-14 | 太陽電池モジュールおよびその製造方法 |
CN2009801063630A CN101960614B (zh) | 2008-01-15 | 2009-01-14 | 太阳能电池模块及其制造方法 |
US13/783,064 US20130178009A1 (en) | 2008-01-15 | 2013-03-01 | Solar cell module and process for its production |
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JP2008163801 | 2008-05-28 | ||
JP2008-163801 | 2008-05-28 | ||
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JP2008-298746 | 2008-10-28 |
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PCT/JP2009/050787 WO2009091068A1 (ja) | 2008-01-15 | 2009-01-14 | 太陽電池モジュールおよびその製造方法 |
Country Status (5)
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US (2) | US20100275992A1 (ja) |
EP (1) | EP2234172A4 (ja) |
JP (2) | JP4869408B2 (ja) |
CN (1) | CN101960614B (ja) |
WO (1) | WO2009091068A1 (ja) |
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Also Published As
Publication number | Publication date |
---|---|
JP2011254116A (ja) | 2011-12-15 |
US20100275992A1 (en) | 2010-11-04 |
EP2234172A4 (en) | 2017-01-04 |
US20130178009A1 (en) | 2013-07-11 |
JPWO2009091068A1 (ja) | 2011-05-26 |
JP4869408B2 (ja) | 2012-02-08 |
EP2234172A1 (en) | 2010-09-29 |
CN101960614A (zh) | 2011-01-26 |
CN101960614B (zh) | 2012-07-18 |
JP5411225B2 (ja) | 2014-02-12 |
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