[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

WO2008069821A1 - Metal aminotroponiminates, bis-oxazolinates and guanidinates - Google Patents

Metal aminotroponiminates, bis-oxazolinates and guanidinates Download PDF

Info

Publication number
WO2008069821A1
WO2008069821A1 PCT/US2006/062713 US2006062713W WO2008069821A1 WO 2008069821 A1 WO2008069821 A1 WO 2008069821A1 US 2006062713 W US2006062713 W US 2006062713W WO 2008069821 A1 WO2008069821 A1 WO 2008069821A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
formula
another
different
same
Prior art date
Application number
PCT/US2006/062713
Other languages
French (fr)
Inventor
Tom Cameron
Chongying Xu
Tianniu Chen
Matthias Stender
Original Assignee
Advanced Technology Materials, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Technology Materials, Inc. filed Critical Advanced Technology Materials, Inc.
Priority to US12/517,901 priority Critical patent/US20110060165A1/en
Publication of WO2008069821A1 publication Critical patent/WO2008069821A1/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07FACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F17/00Metallocenes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C279/00Derivatives of guanidine, i.e. compounds containing the group, the singly-bound nitrogen atoms not being part of nitro or nitroso groups
    • C07C279/02Guanidine; Salts, complexes or addition compounds thereof
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • C23C16/409Oxides of the type ABO3 with A representing alkali, alkaline earth metal or lead and B representing a refractory metal, nickel, scandium or a lanthanide

Definitions

  • the invention relates generally to metal source precursors and their synthesis.
  • the invention relates to strontium, barium and other metal aminotroponiminates, strontium, barium and other bis-oxazolinates, strontium and barium guanidinates, as well as metal guanidinates including metals other than strontium and barium, and methods of making and using these compositions.
  • the invention in another aspect relates to ligand precursors of the inventive metal source precursors.
  • the invention also relates to mixed ligand copper complexes suitable for chemical vapor deposition, atomic layer deposition and rapid vapor deposition applications.
  • the invention relates to methods of depositing metal layers on a substrate utilizing the precursors of the invention and substrates generated thereby.
  • Chemical vapor deposition is a chemical process that involves a series of chemical reactions to produce a thin layer of solid material on a substrate surface. The process is widely used to fabricate microelectronic devices and products.
  • a substrate is exposed to one or more precursors.
  • the precursors react with the substrate surface to produce a deposit of solid material on such surface.
  • CVD is well-suited to provide uniform coverage of the deposited material on the substrate.
  • Atomic layer deposition is a modified CVD process involving a sequential step technique that results in a coating of multiple layers on the substrate.
  • ALD is carried out utilizing two complementary precursors that are alternately introduced to the reaction chamber. The first precursor is delivered in excess into the deposition chamber. The precursor will react with the substrate to form a monolayer of reacted precursor on the surface.
  • the deposition chamber is purged or evacuated with a carrier gas to remove unreacted precursor followed by the delivery of a reactant (a second precursor) to the deposition chamber for reaction with the monolayer of reacted precursor, to form the desired material. This cycle is repeated until an appropriate thickness of material is achieved.
  • ALD provides uniform step coverage and a high level of control over film thicknesses.
  • sequential precursor pulses are used to form a film, layer by layer.
  • a first precursor may be introduced to form a gas monolayer on a substrate, followed by introduction of a second precursor to react with the gas monolayer to form a first solid monolayer of the film.
  • Each cycle including first and second precursor pulses therefore forms one solid monolayer.
  • the process then is repeated to form successive layers until a film of desired thickness is obtained.
  • RVD rapid vapor deposition
  • ALD advanced vapor deposition
  • the substrate is sequentially exposed to precursors in gaseous form.
  • RVD the process is repeated until a substrate coated with multiple layers reaches a desired thickness.
  • the resulting coated substrate is of high coafo ⁇ nality.
  • RVD differs from ALD in that the layers in RVD can be deposited more quickly.
  • Liquid precursors and/or solid precursors dissolved in suitable solvents enable the direct injection and/or liquid delivery of precursors into a CVD, ALD or RVD vaporizer unit.
  • the accurate and precise delivery rate can be obtained through volumetric metering to achieve reproducibility during CVD, ALD or RVD metallization of a VLSI device.
  • Solid precursor delivery via specially-designed devices such as ATMI' s ProE Vap® precursor storage and dispensing package or liquid precursor delivery via specially-designed devices, such as ATMFs NOWTrak® precursor storage and dispensing package (both from ATMI, Inc., Danbury, Connecticut, USA) enables highly efficient transport of solid precursors to a CVD, ALD or RVD reactor.
  • the present invention relates to metal source precursors for use in CVD, ALD and RVD processes and methods of making the same, as well as to a method of depositing a metal layer on a substrate using such precursors and to substrate structures, e.g., microelectronic device structures, having such layers deposited thereon.
  • the invention also relates to ligand precursors useful in making metal source precursors for CVD, ALD and RVD processes.
  • the invention relates to a ligand precursor selected from the group consisting of compounds of formulas:
  • Rjand R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C 5 alkyls, C O -C I0 aryls and C 3 -Ce cycloalkyls;
  • Riand R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, Ce-Q 0 aryls and C 3 -C6 cycloalkyls;
  • Rjand R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -C 10 aryls and C 3 -C 6 cycloalkyls;
  • R 1 and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, C 6 -C 10 aryls and C 3 -C 6 cycloalkyls;
  • R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, C 6 -C 10 aryls and C 3 -C 6 cycloalkyls;
  • Rj, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -Ci 0 aryls and C 3 -C 6 cycloalkyls; and
  • R' may be the same or different from one another and may be methyl or zPr.
  • the invention relates to a metal source precursor selected from the group consisting of compounds of the formulas:
  • R : and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C 5 alkyls, C 6 -Ci 0 aryls and C 3 -C 6 cycloalkyls;
  • M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M.
  • the metal deposited is selected from the group consisting of Ba and Sr;
  • each of the R ⁇ and R 2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C ⁇ -Cio aryls and C 3 -C O cycloalkyls;
  • M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x and x is 1 to 8, dependent on the oxidation state of M.
  • the metal deposited is selected from the group consisting of Ba and Sr;
  • R R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, Ce-Q 0 aryls and C 3 -C O cycloalkyls;
  • M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M.
  • the metal deposited is selected from the group consisting of Ba and Sr;
  • R' may be the same or different from one another and may be methyl or /Pr;
  • R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl;
  • Cp* is pentamethylcyclopentadienyl.
  • the invention relates to various methods of making the above metal source precursors.
  • the invention relates to a method of depositing a metal layer on a substrate comprising deposit of the metal on the substrate surface by ALD or RVD, wherein at least one precursor is selected from the metal source precursors of the invention.
  • the metal deposited is selected from the group comprising Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
  • the one or more layers comprise strontium and/or barium.
  • the ALD is performed at a temperature of less than or equal to 300 degrees Celsius.
  • delivery of the at least one precursor is by solution delivery.
  • delivery of the at least one precursor is by dispensing from a ProE Vap® precursor storage and dispensing package.
  • delivery of the at least one precursor involves dispensing from a NOWTrak® precursor storage and dispensing package.
  • the invention relates to a substrate coated with one or more film monolayers of one or more metals.
  • the substrate of the invention is coated by chemical vapor deposition, atomic layer deposition and/or rapid vapor deposition and the deposition method utilizes one or more metal source precursors of the invention.
  • the one or more layers comprise Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and/or Te.
  • the one or more layers comprise strontium and/or barium.
  • the invention relates to a ligand precursor selected from the group consisting of compounds of the formulas:
  • R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -Cs alkyls, C 6 -C 10 aryls and C 3 -C 6 cycloalkyls; and M is selected from the group consisting of Na and K; and
  • R 1 N C(NR 2 R 3 )NR 4 H [0030] where Ri, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -Cs alkyls, Ce-Q 0 aryls and C 3 -C O cycloalkyls.
  • a further aspect of the invention relates to a metal source precursor of the formula wherein Ri, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C 5 alkyls, C 6 -C] 0 aryls and C 3 -C 6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M.
  • the metal deposited is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
  • the ALD is performed at a temperature of less than or equal to 300 degrees Celsius.
  • delivery of the at least one precursor is by solution delivery.
  • delivery of the at least one precursor is by dispensing from a ProE Vap® precursor storage and dispensing package.
  • delivery of the at least one precursor involves dispensing from a NOWTrak® precursor storage and dispensing package.
  • the invention relates to a substrate coated with one or more film monolayers of one or more metals.
  • the substrate of the invention is coated by chemical vapor deposition, atomic layer deposition and/or rapid vapor deposition and the deposition method utilizes one or more metal source precursors of the invention.
  • metal source precursors of the formula M[RiN C(NR 2 R 3 )
  • the invention in another aspect relates to a precursor storage and delivery apparatus comprising a vessel containing a metal source precursor of the invention.
  • a further aspect of the invention relates to a vapor of a metal source precursor of the invention.
  • a still further aspect of the invention relates to a method of making a microelectronic device product, comprising contacting a microelectronic device substrate with a metal source precursor of the invention, to deposit said metal on the substrate.
  • Yet another aspect relates to a mixed ligand barium and strontium complexes suitable for use in CVD, ALD and RVD applications.
  • Such mixed ligand copper complexes have the general formula:
  • M barium or strontium
  • X and Y are each monoanionic and selected from the parent ligands (A)-(H) below, with the proviso that X and Y are different from one another:
  • Z is (CH 2 ) 2 or SiMe 2 ; and R 1 , R 2 and R 3 are the same as or different from, one another, and each is independently selected from among C 1 -C 5 alkyl, C ⁇ -Cio aryl, and C 3 -C 6 cycloalkyl;
  • Ri, R 2 are the same as or different from one another and each is independently selected from among H, Ci-C 5 alkyl, Ce-Qo aryl, and C 3 -C 6 cycloalkyl;
  • Ri, R 2 are the same as or different from one another and each is independently selected from among H, Ci-C 5 alkyl, C 6 -Ci 0 aryl. and C 3 -C 6 cycloalkyl;
  • Ri, R 2 , R3 are the same as or different from one another and are independently selected from among H, Q-C5 alkyl, C 6 -Ci 0 aryl, and C 3 -C 6 cycloalkyl;
  • Ri, R 2 , R 3 , R 4 , R 5 are the same as or different from one another and are independently selected from among H, C] -C 6 alkyl, C 6 -Ci 0 aryl, Ci-C 8 alkoxy, Ci -C 8 alkylsilyl, and pendant ligands with additional functional group(s) that can provide further coordination to the metal center, e.g., - CH 2 - CH 2 -N(CH 3 ) 2 ;
  • Ri, R 2 , R 3 , R 4 are the same as or different from one another and are independently selected from among Q-C ⁇ alkyl, C ⁇ -Cio aryl, silyl and CrC 8 alkylamine; and
  • Ri, R 2 are the same as or different from one another and are independently selected from among Ci-C 5 alkyl, C ⁇ -Cio aryl, and C 3 -C6 cycloalkyl.
  • Figure 1 is a thermal ellipsoid plot of a strontium guanidinate of the invention.
  • ligands include aminotroponiminate, bis-oxazolinate and guanidinate ligands. While aminitroponiminate and bis-oxazolinate ligands have been discussed in the art, it has been with respect to Group III and lanthanide chemistry, not for CVD/ALD/RVD applications. (See Piers et al. Coord. Chem. Rev. vol. 233-4 p. 131-155 (2002)).
  • a strontium guanidinate complex has also been reported in the art, but that compound has not been used for CVD/ALD/RVD applications. (See Feil, et al. Eur. J. Inorg. Chem. 2005(21) p. 4438-4443 (2005)).
  • the ligand precursors, metal source precursors and corresponding compositions of the invention are volatile and sufficiently stable precursors for CVD, ALD and RVD processes and are reactive at reasonable temperatures for those processes.
  • the present invention relates to metal aminotroponiminate ligand precursors, metal source precursors and compositions for use in CVD, ALD and RVD processes, and to methods of making the same.
  • the invention relates to a ligand precursor of the formula:
  • Rj and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -Ci 0 aryls and C 3 -C 6 cycloalkyls.
  • Ci-C 5 alkyls as used herein includes, but is not limited to, methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl , pentyl and isopentyl and the like.
  • C 6 -Ci 0 aryls as used herein includes hydrocarbons derived from benzene or a benzene derivative that are unsaturated aromatic carbocyclic groups of from 6 to 10 carbon atoms.
  • the aryls may have a single or multiple rings.
  • aryl as used herein also includes substituted aryls. Examples include, but are not limited to phenyl, naphthyl, xylene, phenylethane, substituted phenyl, substituted naphthyl, substituted xylene, substituted phenylethane and the like.
  • C 3 -C 6 cycloalkyls as used herein includes, but is not limited to cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and the like.
  • a range of carbon numbers will be regarded as specifying a sequence of consecutive alternative carbon-containing moieties, including all moieties containing numbers of carbon atoms intermediate the endpoint values of carbon number in the specific range as well as moieties containing numbers of carbon atoms equal to an endpoint value of the specific range, e.g., Ci-C 6 , is inclusive of Ci, C 2 , C 3 , C 4 , C 5 and C 6 , and each of such broader ranges may be further limitingly specified with reference to carbon numbers within such ranges, as sub-ranges thereof.
  • the range Q-C 6 would be inclusive of and can be further limited by specification of sub-ranges such as C 1 -C 3 , Ci-C 4 , C 2 -Ce, C 4 -Ce, etc. within the scope of the broader range.
  • the invention relates to a ligand precursor of the formula:
  • Rj and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-Cs alkyls, C ⁇ -Cio aryls and C 3 -Ce cycloalkyls.
  • the invention relates to a metal source precursor of the formula:
  • Riand R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -Ci 0 aryls and C 3 -C 6 cycloalkyls.
  • M is a metal selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product may be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • the invention provides a method of making a compound of the formula: wherein Rj and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, C ⁇ -Cio aryls and C 3 -C 6 cycloalkyls.
  • M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product may be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • the metal aminotroponiminate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD process applications.
  • the invention relates to a method of forming a metal-containing layer on a substrate.
  • metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
  • deposition of a metal layer on a substrate surface is carried out.
  • the metal is strontium or barium.
  • the resulting layers can therefore include, without limitation, strontium titanate, barium titanate and strontium barium titanate.
  • the present invention relates in various embodiments to metal bis-oxazolinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes, as well as methods of making the same.
  • the invention relates to a ligand precursor of the formula:
  • Ri and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -C] 0 aryls and C 3 -Ce cycloalkyls.
  • the invention provides a ligand precursor of the formula:
  • Ri and R 2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C 5 alkyls, C 6 -C] 0 aryls and C 3 -C 6 cycloalkyls.
  • the invention relates to a metal source precursor of the formula:
  • each of the Ri and R 2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -Cs alkyls, C ⁇ -Cio aryls and C 3 - C 6 cycloalkyls.
  • M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and where x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product may be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • the invention provides a method of making a compound of the formula:
  • each of the Ri and R 2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-Cs alkyls, C 6 -Ci 0 aryls and C 3 - C 6 cycloalkyls.
  • M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and where x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product may be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • X is selected from the group consisting of chlorine, bromine and iodine
  • K is a potassium or sodium
  • the metal bis-Oxazolinate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD processes.
  • the invention in a specific aspect relates to a method of forming a metal containing layer on a substrate.
  • metals include, without limitation, strontium and barium.
  • the CVD/ALD/RVD process may include, but is not limited to, deposition of a metal layer on a substrate surface.
  • metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
  • deposition of a metal layer on a substrate surface is carried out.
  • the metal is strontium or barium.
  • the resulting layers may include, but are not limited to strontium titanate, barium titanate and strontium barium titanate.
  • guanidinate ligands generate homoleptic and monomeric strontium and barium complexes for use in CVD, ALD and RVD processes. These guanidinate ligands are utilized in homoleptic and monomeric precursors that are transportable (volatile) at temperatures specific to the ALD process. Additionally, the sterically demanding nature of the guanidinate ligands promotes conformal deposition of metals, such as barium or strontium, among others.
  • the present invention in a specific aspect relates to strontium and barium guanidinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes and methods of making and using such precursors and compositions.
  • the invention relates to a ligand precursor of the formula:
  • Ri, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C5 alkyls, C 6 -C J0 aryls and C3-C6 cycloalkyls.
  • the invention relates to a ligand precursor of the formula:
  • Rj, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C 5 alkyls, C 6 -Ci 0 aryls and C 3 -C 6 cycloalkyls.
  • the invention relates to a ligand precursor of the formula:
  • R' may be the same or different from one another and may be methyl or iPr.
  • the invention relates to a metal source precursor of the formula:
  • Ri, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C5 alkyls, C ⁇ -Cio aryls and C3-C6 cycloalkyls.
  • M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product can be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • the invention relates to a method of making a compound of the formula:
  • R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, Ce-C 10 aryls and C 3 -C6 cycloalkyls.
  • M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, R, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M.
  • M is barium or strontium.
  • the metal product may be bound by or coordinated to molecules of solvent.
  • the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
  • X is selected from the group consisting of chlorine, bromine and iodine and K is selected from the group consisting of potassium and sodium.
  • the invention relates to a metal source precursor of the formula:
  • R' may be the same or different from one another and may be methyl or zPr.
  • the invention relates to a method of making a compound of the formula:
  • R' may be the same or different from one another and may be methyl or zPr.
  • the method of making the compound comprises the following reaction:
  • R' may be the same or different from one another and may be methyl or /Pr.
  • the invention relates to a metal source precursor of the formula:
  • R' may be the same or different from one another and may be methyl or iPi and wherein Cp* is pentamethylcyclopentadienyl.
  • the invention relates to a method of making a compound of the formula:
  • R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl.
  • the method of making the compound comprises the following reaction:
  • R' may be the same or different from one another and may be methyl or /Pr and wherein Cp* is pentamethylcyclopentadienyl.
  • the invention relates to a metal source precursor of the formula:
  • the invention relates to a method of making a compound of the formula:
  • the method of making the compound comprises the following reaction:
  • R' may be the same or different from one another and may be methyl
  • the invention relates to a metal source precursor of the formula:
  • Cp* is pentamethylcyclopentadienyl
  • the invention relates to a method of making a compound of the formula:
  • the method of making the compound comprises the following reaction:
  • R' may be the same or different from one another and may be methyl or zPr and wherein Cp* is pentamethylcyclopentadienyl.
  • the metal guanidinate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD process applications.
  • another aspect of the invention relates to a method of forming a metal containing layer on a substrate.
  • metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
  • deposition of a metal layer on a substrate surface is carried out.
  • the metal is strontium or barium.
  • the resulting layers can include, but are not limited to strontium titanate, barium titanate and strontium barium titanate.
  • the present invention in another aspect relates to guanidinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes.
  • the properties of complexes including guanidinate ligands are readily adjusted by varying the steric demands of the ligands.
  • the invention relates to a ligand precursor of the formula:
  • R 1 N C(NR 2 R 3 )NR 4 M
  • Ri, R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q -C 5 alkyls, C ⁇ -Qo aryls and C 3 -C 6 cycloalkyls.
  • M is selected from the group consisting of sodium and potassium.
  • RiN C(NR 2 R 3 )NR 4 H wherein R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, C 6 -C 10 aryls and C 3 -C ⁇ cycloalkyls.
  • the invention provides a metal source precursor of the formula:
  • R 1 N C(NR 2 R 3 )NR 4 J x
  • R 1 , R 2 , R 3 and R 4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C 1 -C 5 alkyls, C 6 -C 10 aryls and C 3 -Cn cycloalkyls.
  • M is selected from the group consisting of titanium, yttrium, zirconium, hafnium, praseodymium, erbium, ytterbium, lanthanum, niobium, tantalum, molybdenum, tungsten, ruthenium, osmium, calcium, strontium, barium, iridium, cobalt, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, gallium, aluminum, germanium, indium, tin, lead, antimony, bismuth, magnesium, europium, and tellurium.
  • X is and x is 1 to 8, dependent on the oxidation state of M.
  • the guanidinate ligand precursors, metal source precursors and compositions thereof are utilized in CVD/ALD/RVD processes. Such process may include, but is not limited to, deposition of a metal layer on a substrate surface.
  • Another aspect of the invention is a method of forming a metal containing layer on a substrate.
  • Such metals may include, but are not limited to titanium, yttrium, zirconium, hafnium, praseodymium, erbium, ytterbium, lanthanum, niobium, tantalum, molybdenum, tungsten, ruthenium, osmium, calcium, strontium, barium, iridium, cobalt, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, gallium, aluminum, germanium, indium, tin, lead, antimony, bismuth, magnesium, europium, and tellurium.
  • complex or “compound” as used herein is a substance made up of atoms of two or more elements.
  • an organometallic compound is a compound wherein a carbon is covalently bound to a metal.
  • Other metal complexes and compounds are set forth herein.
  • Complexes or compounds of the invention include ligand precursors and metal source precursors. The terms compound and complex are used interchangeably herein.
  • Ligand as used herein is a molecule or other chemical entity that binds to another molecule, e.g., molecule or ion that is covalently bound to a central metal atom to form an organometallic compound.
  • Precursor as used herein is a chemical entity that precedes and is the source of another chemical entity.
  • a “ligand precursor” is a ligand starting material that is subsequently attached to a metal to form a metal source precursor for use in CVD, ALD and/or RVD applications.
  • a “metal source precursor” is a compound that is usable for depositing metal on a substrate in a CVD, ALD or RVD process.
  • novel ligand precursors, metal source precursors and compositions thereof, as described herein are usefully employed for forming thin films by CVD, ALD and/or RVD processes, utilizing process conditions, including appertaining temperatures, pressures, concentrations, flow rates and CVD, ALD and/or RVD techniques, as readily determinable within the skill of the art for a specific application, based on the disclosure herein.
  • the metal source precursors of the invention are volatilized to form a precursor vapor that is then contacted with a microelectronic device substrate under elevated temperature vapor decomposition conditions to deposit a metal on the substrate.
  • CVD involves the contacting of a volatile metal-organic compound in the gas phase with areas of a substrate where growth of a metal film is required (e.g., for formation of an interconnect).
  • a surface catalyzed chemical reaction e.g., thermal decomposition, occurs and produces deposition of the desired metal. Since the metal film progressively grows on the desired surface, the resulting film is of a uniform thickness and highly conformal even to severe (e.g., high aspect) geometries.
  • CVD is well suited to use in fabricating submicron high aspect ratio features.
  • ALD involves the deposition of successive monolayers over a substrate within a deposition chamber that is typically maintained at subatmospheric pressure.
  • An exemplary method includes feeding a single source precursor into a deposition chamber to form a first monolayer on a substrate disposed therein. Thereafter, the flow of the first source precursor is terminated and an inert purge gas, e.g., nitrogen or argon, is flowed through the chamber to exhaust any unreacted first source precursor from the chamber. Subsequently, a second source precursor, which may be the same as or different from the first metal source precursor, is flowed into the chamber and reacts with the above-mentioned adsorbed mono-layer precursor materials on the substrate, forming a monolayer. The above process can be repeated until a layer of desired thickness and composition has been formed on the substrate.
  • an inert purge gas e.g., nitrogen or argon
  • RVD like ALD, involves deposition of successive monolayers over a substrate.
  • An exemplary method includes feeding a single source precursor into a deposition chamber to form a first substantially saturated monolayer on a substrate surface. Thereafter, the flow of the first deposition metal source precursor is terminated and an inert purge gas, e.g., nitrogen or argon, is flowed through the chamber to exhaust any unreacted first source precursor and/or any byproducts from the chamber. Subsequently, a second source precursor is flowed into the chamber to form a second monolayer on the first monolayer.
  • the second monolayer in specific embodiments can react with the first monolayer, and in other embodiments the second monolayer is non-reactively deposited on the first monolayer.
  • An additional source precursor can form a successive monolayer, or the above process can be repeated until a layer of desired thickness and composition has been formed on the substrate.
  • the metal source precursors of the invention are volatile and thermally stable, and are usefully employed as CVD, ALD and/or RVD precursors under reduced pressure deposition conditions in corresponding CVD, ALD or RVD reactors.
  • compositions of the present invention can be delivered to the CVD, ALD or RVD reactors in a variety of ways.
  • a liquid delivery system may be utilized, with the solid ⁇ recursor(s) being dissolved in organic solvents, and liquid delivery processes being used to meter the solution into a vaporizer for transport of the vapor to the reactor.
  • a combined liquid delivery and flash vaporization process unit may be employed, to enable low volatility materials to be volumetrically delivered, so that reproducible transport and deposition are achieved without thermal decomposition of the precursor, in order to provide a commercially acceptable CVD, ALD or RVD process.
  • a liquid delivery system may be utilized wherein the precursor is stored in and delivered from an ionic liquid.
  • metal source precursors that are liquids may be used in neat liquid form, or liquid or solid metal source precursors may be employed in solvent formulations containing same.
  • metal source precursor formulations of the invention may include solvent components) of suitable character as may be desirable and advantageous in a given end use application to form metals on a substrate.
  • Suitable solvents may for example include alkane solvents (e.g., hexane, heptane, octane, and pentane), aryl solvents (e.g., benzene or toluene), amines (e.g., triethylamine, tert- butylamine), imines and carbodiimides (e.g., N, N'-diisopropylcarbodiimide) alcohols, ethers, ketones, aldehydes and the like.
  • alkane solvents e.g., hexane, heptane, octane, and pentane
  • aryl solvents e.g., benzene or toluene
  • amines e.g., triethylamine, tert- butylamine
  • imines and carbodiimides e.g., N, N'-diisoprop
  • a stabilizing ligand may be added to the CVD, ALD or RVD reactors before, concurrent with or after addition of the metal source precursors.
  • ligands may include, but are not limited to tetraglyme and pmdeta.
  • a solid delivery system may be utilized, for example, using the ProE-Vap® solid delivery and vaporizer unit (commercially available from ATMI, Inc., Danbury, CT, USA).
  • a liquid delivery system may be utilized, for example using the NOWTrak® system (commercially available from ATMI, Inc., Danbury, CT, USA).
  • the packaging utilized in liquid delivery employing the NOWTrak® system includes a disposable liner adapted to hold the liquid precursor composition.
  • Exemplary systems include, but are not limited to, those set forth in U.S. Patent No. 6,879,876, filed June 13, 2001 and issued April 12, 2005 and titled “Liquid handling system with electronic information storage”; U.S. Patent Application No. 10/139,104, filed May 3, 2002 and titled "Liquid handling system with electronic information storage”; U.S. Patent Application No.
  • the metal source precursors of the invention may be packaged in a precursor storage and dispensing package of any suitable type.
  • preferred precursor storage and dispensing packages include those described in U.S. Provisional Patent Application No. 60/662,515 filed in the names of Paul J. Marganski, et al. for "SYSTEM FOR DELIVERY OF REAGENTS FROM SOLID SOURCES THEREOF" and the storage and dispensing apparatus variously described in U.S. Patent 5,518,528; U.S. Patent 5,704,965; U.S. Patent 5,704,967; U.S. Patent 5,707,424; U.S.
  • a wide variety of CVD, ALD or RVD process conditions may be employed in the use of the metal source precursors of the present invention.
  • Generalized process conditions in specific embodiments include substrate temperatures in a range of 150 - 400 0 C, preferably 150-300 and more preferably less than or equal to 300 0 C; pressure in a range of 0.05 - 5 Torr; carrier gas flows of helium, hydrogen, nitrogen, or argon in a range of 25 -750 seem; and vaporizer temperatures in a range of 50 to 18O 0 C.
  • the invention in a further aspect relates to mixed ligand barium or strontium complexes suitable for use in CVD, ALD and RVD applications.
  • Such mixed ligand barium or strontium complexes have the general formula:
  • M barium or strontium
  • X and Y are each monoanionic and selected from the parent ligands (A)-(H) below, with the proviso that X and Y are different from one another:
  • Z is (CH 2 ) 2 or SiMe 2 ; and Rj, R 2 and R 3 are the same as or different from one another, and each is independently selected from among C 1 -C5 alkyl, C ⁇ -Cio aryl, and C 3 -C6 cycloalkyl; (B) aminotroponimine ligands of the formula
  • Ri, R 2 are the same as or different from one another and each is independently selected from among H, Ci-C 5 alkyl, C ⁇ -Cio aryl, and C 3 -C O cycloalkyl;
  • Rj, R 2 are the same as or different from one another and each is independently selected from among H, Ci-C 5 alkyl, C 6 -Ci 0 aryl, and C 3 -C O cycloalkyl;
  • R] R 2 , R 3 , R 4 are the same as or different from one another and are independently selected from among H, Ci-C 5 alkyl, C 6 -Ci 0 aryl- and C 3 -C 6 cycloalkyl;
  • Rj, R 2 , R 3 are the same as or different from one another and are independently selected from among H, Ci-C 5 alkyl, C 6 -Ci 0 aryl, and C 3 -C 6 cycloalkyl;
  • Ri, R 2 , R 3 , R t , R 5 are the same as or different from one another and are independently selected from among H, Q-C 6 alkyl, C 6 -CiO aryl.
  • R] are the same as or different from one another and are independently selected from among Ci-C 6 alkyl, C 6 -Ci 0 aryl, silyl and Ci-C 8 alkylamine;
  • the foregoing mixed ligand barium or strontium complexes are usefully employed for deposition of conformal barium- or strontium-containing films using CVD/ALD/RVD techniques, as monomeric barium or strontium precursors that are transportable (volatile) at temperatures specific to such processes.
  • This aspect of the invention utilizes sterically demanding ligands to generate mixed-ligand, monomeric barium or strontium complexes suitable for CVD/ALD/RVD, in which the ligands are selected from tacn (A), aminotroponimines (B), bis-oxazolines (C), guanidines (D), amidines (E), cyclopentadienes (F), beta-diketimines (G), and amines (H).
  • tacn A
  • aminotroponimines B
  • C bis-oxazolines
  • D guanidines
  • D amidines
  • E cyclopentadienes
  • F beta-diketimines
  • G beta-diketimines
  • H amines
  • the mixed ligand complexes of the invention can be readily synthesized from the parent ligands and the metal, wherein each of the two coordinated ligands is different from one another in the complex.
  • Such mixed ligand complexes can be utilized as reagents for barium or strontium deposition in CVD, ALD or RVD processes conducted at relatively low temperatures.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Vapour Deposition (AREA)

Abstract

Metal aminotroponiminates, metal bis-oxazolinates and metal guanidinates are described, as well as ligand precursors of such compounds, and mixed ligand barium and strontium complexes suitable for chemical vapor deposition, atomic layer deposition, and rapid vapor deposition processes. Such metal compounds are useful in the formation of thin metal films on substrates, e.g., in chemical vapor deposition, atomic layer deposition or rapid vapor deposition processes. The substrates formed have thin film monolayers of the metals provided by the precursors.

Description

METAL AMINOTROPONIMINATES, BIS-OXAZOLINATES AND
GUANIDINATES
CROSS-REFERENCE TO RELATED APPLICATION
The benefit of priority of U.S. Provisional Patent Application 60/868,564 filed December 5, 2006 is hereby claimed.
FIELD OF THE INVENTION
[0001] The invention relates generally to metal source precursors and their synthesis. In one aspect, the invention relates to strontium, barium and other metal aminotroponiminates, strontium, barium and other bis-oxazolinates, strontium and barium guanidinates, as well as metal guanidinates including metals other than strontium and barium, and methods of making and using these compositions. The invention in another aspect relates to ligand precursors of the inventive metal source precursors. The invention also relates to mixed ligand copper complexes suitable for chemical vapor deposition, atomic layer deposition and rapid vapor deposition applications. In a still further aspect, the invention relates to methods of depositing metal layers on a substrate utilizing the precursors of the invention and substrates generated thereby.
BACKGROUND OF THE INVENTION
[0002] Chemical vapor deposition (CVD) is a chemical process that involves a series of chemical reactions to produce a thin layer of solid material on a substrate surface. The process is widely used to fabricate microelectronic devices and products.
[0003] In a typical CVD process, a substrate is exposed to one or more precursors. The precursors react with the substrate surface to produce a deposit of solid material on such surface. CVD is well-suited to provide uniform coverage of the deposited material on the substrate.
[0004] Atomic layer deposition (ALD) is a modified CVD process involving a sequential step technique that results in a coating of multiple layers on the substrate. Typically ALD is carried out utilizing two complementary precursors that are alternately introduced to the reaction chamber. The first precursor is delivered in excess into the deposition chamber. The precursor will react with the substrate to form a monolayer of reacted precursor on the surface. The deposition chamber is purged or evacuated with a carrier gas to remove unreacted precursor followed by the delivery of a reactant (a second precursor) to the deposition chamber for reaction with the monolayer of reacted precursor, to form the desired material. This cycle is repeated until an appropriate thickness of material is achieved. Advantageously, ALD provides uniform step coverage and a high level of control over film thicknesses.
[0005] In an illustrative ALD process, sequential precursor pulses are used to form a film, layer by layer. A first precursor may be introduced to form a gas monolayer on a substrate, followed by introduction of a second precursor to react with the gas monolayer to form a first solid monolayer of the film. Each cycle including first and second precursor pulses therefore forms one solid monolayer. The process then is repeated to form successive layers until a film of desired thickness is obtained.
[0006] An additional deposition process is rapid vapor deposition (RVD). In RVD, similar to ALD, the. substrate, is sequentially exposed to precursors in gaseous form. In RVD the process is repeated until a substrate coated with multiple layers reaches a desired thickness. The resulting coated substrate is of high coafoπnality. RVD differs from ALD in that the layers in RVD can be deposited more quickly.
[0007] Liquid precursors and/or solid precursors dissolved in suitable solvents enable the direct injection and/or liquid delivery of precursors into a CVD, ALD or RVD vaporizer unit. The accurate and precise delivery rate can be obtained through volumetric metering to achieve reproducibility during CVD, ALD or RVD metallization of a VLSI device. Solid precursor delivery via specially-designed devices, such as ATMI' s ProE Vap® precursor storage and dispensing package or liquid precursor delivery via specially-designed devices, such as ATMFs NOWTrak® precursor storage and dispensing package (both from ATMI, Inc., Danbury, Connecticut, USA) enables highly efficient transport of solid precursors to a CVD, ALD or RVD reactor.
[0008] Historically, deposition of strontium or barium materials using ALD techniques has been performed utilizing precursor complexes that have a high (> 300° C) transport temperature and provide non-conformal substrate surface coverage. Thus it is desirable to develop new precursors for delivery of barium or strontium with transport temperatures specific to the ALD and/or RVD processes and that promote conformal film production. Efficient and economic methods of making and using such precursors would also be desirable. [0009] Recently, guanidinate anions have received attention for use as ligands in coordination and organometallic compounds, specifically because of the ease of substitution at the carbon and nitrogen atoms and the consequent versatility and flexibility that is provided. Use of such ligands has been limited to lithium salts of the general formula RiN=C(NR2Rs)NR4Li. Complexes including guanidinate ligands are formed by reaction of the corresponding carboiimide (R1N=C=NR4) and appropriate LiNR2Rs reagent. Development of alternative guanidinate compounds would enable the synthesis of a larger range of guanidinate-containing metal source precursors and would therefore be desirable. Methods of making and using such precursors in a cost-effective and efficient manner would also be desirable.
SUMMARY OF THE INVENTION
[0010] The present invention relates to metal source precursors for use in CVD, ALD and RVD processes and methods of making the same, as well as to a method of depositing a metal layer on a substrate using such precursors and to substrate structures, e.g., microelectronic device structures, having such layers deposited thereon. The invention also relates to ligand precursors useful in making metal source precursors for CVD, ALD and RVD processes.
[0011] In one aspect, the invention relates to a ligand precursor selected from the group consisting of compounds of formulas:
Figure imgf000004_0001
[0012] where Rjand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, CO-CI0 aryls and C3-Ce cycloalkyls;
(B)
Figure imgf000004_0002
R2 [0013] where Riand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Ce-Q0 aryls and C3-C6 cycloalkyls;
Figure imgf000005_0001
[0014] where Rjand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C10 aryls and C3-C6 cycloalkyls;
(D)
Figure imgf000005_0002
[0015] where R1 and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C10 aryls and C3-C6 cycloalkyls;
Figure imgf000005_0003
F* [0016] where R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C10 aryls and C3-C6 cycloalkyls;
(F)
Figure imgf000006_0001
[0017] where Rj, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls; and
Figure imgf000006_0002
wherein R' may be the same or different from one another and may be methyl or zPr.
[0018] In another aspect, the invention relates to a metal source precursor selected from the group consisting of compounds of the formulas:
(A)
Figure imgf000006_0003
[0019] where R:and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M. In one aspect of this embodiment, the metal deposited is selected from the group consisting of Ba and Sr;
(B)
Figure imgf000007_0001
[0020] where each of the R\ and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Cβ-Cio aryls and C3-CO cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x and x is 1 to 8, dependent on the oxidation state of M. In one aspect of this embodiment, the metal deposited is selected from the group consisting of Ba and Sr;
(C)
Figure imgf000007_0002
[0021] where R], R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Ce-Q0 aryls and C3-CO cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M. In one aspect of this embodiment, the metal deposited is selected from the group consisting of Ba and Sr;
(D)
Figure imgf000007_0003
[0022] wherein R' may be the same or different from one another and may be methyl or /Pr;
(E)
Figure imgf000008_0001
[0023] wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl;
(F)
Figure imgf000008_0002
(G)
Figure imgf000008_0003
[0024] wherein Cp* is pentamethylcyclopentadienyl. [0025] In additional aspects, the invention relates to various methods of making the above metal source precursors.
[0026] In still another aspect, the invention relates to a method of depositing a metal layer on a substrate comprising deposit of the metal on the substrate surface by ALD or RVD, wherein at least one precursor is selected from the metal source precursors of the invention. In one aspect the metal deposited is selected from the group comprising Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te. In another embodiment the one or more layers comprise strontium and/or barium. In one embodiment of this method, the ALD is performed at a temperature of less than or equal to 300 degrees Celsius. In another aspect of the embodiment, delivery of the at least one precursor is by solution delivery. In still another aspect of the embodiment, delivery of the at least one precursor is by dispensing from a ProE Vap® precursor storage and dispensing package. In still another aspect, delivery of the at least one precursor involves dispensing from a NOWTrak® precursor storage and dispensing package.
[0027] In still another embodiment, the invention relates to a substrate coated with one or more film monolayers of one or more metals. The substrate of the invention is coated by chemical vapor deposition, atomic layer deposition and/or rapid vapor deposition and the deposition method utilizes one or more metal source precursors of the invention. In one embodiment of the invention the one or more layers comprise Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and/or Te. In another embodiment the one or more layers comprise strontium and/or barium.
[0028] In yet another aspect of the invention, the invention relates to a ligand precursor selected from the group consisting of compounds of the formulas:
(A) R1N=C(NR2R3)NR4M
[0029] where R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-Cs alkyls, C6-C10 aryls and C3-C6 cycloalkyls; and M is selected from the group consisting of Na and K; and
(B) R1N=C(NR2R3)NR4H [0030] where Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-Cs alkyls, Ce-Q0 aryls and C3-CO cycloalkyls.
[0031] A further aspect of the invention relates to a metal source precursor of the formula
Figure imgf000010_0001
wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, C6-C]0 aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M.
[0032] Yet another aspect of the invention relates to a method of depositing a metal layer on a substrate comprising deposit of the metal on the substrate surface by atomic layer deposition or rapid layer deposition, wherein at least one precursor is a metal source precursor of the formula M[R]N=C(NR2R3)NR4]X, wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M. In one aspect of this embodiment, the metal deposited is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te. In a further embodiment of this aspect of the invention, the ALD is performed at a temperature of less than or equal to 300 degrees Celsius. In another embodiment of this aspect of the invention, delivery of the at least one precursor is by solution delivery. In still another embodiment of this aspect of the invention, delivery of the at least one precursor is by dispensing from a ProE Vap® precursor storage and dispensing package. In still another aspect, delivery of the at least one precursor involves dispensing from a NOWTrak® precursor storage and dispensing package.
[0033] In still another embodiment, the invention relates to a substrate coated with one or more film monolayers of one or more metals. The substrate of the invention is coated by chemical vapor deposition, atomic layer deposition and/or rapid vapor deposition and the deposition method utilizes one or more metal source precursors of the invention. In one embodiment of the invention, the deposition method comprises use of at least one precursor selected from metal source precursors of the formula M[RiN=C(NR2R3)NR4]x, wherein R3, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M.
[0034] The invention in another aspect relates to a precursor storage and delivery apparatus comprising a vessel containing a metal source precursor of the invention.
[0035] A further aspect of the invention relates to a vapor of a metal source precursor of the invention.
[0036] A still further aspect of the invention relates to a method of making a microelectronic device product, comprising contacting a microelectronic device substrate with a metal source precursor of the invention, to deposit said metal on the substrate.
[0037] Yet another aspect relates to a mixed ligand barium and strontium complexes suitable for use in CVD, ALD and RVD applications. Such mixed ligand copper complexes have the general formula:
X
M
wherein M is barium or strontium, X and Y are each monoanionic and selected from the parent ligands (A)-(H) below, with the proviso that X and Y are different from one another:
(A) triazacyclononane-amide (tacn) ligands of the formula
Figure imgf000012_0001
wherein: Z is (CH2)2 or SiMe2; and R1, R2 and R3 are the same as or different from, one another, and each is independently selected from among C1-C5 alkyl, Cβ-Cio aryl, and C3-C6 cycloalkyl;
(B) aminotroponimine ligands of the formula
Figure imgf000012_0002
wherein Ri, R2 are the same as or different from one another and each is independently selected from among H, Ci-C5 alkyl, Ce-Qo aryl, and C3-C6 cycloalkyl;
(C) bis(oxazole) ligands of the formula
Figure imgf000012_0003
wherein Ri, R2 are the same as or different from one another and each is independently selected from among H, Ci-C5 alkyl, C6-Ci0 aryl. and C3-C6 cycloalkyl;
(D) guanidine ligands of the formula
Figure imgf000013_0001
wherein Ri, R2, R3, Rψ are the same as or different from one another and are independently selected from among H, Q-C5 alkyl, C6-Q0 aryl, and C3-C6 cycloalkyl;
(E) amidine ligands of the formula
Figure imgf000013_0002
wherein Ri, R2, R3 are the same as or different from one another and are independently selected from among H, Q-C5 alkyl, C6-Ci0 aryl, and C3-C6 cycloalkyl;
(F) cyclopentadiene ligands of the formula
Figure imgf000013_0003
wherein Ri, R2, R3, R4, R5 are the same as or different from one another and are independently selected from among H, C] -C6 alkyl, C6-Ci0 aryl, Ci-C8 alkoxy, Ci -C8 alkylsilyl, and pendant ligands with additional functional group(s) that can provide further coordination to the metal center, e.g., - CH2- CH2-N(CH3)2;
(G) betadiketimine ligands of the formula
Figure imgf000014_0001
wherein Ri, R2, R3, R4 are the same as or different from one another and are independently selected from among Q-Cβ alkyl, Cβ-Cio aryl, silyl and CrC8 alkylamine; and
(H) amine ligands of the formula
Figure imgf000014_0002
wherein Ri, R2 are the same as or different from one another and are independently selected from among Ci-C5 alkyl, Cβ-Cio aryl, and C3-C6 cycloalkyl.
[0038] Other aspects, features and advantages of the invention will be more fully apparent from the ensuing disclosure and appended claims.
BRIEF DESCRIPTION OF THE DRAWINGS
[0039] Figure 1 is a thermal ellipsoid plot of a strontium guanidinate of the invention.
DETAILED DESCRIPTION OF THE INVENTION
[0040] Previous strontium and barium complexes used in ALD processes have required high (> 300° C) transport temperatures and have resulted in non-conformal surface coverage. The non- conformal coverage has been attributed to formation of oligomeric species during complex decomposition on the substrate surface during the ALD process.
[0041] The present inventors have discovered that utilizing sterically demanding ligands will allow for transport temperatures of less than or equal to 300°C and that the sterically demanding nature of the ligand limits oligomerization behavior, promoting conformal film production in the ALD and RVD processes. Such ligands include aminotroponiminate, bis-oxazolinate and guanidinate ligands. While aminitroponiminate and bis-oxazolinate ligands have been discussed in the art, it has been with respect to Group III and lanthanide chemistry, not for CVD/ALD/RVD applications. (See Piers et al. Coord. Chem. Rev. vol. 233-4 p. 131-155 (2002)). A strontium guanidinate complex has also been reported in the art, but that compound has not been used for CVD/ALD/RVD applications. (See Feil, et al. Eur. J. Inorg. Chem. 2005(21) p. 4438-4443 (2005)). The ligand precursors, metal source precursors and corresponding compositions of the invention are volatile and sufficiently stable precursors for CVD, ALD and RVD processes and are reactive at reasonable temperatures for those processes.
Metal aminotroponiminates
[0042] The present invention relates to metal aminotroponiminate ligand precursors, metal source precursors and compositions for use in CVD, ALD and RVD processes, and to methods of making the same.
[0043] In one aspect the invention relates to a ligand precursor of the formula:
Figure imgf000015_0001
wherein Rj and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls. The term "Ci-C5 alkyls" as used herein includes, but is not limited to, methyl, ethyl, propyl, isopropyl, butyl, s-butyl, t-butyl , pentyl and isopentyl and the like. The term "C6-Ci0 aryls" as used herein includes hydrocarbons derived from benzene or a benzene derivative that are unsaturated aromatic carbocyclic groups of from 6 to 10 carbon atoms. The aryls may have a single or multiple rings. The term "aryl" as used herein also includes substituted aryls. Examples include, but are not limited to phenyl, naphthyl, xylene, phenylethane, substituted phenyl, substituted naphthyl, substituted xylene, substituted phenylethane and the like. The term "C3-C6 cycloalkyls" as used herein includes, but is not limited to cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and the like. In all chemical formulae herein, a range of carbon numbers will be regarded as specifying a sequence of consecutive alternative carbon-containing moieties, including all moieties containing numbers of carbon atoms intermediate the endpoint values of carbon number in the specific range as well as moieties containing numbers of carbon atoms equal to an endpoint value of the specific range, e.g., Ci-C6, is inclusive of Ci, C2, C3, C4, C5 and C6, and each of such broader ranges may be further limitingly specified with reference to carbon numbers within such ranges, as sub-ranges thereof. Thus, for example, the range Q-C6 would be inclusive of and can be further limited by specification of sub-ranges such as C1-C3, Ci-C4, C2-Ce, C4-Ce, etc. within the scope of the broader range.
[0044] In another aspect the invention relates to a ligand precursor of the formula:
Figure imgf000016_0001
wherein Rj and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-Cs alkyls, Cβ-Cio aryls and C3-Ce cycloalkyls.
[0045] In still another aspect, the invention relates to a metal source precursor of the formula:
Figure imgf000016_0002
[0046] where Riand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls. M is a metal selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product may be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
[0047] In another aspect, the invention provides a method of making a compound of the formula:
Figure imgf000017_0001
wherein Rj and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-C6 cycloalkyls. M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product may be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
[0048] In one aspect the method of making the compound where x=2 comprises the following reaction:
Solvsrt + 2 0 KΛ
Figure imgf000017_0002
Figure imgf000017_0003
wherein X is selected from the group consisting of: chlorine, bromine and iodine. Where potassium is present in the reaction, one of skill could utilize other ions, as known in the art. Examples include, but are not limited to, alkali metals, such as sodium and lithium.
[0049] In another aspect the method of making the compound where x=2 comprises the following reaction:
4 fl ^T ? .T
Figure imgf000017_0004
CXl > - So vent M O H-N(SiMe3J2
[0050] In various embodiments, the metal aminotroponiminate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD process applications. [0051] In another aspect, the invention relates to a method of forming a metal-containing layer on a substrate. Such metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te. In a specific process embodiment, deposition of a metal layer on a substrate surface is carried out. In one embodiment, the metal is strontium or barium. The resulting layers can therefore include, without limitation, strontium titanate, barium titanate and strontium barium titanate.
Metal bis-Oxazolinates
[0052] The present invention relates in various embodiments to metal bis-oxazolinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes, as well as methods of making the same.
[0053] In one aspect, the invention relates to a ligand precursor of the formula:
Figure imgf000018_0001
wherein Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C]0 aryls and C3-Ce cycloalkyls.
[0054] In another aspect the invention provides a ligand precursor of the formula:
Figure imgf000018_0002
wherein Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C]0 aryls and C3-C6 cycloalkyls.
[0055] In another aspect the invention relates to a metal source precursor of the formula:
Figure imgf000019_0001
wherein each of the Ri and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-Cs alkyls, Cβ-Cio aryls and C3- C6 cycloalkyls. M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and where x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product may be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
[0056] In another aspect the invention provides a method of making a compound of the formula:
Figure imgf000019_0002
wherein each of the Ri and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-Cs alkyls, C6-Ci0 aryls and C3- C6 cycloalkyls. M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and where x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product may be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
[0057] In one aspect the method of making the compound where x=2 comprises the following reaction:
Figure imgf000020_0001
[0058] In another aspect the method of making the compound where x=2 comprises the followin ligS r ' eaction:
. m Solvent
Figure imgf000020_0003
Figure imgf000020_0002
[0059] where X is selected from the group consisting of chlorine, bromine and iodine, and K is a potassium or sodium.
[0060] In one aspect, the metal bis-Oxazolinate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD processes. The invention in a specific aspect relates to a method of forming a metal containing layer on a substrate. Such metals include, without limitation, strontium and barium.
[0061] In a specific embodiment, the CVD/ALD/RVD process may include, but is not limited to, deposition of a metal layer on a substrate surface. Such metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te. In a specific process embodiment, deposition of a metal layer on a substrate surface is carried out. In one embodiment, the metal is strontium or barium. The resulting layers may include, but are not limited to strontium titanate, barium titanate and strontium barium titanate.
Metal Guanidinates
[0062] The present inventors have also discovered that the use of sterically demanding guanidinate ligands generate homoleptic and monomeric strontium and barium complexes for use in CVD, ALD and RVD processes. These guanidinate ligands are utilized in homoleptic and monomeric precursors that are transportable (volatile) at temperatures specific to the ALD process. Additionally, the sterically demanding nature of the guanidinate ligands promotes conformal deposition of metals, such as barium or strontium, among others.
[0063] The present invention in a specific aspect relates to strontium and barium guanidinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes and methods of making and using such precursors and compositions.
[0064] In one aspect the invention relates to a ligand precursor of the formula:
j
Figure imgf000021_0001
wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-CJ0 aryls and C3-C6 cycloalkyls.
[0065] In another aspect the invention relates to a ligand precursor of the formula:
Figure imgf000021_0002
wherein Rj, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls.
[0066] In still another aspect the invention relates to a ligand precursor of the formula:
Figure imgf000021_0003
Wherein R' may be the same or different from one another and may be methyl or iPr.
[0067] In yet another aspect the invention relates to a metal source precursor of the formula:
Figure imgf000022_0001
wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-C6 cycloalkyls. M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product can be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta.
[0068] In still a further aspect, the invention relates to a method of making a compound of the formula:
Figure imgf000022_0002
wherein R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, Ce-C10 aryls and C3-C6 cycloalkyls. M is a metal selected from Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, R, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te and x is 1 to 8, dependent on the oxidation state of M. In one embodiment, M is barium or strontium. In another embodiment, the metal product may be bound by or coordinated to molecules of solvent. In still another embodiment, the metal product may be bound by or coordinated to molecules of additional ligands, such as, but not limited to, tetraglyme and pmdeta. [0069] In one aspect the method of making the compound where x=2 comprises the following reaction:
Figure imgf000023_0001
wherein X is selected from the group consisting of chlorine, bromine and iodine and K is selected from the group consisting of potassium and sodium.
[0070] In a further aspect the invention relates to a metal source precursor of the formula:
Figure imgf000023_0002
wherein R' may be the same or different from one another and may be methyl or zPr.
[0071] In still a further aspect the invention relates to a method of making a compound of the formula:
Figure imgf000023_0003
wherein R' may be the same or different from one another and may be methyl or zPr. [0072] In one aspect, the method of making the compound comprises the following reaction:
Figure imgf000024_0001
wherein R' may be the same or different from one another and may be methyl or /Pr.
[0073] In another aspect the invention relates to a metal source precursor of the formula:
Figure imgf000024_0002
wherein R' may be the same or different from one another and may be methyl or iPi and wherein Cp* is pentamethylcyclopentadienyl.
[0074] In still an additional aspect the invention relates to a method of making a compound of the formula:
Figure imgf000024_0003
wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl.
[0075] In one aspect, the method of making the compound comprises the following reaction:
Figure imgf000025_0001
wherein R' may be the same or different from one another and may be methyl or /Pr and wherein Cp* is pentamethylcyclopentadienyl.
[0076] In another aspect the invention relates to a metal source precursor of the formula:
Figure imgf000025_0002
[0077] In an additional aspect the invention relates to a method of making a compound of the formula:
Figure imgf000025_0003
[0078] In still another aspect, the method of making the compound comprises the following reaction:
Figure imgf000026_0001
wherein R' may be the same or different from one another and may be methyl
[0079] In a further aspect the invention relates to a metal source precursor of the formula:
Figure imgf000026_0002
wherein Cp* is pentamethylcyclopentadienyl.
[0080] In still a further aspect the invention relates to a method of making a compound of the formula:
Figure imgf000026_0003
wherein Cp* is pentamethylcyclopentadienyl. [0081] In another aspect, the method of making the compound comprises the following reaction:
Figure imgf000027_0001
wherein R' may be the same or different from one another and may be methyl or zPr and wherein Cp* is pentamethylcyclopentadienyl.
[0082] In one aspect, the metal guanidinate ligand precursors, metal source precursors and compositions thereof are utilized for CVD/ALD/RVD process applications. As such, another aspect of the invention relates to a method of forming a metal containing layer on a substrate. Such metals may include, but are not limited to, Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te. In a specific process embodiment, deposition of a metal layer on a substrate surface is carried out. In one embodiment, the metal is strontium or barium. The resulting layers can include, but are not limited to strontium titanate, barium titanate and strontium barium titanate.
Guanidinate Ligands
[0083] The present invention in another aspect relates to guanidinate ligand precursors, metal source precursors and compositions thereof for use in CVD, ALD and RVD processes. The properties of complexes including guanidinate ligands are readily adjusted by varying the steric demands of the ligands.
[0084] In another aspect, the invention relates to a ligand precursor of the formula:
R1N=C(NR2R3)NR4M wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q -C5 alkyls, Cβ-Qo aryls and C3-C6 cycloalkyls. M is selected from the group consisting of sodium and potassium. [0085] In still another aspect the invention relates to a ligand precursor of the formula:
RiN=C(NR2R3)NR4H wherein R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C10 aryls and C3-Cδ cycloalkyls.
[0086] In still another aspect the invention provides a metal source precursor of the formula:
M[R1N=C(NR2R3)NR4Jx wherein R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C10 aryls and C3-Cn cycloalkyls. M is selected from the group consisting of titanium, yttrium, zirconium, hafnium, praseodymium, erbium, ytterbium, lanthanum, niobium, tantalum, molybdenum, tungsten, ruthenium, osmium, calcium, strontium, barium, iridium, cobalt, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, gallium, aluminum, germanium, indium, tin, lead, antimony, bismuth, magnesium, europium, and tellurium. X is and x is 1 to 8, dependent on the oxidation state of M.
[0087] In various embodiments, the guanidinate ligand precursors, metal source precursors and compositions thereof are utilized in CVD/ALD/RVD processes. Such process may include, but is not limited to, deposition of a metal layer on a substrate surface. Another aspect of the invention is a method of forming a metal containing layer on a substrate. Such metals may include, but are not limited to titanium, yttrium, zirconium, hafnium, praseodymium, erbium, ytterbium, lanthanum, niobium, tantalum, molybdenum, tungsten, ruthenium, osmium, calcium, strontium, barium, iridium, cobalt, nickel, palladium, platinum, copper, silver, gold, zinc, cadmium, gallium, aluminum, germanium, indium, tin, lead, antimony, bismuth, magnesium, europium, and tellurium.
[0088] Definitions and Additional Details
[0089] The terms "complex" or "compound" as used herein is a substance made up of atoms of two or more elements. For example, an organometallic compound is a compound wherein a carbon is covalently bound to a metal. Other metal complexes and compounds are set forth herein. Complexes or compounds of the invention include ligand precursors and metal source precursors. The terms compound and complex are used interchangeably herein. [0090] "Ligand" as used herein is a molecule or other chemical entity that binds to another molecule, e.g., molecule or ion that is covalently bound to a central metal atom to form an organometallic compound.
[0091] "Precursor" as used herein is a chemical entity that precedes and is the source of another chemical entity. A "ligand precursor" is a ligand starting material that is subsequently attached to a metal to form a metal source precursor for use in CVD, ALD and/or RVD applications. A "metal source precursor" is a compound that is usable for depositing metal on a substrate in a CVD, ALD or RVD process.
[0092] The novel ligand precursors, metal source precursors and compositions thereof, as described herein are usefully employed for forming thin films by CVD, ALD and/or RVD processes, utilizing process conditions, including appertaining temperatures, pressures, concentrations, flow rates and CVD, ALD and/or RVD techniques, as readily determinable within the skill of the art for a specific application, based on the disclosure herein.
[0093] In CVD, ALD and/or RVD usage, the metal source precursors of the invention are volatilized to form a precursor vapor that is then contacted with a microelectronic device substrate under elevated temperature vapor decomposition conditions to deposit a metal on the substrate.
[0094] CVD involves the contacting of a volatile metal-organic compound in the gas phase with areas of a substrate where growth of a metal film is required (e.g., for formation of an interconnect). A surface catalyzed chemical reaction, e.g., thermal decomposition, occurs and produces deposition of the desired metal. Since the metal film progressively grows on the desired surface, the resulting film is of a uniform thickness and highly conformal even to severe (e.g., high aspect) geometries. CVD is well suited to use in fabricating submicron high aspect ratio features.
[0095] ALD involves the deposition of successive monolayers over a substrate within a deposition chamber that is typically maintained at subatmospheric pressure. An exemplary method includes feeding a single source precursor into a deposition chamber to form a first monolayer on a substrate disposed therein. Thereafter, the flow of the first source precursor is terminated and an inert purge gas, e.g., nitrogen or argon, is flowed through the chamber to exhaust any unreacted first source precursor from the chamber. Subsequently, a second source precursor, which may be the same as or different from the first metal source precursor, is flowed into the chamber and reacts with the above-mentioned adsorbed mono-layer precursor materials on the substrate, forming a monolayer. The above process can be repeated until a layer of desired thickness and composition has been formed on the substrate.
[0096] RVD, like ALD, involves deposition of successive monolayers over a substrate. An exemplary method includes feeding a single source precursor into a deposition chamber to form a first substantially saturated monolayer on a substrate surface. Thereafter, the flow of the first deposition metal source precursor is terminated and an inert purge gas, e.g., nitrogen or argon, is flowed through the chamber to exhaust any unreacted first source precursor and/or any byproducts from the chamber. Subsequently, a second source precursor is flowed into the chamber to form a second monolayer on the first monolayer. The second monolayer in specific embodiments can react with the first monolayer, and in other embodiments the second monolayer is non-reactively deposited on the first monolayer. An additional source precursor can form a successive monolayer, or the above process can be repeated until a layer of desired thickness and composition has been formed on the substrate.
[0097] The metal source precursors of the invention are volatile and thermally stable, and are usefully employed as CVD, ALD and/or RVD precursors under reduced pressure deposition conditions in corresponding CVD, ALD or RVD reactors.
[0098] The compositions of the present invention can be delivered to the CVD, ALD or RVD reactors in a variety of ways. For example, a liquid delivery system may be utilized, with the solid ρrecursor(s) being dissolved in organic solvents, and liquid delivery processes being used to meter the solution into a vaporizer for transport of the vapor to the reactor. Alternatively, a combined liquid delivery and flash vaporization process unit may be employed, to enable low volatility materials to be volumetrically delivered, so that reproducible transport and deposition are achieved without thermal decomposition of the precursor, in order to provide a commercially acceptable CVD, ALD or RVD process. In still another alternative, a liquid delivery system may be utilized wherein the precursor is stored in and delivered from an ionic liquid.
[0099] In liquid delivery formulations, metal source precursors that are liquids may be used in neat liquid form, or liquid or solid metal source precursors may be employed in solvent formulations containing same. Thus, metal source precursor formulations of the invention may include solvent components) of suitable character as may be desirable and advantageous in a given end use application to form metals on a substrate. [00100] Suitable solvents may for example include alkane solvents (e.g., hexane, heptane, octane, and pentane), aryl solvents (e.g., benzene or toluene), amines (e.g., triethylamine, tert- butylamine), imines and carbodiimides (e.g., N, N'-diisopropylcarbodiimide) alcohols, ethers, ketones, aldehydes and the like. The utility of specific solvent compositions for particular metal source precursors may be readily empirically determined, to select an appropriate single component or multiple component solvent medium for the liquid delivery vaporization and transport of the specific metal source precursor that is employed.
[0100] In another aspect of the invention, a stabilizing ligand may be added to the CVD, ALD or RVD reactors before, concurrent with or after addition of the metal source precursors. Such ligands may include, but are not limited to tetraglyme and pmdeta.
[0101] In another aspect of the invention, a solid delivery system may be utilized, for example, using the ProE-Vap® solid delivery and vaporizer unit (commercially available from ATMI, Inc., Danbury, CT, USA).
[0102] In another aspect of the invention, a liquid delivery system may be utilized, for example using the NOWTrak® system (commercially available from ATMI, Inc., Danbury, CT, USA). In still another aspect of the invention, the packaging utilized in liquid delivery employing the NOWTrak® system includes a disposable liner adapted to hold the liquid precursor composition. Exemplary systems include, but are not limited to, those set forth in U.S. Patent No. 6,879,876, filed June 13, 2001 and issued April 12, 2005 and titled "Liquid handling system with electronic information storage"; U.S. Patent Application No. 10/139,104, filed May 3, 2002 and titled "Liquid handling system with electronic information storage"; U.S. Patent Application No. 10/742,125, filed December 19, 2003 and titled "Secure Reader System"; and U.S. Provisional Patent Application No. 60/819,681 filed July 10, 2006 entitled "Fluid storage vessel management systems and methods employing electronic information storage," all of which are hereby incorporated by reference in their entirety.
[0103] The metal source precursors of the invention may be packaged in a precursor storage and dispensing package of any suitable type. Depending on the form, e.g., solid or liquid form, of the precursor, preferred precursor storage and dispensing packages include those described in U.S. Provisional Patent Application No. 60/662,515 filed in the names of Paul J. Marganski, et al. for "SYSTEM FOR DELIVERY OF REAGENTS FROM SOLID SOURCES THEREOF" and the storage and dispensing apparatus variously described in U.S. Patent 5,518,528; U.S. Patent 5,704,965; U.S. Patent 5,704,967; U.S. Patent 5,707,424; U.S. Patent 6,101,816; U.S. Patent 6,089,027; U.S. Patent Application Publication 20040206241; U.S. Patent 6,921,062; U.S. Patent Application 10/858,509; and U.S. Patent Application 10/022,298.
[0104] A wide variety of CVD, ALD or RVD process conditions may be employed in the use of the metal source precursors of the present invention. Generalized process conditions in specific embodiments include substrate temperatures in a range of 150 - 4000C, preferably 150-300 and more preferably less than or equal to 3000C; pressure in a range of 0.05 - 5 Torr; carrier gas flows of helium, hydrogen, nitrogen, or argon in a range of 25 -750 seem; and vaporizer temperatures in a range of 50 to 18O0C.
[0105] The invention in a further aspect relates to mixed ligand barium or strontium complexes suitable for use in CVD, ALD and RVD applications. Such mixed ligand barium or strontium complexes have the general formula:
X
M
wherein M is barium or strontium, X and Y are each monoanionic and selected from the parent ligands (A)-(H) below, with the proviso that X and Y are different from one another:
(A) triazacyclononane-amide (tacn) ligands of the formula
< \
NH
% wherein: Z is (CH2)2 or SiMe2; and Rj, R2 and R3 are the same as or different from one another, and each is independently selected from among C1-C5 alkyl, Cβ-Cio aryl, and C3-C6 cycloalkyl; (B) aminotroponimine ligands of the formula
Figure imgf000033_0001
wherein Ri, R2 are the same as or different from one another and each is independently selected from among H, Ci-C5 alkyl, Cβ-Cio aryl, and C3-CO cycloalkyl;
(C) bis(oxazole) ligands of the formula
Figure imgf000033_0002
wherein Rj, R2 are the same as or different from one another and each is independently selected from among H, Ci-C5 alkyl, C6-Ci0 aryl, and C3-CO cycloalkyl;
(D) guanidine ligands of the formula
Figure imgf000033_0003
wherein R], R2, R3, R4 are the same as or different from one another and are independently selected from among H, Ci-C5 alkyl, C6-Ci0 aryl- and C3-C6 cycloalkyl;
(E) amidine ligands of the formula
Figure imgf000034_0001
wherein Rj, R2, R3 are the same as or different from one another and are independently selected from among H, Ci-C5 alkyl, C6-Ci0 aryl, and C3-C6 cycloalkyl;
(F) cyclopentadiene ligands of the formula
Figure imgf000034_0002
wherein Ri, R2, R3, Rt, R5 are the same as or different from one another and are independently selected from among H, Q-C6 alkyl, C6-CiO aryl. Ci-Cs alkoxy, Ci-Cs alkylsilyl, or pendant ligands with additional functional group(s), which can provide further coordination to the metal center, e.g., - CH2- CH2-N(CH3)2;
(G) betadiketimine ligands of the formula
Figure imgf000034_0003
wherein R], R2, R3, R4 are the same as or different from one another and are independently selected from among Ci-C6 alkyl, C6-Ci0 aryl, silyl and Ci-C8 alkylamine; and
(H) amine ligands of the formula
Figure imgf000035_0001
wherein Rj, R2 are the same as or different from one another and are independently selected from among C1-C5 alkyl, Cβ-Cio aryl, and C3-C6 cycloalkyl.
[0106] The foregoing mixed ligand barium or strontium complexes are usefully employed for deposition of conformal barium- or strontium-containing films using CVD/ALD/RVD techniques, as monomeric barium or strontium precursors that are transportable (volatile) at temperatures specific to such processes. This aspect of the invention utilizes sterically demanding ligands to generate mixed-ligand, monomeric barium or strontium complexes suitable for CVD/ALD/RVD, in which the ligands are selected from tacn (A), aminotroponimines (B), bis-oxazolines (C), guanidines (D), amidines (E), cyclopentadienes (F), beta-diketimines (G), and amines (H). Such ligands will exist in their monoanionic form once associated with the metal. The sterically demanding ligands are selected to force monomeric structures enabling compound transportation at low temperatures.
[0107] The mixed ligand complexes of the invention can be readily synthesized from the parent ligands and the metal, wherein each of the two coordinated ligands is different from one another in the complex. Such mixed ligand complexes can be utilized as reagents for barium or strontium deposition in CVD, ALD or RVD processes conducted at relatively low temperatures.
[0108] The following examples are intended to illustrate, but not limit the invention.
EXAMPLE 1
[0109] A non-limiting example for the synthesis of strontium guanidinate Sr{(/-pr)NC{N(SiMe3)2}N(^pr)}2<Et2O) is described below. To a stirring 20 ml ether suspension Of SrI2 (1.00 g, 2.93 mmol) was added Na{(z-pr)NC{N(SiMe3)2}N(z"-pr)} (1.811 g, 5.85 mmol). The mixture was stirred for 8 days and filtered through a 0.2 micron filter. The resulting filtrate was concentrated under reduced pressure to afford 1.33 grams of Sr{(i-pr)NC{N(SiMe3)2}N(r-pr)}2-(Et2O). Single crystals of
Sr{(/-pr)NC{N(SiMe3)2}N(/-pr)}2-(Et20) were grown from a concentrated pentane solution at -30 0C and an X-ray crystallographic study was carried out on a single crystal. The thermal ellipsoid plot is shown in Figure 1. EXAMPLE 2
[0110] Another non-limiting example for the synthesis of strontium guanidinate [Sr(ZPrNC(NMe2)NzPr)2J2 is described here. To a toluene or benzene solution of {Sr[N(SiMe3)2]2}2 (0.31 g, 0.38 mmol, 10 ml solvent) was added 4.0 eq of zPrN(H)C(NMe2)=NzPr (0.26 g, 1.50 mmol). On standing X-ray quality crystals of [Sr(zPrNC(NMe2)NzPr)2]2 formed overnight and were isolated by filtration in 69% yield.
[0111] Although the invention has been described with reference to the above descriptions and examples, it will be understood that modifications and variations are encompassed within the spirit and scope of the invention. Accordingly, the invention is limited only by the following claims.

Claims

What is claimed is:
1. A ligand precursor selected from the group consisting of:
(A) compounds of the formula:
Figure imgf000037_0001
wherein Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-Cs alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls;
(B) compounds of the formula:
Figure imgf000037_0002
wherein Rj and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cg-C]0 aryls and C3-C6 cycloalkyls;
(C) compounds of the formula:
Figure imgf000037_0003
wherein Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C]0 aryls and C3-C6 cycloalkyls;
(D) compounds of the formula:
Figure imgf000037_0004
wherein R] and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C]0 aryls and C3-C6 cycloalkyls; (E) compounds of the formula:
Figure imgf000038_0001
wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-C6 cycloalkyls;
(F) compounds of the formula:
Figure imgf000038_0002
wherein Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Ce-Qo aryls and C3-C6 cycloalkyls; and
(G) compounds of the formula:
Figure imgf000038_0003
wherein R' may be the same or different from one another and may be methyl or ϊPτ.
2. A metal source precursor selected from the group consisting of:
(A) compounds of the formula:
Figure imgf000039_0001
wherein:
Rjand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-CO cycloalkyls;
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(B) compounds of the formula:
Figure imgf000039_0002
wherein: each of the Ri and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Ce-Ci0 aryls and C3-CO cycloalkyls; and M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(C) compounds of the formula:
Figure imgf000039_0003
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Ce-Qo aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(D) compounds of the formula:
Figure imgf000040_0001
wherein R' may be the same or different from one another and may be methyl or zPr;
(E) compounds of the formula:
Figure imgf000040_0002
wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl;
(F) compounds of the formula:
Figure imgf000041_0001
(G) compounds of the formula:
Figure imgf000041_0002
wherein Cp* is pentamethylcyclopentadienyl.
3. A metal source precursor of claim 2, wherein M is barium.
4. A metal source precursor of claim 2, wherein M is strontium.
5. A method of making a compound of the formula:
Figure imgf000041_0003
wherein:
Riand R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, Ce-Qo aryls and C3-C6 cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 2,
the method comprising the reaction of:
Figure imgf000042_0001
wherein X is selected from the group consisting of: Cl, Br and I.
6. A method of making a compound of the formula:
Figure imgf000042_0002
wherein:
Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Cj-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 2, the method comprising the reaction of:
Figure imgf000042_0003
7. A method of making a compound of the formula:
Figure imgf000043_0001
wherein each of the Rj and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C10 aryls and C3-
Cβ cycloalkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 2, the method comprising the reaction of:
4.0 + -[MP(SiMe5J)J2I2 ftolvert + 4.Q H-N(S)Mβ3.}2
Figure imgf000043_0003
Figure imgf000043_0002
8. A method of making a compound of the formula:
Figure imgf000043_0004
wherein each of the Ri and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-Cs alkyls, Cβ-Qo aryls and C3-
Cβ cycloalkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 2, the method comprising the reaction of:
Figure imgf000044_0001
wherein X is selected from the group consisting of: Cl, Br and I.
9. A method of making a compound of the formula:
Figure imgf000044_0002
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cio aryls and C3-Ce cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 2;
the method comprising the reaction of:
Figure imgf000044_0003
wherein X is selected from the group consisting of: Cl, Br and I; and K is selected from the group consisting of K and Na.
10. A method of making a compound of the formula: 006/062713
Figure imgf000045_0001
wherein R' may be the same or different from one another and may be methyl or iPr, comprising the reaction of:
Figure imgf000045_0002
wherein R' may be the same or different from one another and may be methyl or z'Pr.
11. A method of making a compound of formula:
Figure imgf000045_0003
wherein R' may be the same or different from one another and may be methyl or /Pr and wherein Cp* is pentamethylcyclopentadienyl, comprising the reaction of:
Figure imgf000046_0001
wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl.
12. A method of making a compound of the formula:
Figure imgf000046_0002
Comprising the reaction of:
Figure imgf000046_0003
wherein R' may be the same or different from one another and may be methyl.
13. A method of making a compound of the formula:
Figure imgf000047_0001
wherein Cp* is pentamethylcyclopentadienyl, the method comprising the reaction of:
Figure imgf000047_0002
wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl.
14. A method of depositing a metal layer on a substrate surface by atomic layer deposition or rapid layer deposition, wherein at least one precursor is selected from the group consisting of:
(A) compounds of the formula:
Figure imgf000047_0003
wherein:
Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Cg-Ci0 aryls and C3-C6 cycloalkyls; and M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(B) compounds of the formula:
Figure imgf000048_0001
wherein: each of the Rj and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Ce-Q0 aryls and C3-Ce cycloaLkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(C) compounds of the formula:
Figure imgf000048_0002
wherein:
Ri, K2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Cβ-Cio aryls and C3-Ce cycloalkyls; M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, R, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(D) compounds of the formula:
Figure imgf000049_0001
wherein R' may be the same or different from one another and may be methyl or /Pr;
(E) compounds of the formula:
Figure imgf000049_0002
wherein R' may be the same or different from one another and may be methyl or j'Pr and wherein Cp* is pentamethylcyclopentadienyl;
(F) compounds of the formula:
Figure imgf000049_0003
(G) compounds of the formula:
Figure imgf000050_0001
wherein Cp* is pentamethylcyclopentadienyl.
15. The method of claim 14, wherein M is barium.
16. The method of claim 14, wherein M is strontium.
17. The method of claim 14, wherein the temperature of the ALD is less than or equal to 300 degrees Celsius.
18. The method of claim 14, wherein delivery of the at least one precursor is by solution delivery.
19. The method of claim 14, wherein delivery of the at least one precursor is by solid delivery.
20. The method of claim 14, wherein the metal layer is selected from the group comprising strontium titanate, barium titanate and strontium barium titanate.
21. A substrate coated with one or more film monolayers of one or more metals, obtained by a method selected from chemical vapor deposition, atomic layer deposition and rapid vapor deposition, wherein at least one precursor is a metal source precursor selected from the group consisting of:
(A) compounds of the formula:
Figure imgf000051_0001
wherein:
Ri and R2 may be the same as or different from one another and each is independently selected from the group consisting of: H, Q-C5 alkyls, Ce-Qo aryls and C3-C6 cycloalkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(B) compounds of the formula:
Figure imgf000051_0002
wherein: each of the Ri and R2 substituents may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-Ci0 aryls and C3-Cg cycloalkyls; and
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(C) compounds of the formula:
Figure imgf000051_0003
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, Cβ-Cιo aryls and C3-C6 cycloalkyls; M is selected from die group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is 1 to 8, dependent on the oxidation state of M;
(D) compounds of the formula:
Figure imgf000052_0001
wherein R' may be the same or different from one another and may be methyl or iPr;
(E) compounds of the formula:
Figure imgf000052_0002
wherein R' may be the same or different from one another and may be methyl or iPr and wherein Cp* is pentamethylcyclopentadienyl;
(F) compounds of the formula:
Figure imgf000053_0001
(G) compounds of the formula:
Figure imgf000053_0002
wherein Cp* is pentamethylcyclopentadienyl.
22. The substrate of claim 21 , wherein M is barium.
23. The substrate of claim 21, wherein M is strontium.
24. A ligand precursor selected from the group consisting of :
(A) compounds of the formula:
R1N=C(NR2R3)NR4M
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, Cβ-Cjo aryls and C3-Ce cycloalkyls; and M is selected from the group consisting of Na and K; and
(B) compounds of the formula: R1N=C(NR2R3)NR4H
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-Ci0 aryls and C3-C6 cycloalkyls.
25. A metal source precursor of the formula:
M[R1N=C(NR2R3)NR4L
wherein:
R1, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, C1-C5 alkyls, C6-C10 aryls and C3-C6 cycloalkyls;
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M.
26. A method of depositing a metal layer on a substrate comprising deposit of the metal on the substrate surface by atomic layer deposition or rapid vapor deposition, wherein at least one precursor is a metal source precursor of claim 25.
27. The method of claim 26, wherein the metal deposited is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Lr, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
28. The method of claim 26, wherein the temperature of the ALD is less than or equal to 300 degrees Celsius.
29. The method of claim 26, wherein delivery of the at least one precursor is by solution delivery.
30. The method of claim 26, wherein delivery of the at least one precursor is by solid delivery.
31. A substrate coated with one or more film monolayers of one or more metals, obtained by a method selected from chemical vapor deposition, atomic layer deposition and rapid vapor deposition, wherein at least one precursor is a metal source precursor selected from the group consisting of: metal source precursors of the formula:
Figure imgf000055_0001
wherein:
Ri, R2, R3 and R4 may be the same as or different from one another and each is independently selected from the group consisting of: H, Ci-C5 alkyls, C6-C10 aryls and C3-C6 cycloalkyls;
M is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os,
Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te; and x is the oxidation state of M.
32. A precursor storage and delivery apparatus comprising a vessel containing a metal source precursor as claimed in claim 2.
33. A vapor of a metal source precursor as claimed in claim 2.
34. A method of making a microelectronic device product, comprising contacting a microelectronic device substrate with a metal source precursor as claimed in claim 2, to deposit said metal on the substrate.
35. The method of claim 34, wherein said metal is selected from the group consisting of Ti, Y, Zr, Hf, Pr, Er, Yb, La, Nb, Ta, Mo, W, Ru, Os, Ca, Sr, Ba, Ir, Co, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd, Ga, Al, Ge, In, Sn, Pb, Sb, Bi, Mg, Eu, and Te.
36. The method of claim 34, wherein said contacting comprises chemical vapor deposition of said metal on the substrate.
37. The method of claim 34, wherein said contacting comprises atomic layer deposition of said metal on the substrate.
38. The method of claim 34, wherein said contacting comprises rapid vapor deposition of said metal on the substrate.
39. A mixed ligand barium or strontium complex having the general formula: X
M
Y wherein M is barium or strontium, and X and Y are each monoanionic and selected from the parent ligands (A)-(H) below, with the proviso that X and Y are different from one another:
(A) triazacyclononane-amide (tacn) ligands of the formula
Figure imgf000056_0001
wherein: Z is (CH2)2 or SiMe2; and R3, R2 and R3 are the same as or different from one another, and each is independently selected from among Ci-C5 alkyl, Cβ-Cio aryl, and C3-Ce cycloalkyl;
(B) aminotroponimine ligands of the formula
Figure imgf000057_0001
wherein Ri, R2 are the same as or different from one another and each is independently selected from among H, Ci-C5 alkyl, C6-Ci0 aryl, and C3-Cg cycloalkyl;
(C) bis(oxazole) ligands of the formula
Figure imgf000057_0002
wherein R], R2 are the same as or different from one another and each is independently selected from among H, Cx-C5 alkyl, C6-Ci0 aryl> and C3-C6 cycloalkyl;
(D) guanidine ligands of the formula
Figure imgf000057_0003
wherein R1, R2, R3, R4 are the same as or different from one another and are independently selected from among H, Q-C5 alkyl, C6-Ci0 aryl. and C3-C6 cycloalkyl;
(E) amidine ligands of the formula
Figure imgf000058_0001
wherein Ri, R2, R3 are the same as or different from one another and are independently selected from among H, Q-C5 alkyl, C6-Q0 aryl, and C3-C6 cycloalkyl;
(F) cyclopentadiene ligands of the formula
Figure imgf000058_0002
wherein Rj, R2, R3, R4, R5 are the same as or different from one another and are independently selected from among H, Ci-C6 alkyl, C6-Ci0 aryl, Ci-Cg alkoxy, Ci-Cg alkylsilyl, and pendant ligands with additional functional group(s) that can provide further coordination to the metal center;
(G) betadiketimine ligands of the formula
Figure imgf000058_0003
wherein Ri, R2, R3, R4 are the same as or different from one another and are independently selected from among CrC6 alkyl, C6-Ci0 aryl, silyl and CrC8 alkylamine; and
(H) amine ligands of the formula
Figure imgf000059_0001
wherein Rj, R2 are the same as or different from one another and are independently selected from among Ci-C5 alkyl, Cg-C10 aryl, and C3-C6 cycloalkyl.
PCT/US2006/062713 2006-12-05 2006-12-29 Metal aminotroponiminates, bis-oxazolinates and guanidinates WO2008069821A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/517,901 US20110060165A1 (en) 2006-12-05 2006-12-29 Metal aminotroponiminates, bis-oxazolinates and guanidinates

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86856406P 2006-12-05 2006-12-05
US60/868,564 2006-12-05

Publications (1)

Publication Number Publication Date
WO2008069821A1 true WO2008069821A1 (en) 2008-06-12

Family

ID=39492513

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/062713 WO2008069821A1 (en) 2006-12-05 2006-12-29 Metal aminotroponiminates, bis-oxazolinates and guanidinates

Country Status (3)

Country Link
US (1) US20110060165A1 (en)
TW (1) TW200825200A (en)
WO (1) WO2008069821A1 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102199166A (en) * 2011-04-11 2011-09-28 南京航空航天大学 Functional alkoxyl rear-earth metal lanthanum coordination compound, synthesis method thereof and application thereof
WO2012076356A1 (en) 2010-12-07 2012-06-14 L'air Liquide,Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Novel diazacrown barium and strontium precursors for vapor phase deposition of thin film
EP2468756A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel diazacrown strontium precursors for vapor phase deposition of thin films
EP2468753A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Strontium precursors for vapor phase deposition of thin films
EP2468757A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel diazacrown barium precursors for vapor phase deposition of thin films
EP2468755A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel barium precursors for vapor phase deposition of thin films
EP2708543A1 (en) 2012-09-17 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Salen-type strontium precursors for vapor phase deposition of thin films
EP2708542A1 (en) 2012-09-17 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Salen-type barium precursors for vapor phase deposition of thin films
EP2708545A1 (en) 2012-09-18 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Pentadienyl strontium-organic compounds and their use for thin films deposition
EP2708544A1 (en) 2012-09-18 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Pentadienyl barium-organic compounds and their use for thin films deposition

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101499260B1 (en) 2006-05-12 2015-03-05 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 low temperature deposition of phase change memory materials
KR101279925B1 (en) 2006-11-02 2013-07-08 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Antimony and germanium complexes useful for cvd/ald of metal thin films
KR20100038211A (en) 2007-06-28 2010-04-13 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 Precursors for silicon dioxide gap fill
US20090215225A1 (en) 2008-02-24 2009-08-27 Advanced Technology Materials, Inc. Tellurium compounds useful for deposition of tellurium containing materials
US8674127B2 (en) 2008-05-02 2014-03-18 Advanced Technology Materials, Inc. Antimony compounds useful for deposition of antimony-containing materials
WO2010065874A2 (en) 2008-12-05 2010-06-10 Atmi High concentration nitrogen-containing germanium telluride based memory devices and processes of making
TW201132787A (en) 2010-03-26 2011-10-01 Advanced Tech Materials Germanium antimony telluride materials and devices incorporating same
US9190609B2 (en) 2010-05-21 2015-11-17 Entegris, Inc. Germanium antimony telluride materials and devices incorporating same
WO2014070682A1 (en) 2012-10-30 2014-05-08 Advaned Technology Materials, Inc. Double self-aligned phase change memory device structure
US10155783B2 (en) 2013-05-28 2018-12-18 Merck Patent Gmbh Manganese complexes and use thereof for preparing thin films
KR20190009245A (en) * 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. Methods for forming a semiconductor device structure and related semiconductor device structures

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4962214A (en) * 1988-05-11 1990-10-09 Massachusettes Institute Of Technology Catalytic enantioselective addition of hydrocarbon equivalents to alpha, beta-unsaturated carbonyl compounds
US5453494A (en) * 1990-07-06 1995-09-26 Advanced Technology Materials, Inc. Metal complex source reagents for MOCVD
US6646122B1 (en) * 2000-02-29 2003-11-11 Unilever Home & Personal Care Usa, Division Of Conopco, Inc. Ligand and complex for catalytically bleaching a substrate

Family Cites Families (89)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2326107A (en) * 1940-05-28 1943-08-03 American Cyanamid Co Guanidine ammonium ferrocyanide
US2839421A (en) * 1955-04-06 1958-06-17 Du Pont An alkoxy aluminum chelate, a dispersion of it in an organic liquid and a water repellant porous object
US3076834A (en) * 1960-03-04 1963-02-05 Dow Chemical Co Chelate-phenol adducts
US3356527A (en) * 1964-04-23 1967-12-05 Ross W Moshier Vapor-plating metals from fluorocarbon keto metal compounds
US3437516A (en) * 1966-04-28 1969-04-08 Us Air Force Vapor deposition from perfluoroorganometallic compounds
US3594216A (en) * 1969-06-19 1971-07-20 Westinghouse Electric Corp Vapor phase deposition of metal from a metal-organic beta-ketoamine chelate
US4147556A (en) * 1972-01-12 1979-04-03 Ppg Industries, Inc. Nonflammable beta diketonate composition
US3988332A (en) * 1974-05-20 1976-10-26 E. I. Du Pont De Nemours And Company Hydrocarbylidene compounds of niobium and tantalum
US4529427A (en) * 1977-05-19 1985-07-16 At&T Bell Laboratories Method for making low-loss optical waveguides on an industrial scale
US4401474A (en) * 1979-12-03 1983-08-30 Ppg Industries, Inc. Pyrolytic coating reactant for defect and durability control
US4281037A (en) * 1980-08-08 1981-07-28 Dap, Inc. Cleaning and priming composition containing titanium acetylacetonate and method
JPS58203443A (en) * 1982-05-24 1983-11-26 Hitachi Ltd Composition used for correcting of white spot defect of photomask
JPS60140880A (en) * 1983-12-28 1985-07-25 Hitachi Ltd Manufacture of solar cell
FR2575936B1 (en) * 1985-01-15 1987-02-13 Rhone Poulenc Spec Chim PROCESS FOR THE PURIFICATION OF AQUEOUS SOLUTIONS OF RARE EARTH SALTS BY LIQUID-LIQUID EXTRACTION
US4898842A (en) * 1986-03-03 1990-02-06 International Business Machines Corporation Organometallic-derived cordierite and other compounds comprising oxides of silicon
JP2729373B2 (en) * 1987-01-07 1998-03-18 東京応化工業 株式会社 Coating solution for metal oxide film formation
US4948623A (en) * 1987-06-30 1990-08-14 International Business Machines Corporation Method of chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl/metal complex
US5034372A (en) * 1987-12-07 1991-07-23 Mitsubishi Denki Kabushiki Kaisha Plasma based method for production of superconductive oxide layers
JP2615469B2 (en) * 1988-04-21 1997-05-28 松下電器産業株式会社 Method for producing metal sulfide thin film
US4927670A (en) * 1988-06-22 1990-05-22 Georgia Tech Research Corporation Chemical vapor deposition of mixed metal oxide coatings
US4960916A (en) * 1989-09-29 1990-10-02 United States Of America As Represented By The Secretary Of The Navy Organometallic antimony compounds useful in chemical vapor deposition processes
US5094701A (en) * 1990-03-30 1992-03-10 Air Products And Chemicals, Inc. Cleaning agents comprising beta-diketone and beta-ketoimine ligands and a process for using the same
US5120703A (en) * 1990-04-17 1992-06-09 Alfred University Process for preparing oxide superconducting films by radio-frequency generated aerosol-plasma deposition in atmosphere
US5225561A (en) * 1990-07-06 1993-07-06 Advanced Technology Materials, Inc. Source reagent compounds for MOCVD of refractory films containing group IIA elements
US5820664A (en) * 1990-07-06 1998-10-13 Advanced Technology Materials, Inc. Precursor compositions for chemical vapor deposition, and ligand exchange resistant metal-organic precursor solutions comprising same
US5280012A (en) * 1990-07-06 1994-01-18 Advanced Technology Materials Inc. Method of forming a superconducting oxide layer by MOCVD
US6111124A (en) * 1997-10-30 2000-08-29 Advanced Technology Materials, Inc. Lewis base adducts of anhydrous mononuclear tris(β-diketonate) bismuth compositions for deposition of bismuth-containing films, and method of making the same
US5362328A (en) * 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5204314A (en) * 1990-07-06 1993-04-20 Advanced Technology Materials, Inc. Method for delivering an involatile reagent in vapor form to a CVD reactor
US6218518B1 (en) * 1990-07-06 2001-04-17 Advanced Technology Materials, Inc. Tetrahydrofuran-adducted group II β-diketonate complexes as source reagents for chemical vapor deposition
US6110529A (en) * 1990-07-06 2000-08-29 Advanced Tech Materials Method of forming metal films on a substrate by chemical vapor deposition
US5711816A (en) * 1990-07-06 1998-01-27 Advanced Technolgy Materials, Inc. Source reagent liquid delivery apparatus, and chemical vapor deposition system comprising same
US5840897A (en) * 1990-07-06 1998-11-24 Advanced Technology Materials, Inc. Metal complex source reagents for chemical vapor deposition
US5220044A (en) * 1990-10-24 1993-06-15 International Business Machines Corporation Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films
US5096737A (en) * 1990-10-24 1992-03-17 International Business Machines Corporation Ligand stabilized +1 metal beta-diketonate coordination complexes and their use in chemical vapor deposition of metal thin films
US5098516A (en) * 1990-12-31 1992-03-24 Air Products And Chemicals, Inc. Processes for the chemical vapor deposition of copper and etching of copper
US5187300A (en) * 1991-02-04 1993-02-16 Air Products And Chemicals, Inc. Volatile precursors for copper CVD
US5085731A (en) * 1991-02-04 1992-02-04 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
US5144049A (en) * 1991-02-04 1992-09-01 Air Products And Chemicals, Inc. Volatile liquid precursors for the chemical vapor deposition of copper
US5165960A (en) * 1991-07-29 1992-11-24 Ford Motor Company Deposition of magnesium fluoride films
DE59301905D1 (en) * 1992-04-09 1996-04-18 Doetsch Neo Plastic METHOD FOR PRODUCING A SLEEVED SLIDING BEARING AND SLIDING BEARING PRODUCED BY THIS METHOD
US5376409B1 (en) * 1992-12-21 1997-06-03 Univ New York State Res Found Process and apparatus for the use of solid precursor sources in liquid form for vapor deposition of materials
US5322712A (en) * 1993-05-18 1994-06-21 Air Products And Chemicals, Inc. Process for improved quality of CVD copper films
US5412129A (en) * 1994-06-17 1995-05-02 Dicarolis; Stephen A. Stabilization of precursors for thin film deposition
US5679815A (en) * 1994-09-16 1997-10-21 Advanced Technology Materials, Inc. Tantalum and niobium reagents useful in chemical vapor deposition processes, and process for depositing coatings using the same
US5518528A (en) * 1994-10-13 1996-05-21 Advanced Technology Materials, Inc. Storage and delivery system for gaseous hydride, halide, and organometallic group V compounds
US5707424A (en) * 1994-10-13 1998-01-13 Advanced Technology Materials, Inc. Process system with integrated gas storage and delivery unit
US5704967A (en) * 1995-10-13 1998-01-06 Advanced Technology Materials, Inc. Fluid storage and delivery system comprising high work capacity physical sorbent
US6214105B1 (en) * 1995-03-31 2001-04-10 Advanced Technology Materials, Inc. Alkane and polyamine solvent compositions for liquid delivery chemical vapor deposition
US6444264B2 (en) * 1995-03-31 2002-09-03 Advanced Technology Materials, Inc. Method for liquid delivery CVD utilizing alkane and polyamine solvent compositions
US5916359A (en) * 1995-03-31 1999-06-29 Advanced Technology Materials, Inc. Alkane and polyamine solvent compositions for liquid delivery chemical vapor deposition
US5919522A (en) * 1995-03-31 1999-07-06 Advanced Technology Materials, Inc. Growth of BaSrTiO3 using polyamine-based precursors
US6344079B1 (en) * 1995-03-31 2002-02-05 Advanced Technology Materials, Inc. Alkane and polyamine solvent compositions for liquid delivery chemical vapor deposition
US5783716A (en) * 1996-06-28 1998-07-21 Advanced Technology Materials, Inc. Platinum source compositions for chemical vapor deposition of platinum
KR0179797B1 (en) * 1995-12-29 1999-04-15 문정환 Method of forming cu thin film with bias voltage supplied
US5668054A (en) * 1996-01-11 1997-09-16 United Microelectronics Corporation Process for fabricating tantalum nitride diffusion barrier for copper matallization
US5744192A (en) * 1996-11-08 1998-04-28 Sharp Microelectronics Technology, Inc. Method of using water vapor to increase the conductivity of cooper desposited with cu(hfac)TMVS
US6303391B1 (en) * 1997-06-26 2001-10-16 Advanced Technology Materials, Inc. Low temperature chemical vapor deposition process for forming bismuth-containing ceramic films useful in ferroelectric memory devices
US5972743A (en) * 1996-12-03 1999-10-26 Advanced Technology Materials, Inc. Precursor compositions for ion implantation of antimony and ion implantation process utilizing same
US6090960A (en) * 1997-01-07 2000-07-18 Sharp Laboratories Of America, Inc. Precursor with (methoxy) (methyl) silylolefin ligand to deposit copper and method same
US5767301A (en) * 1997-01-21 1998-06-16 Sharp Microelectronics Technology, Inc. Precursor with (alkyloxy)(alkyl)-silylolefin ligand to deposit copper
US6117571A (en) * 1997-03-28 2000-09-12 Advanced Technology Materials, Inc. Compositions and method for forming doped A-site deficient thin-film manganate layers on a substrate
US5902639A (en) * 1997-03-31 1999-05-11 Advanced Technology Materials, Inc Method of forming bismuth-containing films by using bismuth amide compounds
US6153519A (en) * 1997-03-31 2000-11-28 Motorola, Inc. Method of forming a barrier layer
US5932363A (en) * 1997-10-02 1999-08-03 Xerox Corporation Electroluminescent devices
US6018065A (en) * 1997-11-10 2000-01-25 Advanced Technology Materials, Inc. Method of fabricating iridium-based materials and structures on substrates, iridium source reagents therefor
US6277436B1 (en) * 1997-11-26 2001-08-21 Advanced Technology Materials, Inc. Liquid delivery MOCVD process for deposition of high frequency dielectric materials
US6015917A (en) * 1998-01-23 2000-01-18 Advanced Technology Materials, Inc. Tantalum amide precursors for deposition of tantalum nitride on a substrate
US6284654B1 (en) * 1998-04-16 2001-09-04 Advanced Technology Materials, Inc. Chemical vapor deposition process for fabrication of hybrid electrodes
US6111122A (en) * 1998-04-28 2000-08-29 Advanced Technology Materials, Inc. Group II MOCVD source reagents, and method of forming Group II metal-containing films utilizing same
US6101816A (en) * 1998-04-28 2000-08-15 Advanced Technology Materials, Inc. Fluid storage and dispensing system
US6355562B1 (en) * 1998-07-01 2002-03-12 Advanced Technology Materials, Inc. Adhesion promotion method for CVD copper metallization in IC applications
WO2000008230A1 (en) * 1998-08-03 2000-02-17 Advanced Technology Materials, Inc. Copper precursor composition and process for manufacture of microelectronic device structures
KR20000013302A (en) * 1998-08-06 2000-03-06 최형수 Glass copper precursor for chemical vapor deposition
US6037001A (en) * 1998-09-18 2000-03-14 Gelest, Inc. Method for the chemical vapor deposition of copper-based films
US6316797B1 (en) * 1999-02-19 2001-11-13 Advanced Technology Materials, Inc. Scalable lead zirconium titanate(PZT) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material
US6086779A (en) * 1999-03-01 2000-07-11 Mcgean-Rohco, Inc. Copper etching compositions and method for etching copper
US6099903A (en) * 1999-05-19 2000-08-08 Research Foundation Of State University Of New York MOCVD processes using precursors based on organometalloid ligands
US6110530A (en) * 1999-06-25 2000-08-29 Applied Materials, Inc. CVD method of depositing copper films by using improved organocopper precursor blend
US6269979B1 (en) * 1999-10-05 2001-08-07 Charles Dumont Multi-compartmented mixing dispenser
US6399208B1 (en) * 1999-10-07 2002-06-04 Advanced Technology Materials Inc. Source reagent composition and method for chemical vapor deposition formation or ZR/HF silicate gate dielectric thin films
US6589329B1 (en) * 2000-03-09 2003-07-08 Advanced Technology Materials, Inc. Composition and process for production of copper circuitry in microelectronic device structures
US6599447B2 (en) * 2000-11-29 2003-07-29 Advanced Technology Materials, Inc. Zirconium-doped BST materials and MOCVD process forming same
US6879876B2 (en) * 2001-06-13 2005-04-12 Advanced Technology Materials, Inc. Liquid handling system with electronic information storage
US20030111014A1 (en) * 2001-12-18 2003-06-19 Donatucci Matthew B. Vaporizer/delivery vessel for volatile/thermally sensitive solid and liquid compounds
US6878641B2 (en) * 2002-10-01 2005-04-12 Advanced Technology Materials, Inc. Composition and chemical vapor deposition method for forming organic low k dielectric films
US7172646B2 (en) * 2003-04-15 2007-02-06 Air Products And Chemicals, Inc. Reactive liquid based gas storage and delivery systems
US6822107B1 (en) * 2003-08-19 2004-11-23 Advanced Technology Materials, Inc. Chemical vapor deposition precursors for deposition of copper
US7300873B2 (en) * 2004-08-13 2007-11-27 Micron Technology, Inc. Systems and methods for forming metal-containing layers using vapor deposition processes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4962214A (en) * 1988-05-11 1990-10-09 Massachusettes Institute Of Technology Catalytic enantioselective addition of hydrocarbon equivalents to alpha, beta-unsaturated carbonyl compounds
US5453494A (en) * 1990-07-06 1995-09-26 Advanced Technology Materials, Inc. Metal complex source reagents for MOCVD
US6646122B1 (en) * 2000-02-29 2003-11-11 Unilever Home & Personal Care Usa, Division Of Conopco, Inc. Ligand and complex for catalytically bleaching a substrate

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012076356A1 (en) 2010-12-07 2012-06-14 L'air Liquide,Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Novel diazacrown barium and strontium precursors for vapor phase deposition of thin film
EP2468756A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel diazacrown strontium precursors for vapor phase deposition of thin films
EP2468753A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Strontium precursors for vapor phase deposition of thin films
EP2468757A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel diazacrown barium precursors for vapor phase deposition of thin films
EP2468755A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel barium precursors for vapor phase deposition of thin films
EP2468754A1 (en) 2010-12-07 2012-06-27 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Novel diazacrown barium and strontium precursors for vapor phase deposition of thin film
CN102199166A (en) * 2011-04-11 2011-09-28 南京航空航天大学 Functional alkoxyl rear-earth metal lanthanum coordination compound, synthesis method thereof and application thereof
EP2708543A1 (en) 2012-09-17 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Salen-type strontium precursors for vapor phase deposition of thin films
EP2708542A1 (en) 2012-09-17 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Salen-type barium precursors for vapor phase deposition of thin films
EP2708545A1 (en) 2012-09-18 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Pentadienyl strontium-organic compounds and their use for thin films deposition
EP2708544A1 (en) 2012-09-18 2014-03-19 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Pentadienyl barium-organic compounds and their use for thin films deposition

Also Published As

Publication number Publication date
TW200825200A (en) 2008-06-16
US20110060165A1 (en) 2011-03-10

Similar Documents

Publication Publication Date Title
WO2008069821A1 (en) Metal aminotroponiminates, bis-oxazolinates and guanidinates
US10738008B2 (en) Nitrogen-containing ligands and their use in atomic layer deposition methods
US20170073361A1 (en) Group 11 mono-metallic precursor compounds and use thereof in metal deposition
EP2910665B1 (en) Volatile dihydropyrazinyl and dihydropyrazine metal complexes
EP2609102B1 (en) Molybdenum (iv) amide precursors and use thereof in atomic layer deposition
US8859785B2 (en) Volatile group 2 metal precursors
EP2460807A1 (en) Metal-enolate precursors for depositing metal-containing films
WO2008002546A1 (en) Metal(iv) tetra-amidinate compounds and their use in vapor deposition
JP2016540038A (en) Metal complexes containing amidoimine ligands
US9127031B2 (en) Bisamineazaallylic ligands and their use in atomic layer deposition methods
JP5690684B2 (en) Alkoxide compounds
JP2017226614A (en) Vanadium compound, raw material for forming thin film and method for producing thin film
US8680289B2 (en) Complexes of imidazole ligands
WO2007142700A1 (en) Copper (i) amidinates and guanidinates for forming copper thin films
US20130059077A1 (en) Method of Atomic Layer Deposition Using Metal Precursors
WO2012125439A2 (en) Precursors and methods for the atomic layer deposition of manganese
WO2015163090A1 (en) Alkoxide compound, raw material for forming thin film, method for producing thin film, and alcohol compound
El-Kadri et al. Film growth precursor development for metal nitrides. Synthesis, structure, and volatility of molybdenum (VI) and tungsten (VI) complexes containing bis (imido) metal fragments and various nitrogen donor ligands
WO2022196491A1 (en) Tin compound, starting material for forming thin film, thin film, method for producing thin film, and halogen compound
JP6408178B2 (en) Alkoxide compounds
EP4430054A1 (en) Precursors for deposition of bismuth-containing films
Kurek Development of Volatile Inorganic Compounds and Their Application for Chemical Vapour Deposition of Metal and Metal Oxide Thin Films

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06846856

Country of ref document: EP

Kind code of ref document: A1

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 12517901

Country of ref document: US

122 Ep: pct application non-entry in european phase

Ref document number: 06846856

Country of ref document: EP

Kind code of ref document: A1