WO2007055852A1 - Refrigeration system including thermoelectric heat recovery and actuation - Google Patents
Refrigeration system including thermoelectric heat recovery and actuation Download PDFInfo
- Publication number
- WO2007055852A1 WO2007055852A1 PCT/US2006/039598 US2006039598W WO2007055852A1 WO 2007055852 A1 WO2007055852 A1 WO 2007055852A1 US 2006039598 W US2006039598 W US 2006039598W WO 2007055852 A1 WO2007055852 A1 WO 2007055852A1
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- WO
- WIPO (PCT)
- Prior art keywords
- heat
- working fluid
- transferring
- thermoelectric device
- fluid
- Prior art date
Links
- 238000005057 refrigeration Methods 0.000 title claims description 48
- 238000011084 recovery Methods 0.000 title description 2
- 239000012530 fluid Substances 0.000 claims abstract description 183
- 238000007906 compression Methods 0.000 claims abstract description 42
- 239000013589 supplement Substances 0.000 claims abstract description 8
- 239000002918 waste heat Substances 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 40
- 239000007789 gas Substances 0.000 claims description 32
- 239000000314 lubricant Substances 0.000 claims description 24
- 230000006835 compression Effects 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 10
- 238000004146 energy storage Methods 0.000 claims description 7
- 239000013529 heat transfer fluid Substances 0.000 claims 25
- 238000005482 strain hardening Methods 0.000 claims 5
- 238000004378 air conditioning Methods 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 9
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000003750 conditioning effect Effects 0.000 abstract description 4
- 239000002470 thermal conductor Substances 0.000 description 42
- 239000003570 air Substances 0.000 description 32
- 238000010586 diagram Methods 0.000 description 10
- 239000000284 extract Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 6
- 239000012080 ambient air Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 239000003507 refrigerant Substances 0.000 description 5
- 230000005679 Peltier effect Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000005678 Seebeck effect Effects 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000295 complement effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001143 conditioned effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007791 dehumidification Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000003920 environmental process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000010687 lubricating oil Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- WFIZEGIEIOHZCP-UHFFFAOYSA-M potassium formate Chemical compound [K+].[O-]C=O WFIZEGIEIOHZCP-UHFFFAOYSA-M 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000009469 supplementation Effects 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
- 238000013169 thromboelastometry Methods 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B1/00—Compression machines, plants or systems with non-reversible cycle
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B27/00—Machines, plants or systems, using particular sources of energy
- F25B27/02—Machines, plants or systems, using particular sources of energy using waste heat, e.g. from internal-combustion engines
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B6/00—Compression machines, plants or systems, with several condenser circuits
- F25B6/02—Compression machines, plants or systems, with several condenser circuits arranged in parallel
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
- Y02A30/27—Relating to heating, ventilation or air conditioning [HVAC] technologies
- Y02A30/274—Relating to heating, ventilation or air conditioning [HVAC] technologies using waste energy, e.g. from internal combustion engine
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
- Y02A40/90—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in food processing or handling, e.g. food conservation
- Y02A40/963—Off-grid food refrigeration
Definitions
- the present teachings relate to vapor compression circuits, and more particularly to a vapor compression circuit associated with a thermoelectric device.
- Refrigeration systems incorporating a vapor-compression cycle may be utilized to condition the environment of open or closed compartments or spaces.
- the vapor-compression cycle utilizes a compressor to compress a phase-changing working fluid (e.g., a refrigerant), which is then condensed, expanded and evaporated. Compressing the working fluid generates heat, which, in cooling applications, is waste heat that is discharged to ambient from the compressor and condenser. Because the waste heat is not used or recovered, the lost energy of the waste heat represents an inefficiency of most refrigeration systems.
- a phase-changing working fluid e.g., a refrigerant
- an air flow may be chilled to a very low temperature to reduce the humidity.
- the low temperature required to remove humidity may be too low for the conditioned space or compartment within a space or compartment to be.
- the dehumidified chilled air may be reheated by electric radiant heat or hot-gas bypass heat to an appropriate temperature while maintaining the low humidity level.
- radiant electrical heat and a hot gas bypass heat to reheat over- chilled air represents inefficiencies in this type of cooling application.
- a vapor-compression cycle or circuit may be used to meet the temperature or load demands for conditioning one or more spaces or compartments.
- Waste heat generated by components of the vapor-compression circuit may be used to generate an electric current that may power other components of the vapor-compression circuit.
- a thermoelectric device may be placed in heat-transferring relation with the generated waste heat and produce the electrical current, which may be used to generate an electric current to power another device or another thermoelectric device.
- the other devices may include sensors, switches, controllers, fans, valves, actuators, pumps, compressors, etc.
- the other thermoelectric device may provide cooling or heating of a fluid in heat- transferring relation therewith to supplement the vapor-compression circuit and facilitate the conditioning of the space or compartment.
- the utilization of the generated waste heat as an energy source for powering other components or loads may improve the efficiency of the system.
- the present teachings disclose a method of operating a refrigeration system including transferring heat generated in the system through a thermoelectric device, generating an electric current with the heat flowing through the thermoelectric device, and powering a load with the generated electric current.
- the load may be another device or another thermoelectric device.
- a refrigeration system may be operated by supplying power to a thermoelectric device in a heat-transferring relation with a working fluid flowing through a vapor-compression circuit downstream of a condenser.
- a first heat flow may be generated with the thermoelectric device.
- the first heat flow may be transferred to a first fluid medium.
- a second heat flow may be transferred from the first fluid medium to a second fluid medium.
- FIGS 1-3 are schematic diagrams of the use of thermoelectric devices according to the present teachings.
- FIG. 4 is a schematic diagram of a thermoelectric device according to the present teachings.
- FIG. 5 is a schematic diagram of a compressor with thermoelectric devices according to the present teachings.
- Figure 6 is a schematic diagram of a top portion of another compressor with a thermoelectric device according to the present teachings;
- Figure 7 is a schematic diagram of a bank of compressors and a thermoelectric device according to the present teachings;
- Figure 8 is a schematic diagram of a refrigeration system according to the present teachings.
- Figure 9 is a schematic diagram of a refrigeration system according to the present teachings.
- Figure 10 is a schematic diagram of a refrigeration system according to the present teachings.
- Figures 11-13 are schematic diagrams of heat pump systems according to the present teachings.
- Figure 14 is a schematic diagram of a refrigeration system according to the present teachings.
- thermoelectric elements or devices are solid-state devices that convert electrical energy into a temperature gradient, known as the "Peltier effect,” or convert thermal energy from a temperature gradient into electrical energy, known as the “Seebeck effect.” With no moving parts, thermoelectric devices are rugged, reliable and quiet.
- thermoelectric device In use, power is applied from a battery or other DC source to the thermoelectric device, which will have a relatively lower temperature on one side, a relatively higher temperature on the other side, and a temperature gradient therebetween.
- the lower and higher relative temperature sides are referred herein as a “cold side” and “hot side,” respectively. Further, the terms “cold side” and “hot side” may refer to specific sides, surfaces or areas of the thermoelectric devices.
- the hot and cold sides of the thermoelectric device may be placed in heat-transferring relation with two mediums. When power is applied to the thermoelectric device, the resulting temperature gradient will promote heat flow between the two mediums through the thermoelectric device.
- one side of the thermoelectric device may be placed in heat-transferring relation with a relatively higher temperature medium providing a heat source and the other side placed in heat-transferring relation with a relatively lower temperature medium providing a heat sink, whereby the resulting hot and cold sides generate electric current.
- the term "heat transfer medium” may be a solid, a liquid or a gas through which heat may be transferred to/from.
- Thermoelectric devices can be acquired from various suppliers. For example, Kryotherm USA of Carson City, Nevada is a source for thermoelectric devices.
- thermoelectric devices may generate electric current from waste heat generated in a vapor-compression circuit using the "Seebeck effect.”
- the electric current generated may be used to power other electrical devices or other thermoelectric devices, which may generate a temperature gradient using the "Peltier effect” to transfer heat therethrough.
- a power supply may be used to supply a current flow to a thermoelectric device to provide a desired temperature gradient thereacross through the "Peltier effect” and transfer heat therethrough to a desired medium.
- thermoelectric device 20a uses waste or excess heat Q was t e to generate an electric current I that is used to form a temperature gradient across a second thermoelectric device 20b to produce recovered heat Q re covered- Hot side 22a of thermoelectric device 20a is in heat- transferring relation to a source of waste heat Q waste - Cold side 24a of thermoelectric device 20a is in heat-transferring relation to a heat sink that Q waste can be expelled thereto.
- thermoelectric device 20a The temperature gradient formed across first thermoelectric device 20a generates an electric current I that is supplied to a second thermoelectric device 20b.
- the electric current flowing therethrough generates a temperature gradient across second thermoelectric device 20b resulting in a hot side 22b and a cold side 24b.
- the temperature gradient causes a recovered heat Qrecov e red to flow through thermoelectric device 20b.
- Hot side 22b of second thermoelectric device 20b is in heat-transferring relation with a medium into which recovered heat Qrecovered is conducted, while cold side 24b of second thermoelectric device 20b is in heat-transferring relation to a heat source.
- thermoelectric device 20 is exposed to waste heat Qw aste to cause a second thermoelectric device 20b to generate recovered heat Qre co v e r ed -
- the electric current generated by a thermoelectric device 20 may also be used to activate or drive an electrical device or meet an electrical load (hereinafter referred to as load 26 and/or "L") as shown in Figure 2.
- load 26 and/or "L" an electrical load
- waste heat Qw a s te is utilized to generate a temperature differential between hot and cold sides 22, 24 and generate electric current I.
- thermoelectric device 20 is placed in heat-transferring relation to a source of waste heat Qwaste and a heat sink to generate electric current I that is used to power load 26.
- Load 26 is utilized generically herein to refer to any type of device requiring an electric current.
- Such devices include compressors, pumps, fans, valves, solenoids, actuators, sensors, controllers and other components of a refrigeration system.
- the sensors may include, such as by way of non-limiting example, pressure sensors, temperature sensors, flow sensors, accelerometers, RPM sensors, position sensors, resistance sensors, and the like and may be represented by “S” in the drawings.
- the various valves, solenoids and actuators may be represented by "V” in the drawings.
- a power supply 28 is connected to a thermoelectric device 20 to generate a desired heat Qd es ir e d-
- Power supply 28 may supply a current flow I to thermoelectric device 20 to cause a temperature gradient to be formed between hot and cold sides 22, 24.
- the temperature gradient generates a desired heat Q des i red -
- Hot side 22 may be placed in heat- transferring relation with a medium into which heat Q des ir ed is conducted.
- Power supply 28 may modulate current flow I to maintain a desired temperature gradient and produce a desired heat Q des ir ed -
- a power supply 28 provides an electric current I within thermoelectric device 20, which generates a source of desired heat Qdesired-
- Thermal enhancing devices or thermal conductors 30, 32 may be placed in heat-transferring relation with sides 22, 24 of one or more thermoelectric devices 20 to enhance or facilitate heat transfer through the thermoelectric device 20 and a medium, as shown in Figure 4.
- a thermoelectric device 20 having one or more thermal conductors 30, 32 is referred to herein as a thermoelectric module (TEM) 33, which may include multiple thermoelectric devices 20.
- Thermal conductors 30, 32 may be referred to herein as hot and cold thermal conductors 30, 32, respectively. It should be appreciated, that the terms “hot” and “cold” are relative terms and serve to indicate that that particular thermal conductor is in heat-transferring relation with the respective hot or cold side of a thermoelectric device 20.
- Heat transfer may be enhanced by increasing the heat- conductive surface area that is in contact with the medium into which the heat is to be conducted.
- micro-channel tubing may accomplish the enhancing of the heat flow.
- the fluid medium flows through the micro channels therein and the hot or cold side of the thermoelectric device is placed in heat- transferring contact with the exterior surface of the tubing.
- the thermal conductor may be in the form of fins which may accomplish the enhancement of the heat transfer to/from the medium.
- the thermal conductor may be shaped to match a contour of a heat source.
- the thermal conductor may have one surface curved so that it is complementary to the surface of the solid through which the heat is to be conducted while the other side of the thermal conductor is complementary to the hot or cold side of the thermoelectric device 20.
- Thermal conductors 30, 32 may include materials, layers or coatings having a high thermal conductivity whereby heat transfer through the thermoelectric device 20 is conducted efficiently.
- materials having a high thermal conductivity include aluminum, copper and steel.
- heat-conducting adhesives may also be used as thermal conductors 30, 32. Regardless of the form, the thermal conductors 30, 32 have a high thermal conductivity.
- a compressor 34 compresses a relatively cool working fluid (e.g., refrigerant) in gaseous form to a relatively high temperature, high-pressure gas.
- the compressing process generates waste heat Q wa s te that is conducted through the compressor to ambient.
- Waste heat Qw ast e may be utilized by a thermoelectric device 20 to power another thermoelectric device 20, and/or a load 26.
- FIG. 5 a schematic view of portions of an exemplary compressor, in this case an orbital scroll compressor 34 by way of a non-limiting example, generally includes a cylindrical hermetic shell 37 having welded at the upper end thereof a cap 38 and at the lower end thereof a base 58.
- a refrigerant discharge passage 39 which may have a discharge valve (not shown) therein, is attached to cap 38.
- Other major elements affixed to shell 37 include a transversely extending partition 40 that is welded about its periphery at the same point that cap 38 is welded to shell 37, upper and lower bearing assemblies (not shown) and a motor stator 41 press-fitted therein.
- a driveshaft or crankshaft 42 is rotatably journalled in the upper and lower bearing assemblies.
- the lower portion of shell 37 forms a sump 43 that is filled with lubricating oil which gets internally distributed throughout compressor 34 during operation.
- Crankshaft 42 is rotatably driven by an electric motor including stator 41, with windings passing therethrough, and a rotor 44 press-fitted on crankshaft 42. Upper and lower surfaces of rotor 44 have respective upper and lower counterweights 45, 46 thereon.
- An Oldham coupling (not shown) couples crankshaft 42 to an orbiting scroll member 47 having a spiral vane or wrap 48 on the upper surface thereof.
- a nonorbiting scroll member 49 is also provided having a wrap 50 positioned in meshing engagement with wrap 48 of orbiting scroll member 47.
- Nonorbiting scroll member 49 has a center-disposed discharge passage 51 that is in fluid communication with a discharge muffler chamber 52 defined by cap 38 and partition 40.
- Compressor 34 also includes numerous sensors, diagnostic modules, printed circuit board assemblies, solenoids, such as internal and external capacity modulation solenoids, switches, such as a switch to change resistance of motor 36 to provide a first resistant for start-up and a second resistance for continuous operation, and other electrically-actuated devices or loads 26. These electrical devices may be internal or external to the compressor and may be stationary or rotating with the rotating components of the compressor.
- motor 36 causes rotor 44 to rotate relative to stator 41 , which causes crankshaft 42 to rotate.
- Rotation of crankshaft 42 causes orbiting scroll member 47 to orbit relative to nonorbiting scroll member 49.
- Working fluid within suction chamber 54 is pulled into the space between wraps 48, 50 and progresses toward the central portion due to the relative movement therebetween.
- a TEM 33a which may be attached to rotor 44, includes a thermoelectric device 20a with hot side 22a.
- Hot side 22a is in heat-transferring relation to rotor 44 while cold side 24a is in heat-transferring relation with the lubricant and working fluid within suction chamber 54.
- the temperature differential between the hot and cold sides 22a, 24a causes a heat Q a to flow through TEM 33a, which generates an electric current that is supplied to a load 26a.
- TEM 33a powers load 26a that is also rotating with rotor 44 or shaft 42.
- load 26a may include a resistance switch that changes the resistance of the rotor so that a higher resistance is realized for a startup and a lower resistance is realized during nominal operation, a temperature sensor, an RPM sensor, and the like.
- TEM 33a is shown as being attached to the upper portion of rotor 44, it should be appreciated that TEM 33a can be attached to other portions of rotor 44, such as a middle, lower or internal portion, made integral with upper or lower counterweight 45, 46, or in direct contact with lubricant within sump 43.
- Partition 40 which separates the relatively hot discharge gas within discharge chamber 52 from the relatively cooler suction gas within suction chamber 54, conducts waste heat Qwaste, which may be used to generate electrical power within a thermoelectric device 20.
- waste heat Q b may be transferred from partition 40 through TEM 33b and into the suction gas within suction chamber 54. Waste heat Q b generates an electric current in thermoelectric device 20b of TEM 33b.
- TEM 33b may be connected to an internal electric load 26bi or an external electric load 26b 2 .
- TEM 33b may be attached in a fixed manner to a stationary component, such as partition 40, which facilitates the attachment to stationary loads either internal or external to compressor 34.
- a stationary component such as partition 40
- thermoelectric device 20 By positioning thermoelectric device 20 in heat-transferring relation with a stationary component conducting waste heat Qwas t e, an electric current to power a load 26 either internal or external to compressor 34 may be generated.
- Waste heat Qw as t e from the relatively hot discharge gas within discharge chamber 52 is conducted through cap 38 to the ambient environment within which compressor 34 is located.
- a TEM 33c may be attached to cap 38 with a hot thermal conductor 30c in heat-transferring relation with the exterior surface of cap 38 and the cold thermal conductor 32c in heat-transferring relation with the ambient environment.
- cold thermal conductor 32c includes fins over which the ambient air flows and hot thermal conductor 30c includes a contoured surface matched to the exterior contour of cap 38.
- Hot thermal conductor 30c has a greater surface area in contact with cap 38 than in contact with hot side 22c of thermoelectric device 20c.
- the temperature differential between the ambient air and cap 38 causes waste heat Q 0 to flow through TEM 33c and generate an electric current that powers load 26c, which may be external (26ci) or internal (26c 2 ) to compressor 34.
- Thermoelectric device 20 may be placed in heat-transferring relation to the relatively hot discharge gas in discharge chamber 52 (via cap 38) and the relatively cold ambient environment to provide a temperature gradient that may be used to generate electric current to power a load.
- thermoelectric device 2Od of TEM 33d generates electric current that may be used to power load 26d.
- a thermoelectric device 20 may be disposed in heat-transferring relation to the relatively hot gas within the discharge passage and the ambient environment to generate an electric current that can be used to power a load.
- a TEM 33e may be attached to orbiting-scroll member 47 adjacent or opposite to discharge passage 51. Specifically, hot thermal conductor 3Oe of TEM 33e is placed in heat-transferring relation to a bottom surface of orbiting scroll member 47 generally opposite discharge passage 51.
- Cold thermal conductor 32e of TEM 33e is disposed in heat-transferring relation to the suction gas and lubricant flowing within suction chamber 54.
- the thermoelectric device 2Oe of TEM 33e generates electric current that may be used to power load 26e.
- a thermoelectric device 20 may be disposed in heat-transferring relation to the discharge gas and suction gas adjacent the orbiting scroll member to generate electric current that can be used to power a load.
- stator 41 During operation, stator 41 generates waste heat Q f that is transferred to the internally distributed lubricant and/or suction gas in the suction chamber 54.
- a TEM 33f may be attached to stator 41 with the hot thermal conductor 3Of in heat-transferring relation to stator 41 and cold thermal conductor 32f is in heat-transferring relation to the lubricant and/or suction gas in suction chamber 54.
- the temperature differential between stator 41 and the lubricant and/or suction gas within suction chamber 54 causes waste heat Q f to flow through TEM 33f, wherein thermoelectric device 2Of generates electric current that may be used to power load 26f.
- TEM 33f is shown as being attached to the upper portion of stator 41 , it should be appreciated that TEM 33f can be attached to other portions of stator 41 , such as a middle, lower or internal portion, or in direct contact with lubricant within sump 43.
- a thermoelectric device may be disposed in heat-transferring relation to the stator and the lubricant or suction gas to generate electric current that can be used to power a load.
- the lubricant within sump 43 of compressor 34 is relatively hot (relative to the ambient environment) and heat waste Q 9 is conducted from the lubricant through shell 37 to the ambient environment.
- a TEM 33g may be positioned with cold thermal conductor 32g in heat-transferring relation to the ambient environment and hot thermal conductor 3Og in heat-transferring relation to the lubricant within sump 43. This may be accomplished by integrating TEM 33g within the wall of shell 37.
- the temperature differential between the lubricant and ambient causes waste heat Q 9 to flow through thermoelectric device 20g in TEM 33g and generate electric current that may be used to power load 26g.
- a thermoelectric device 20 disposed in heat-transferring relation to the relatively hot lubricant and relatively cool ambient environment may be used to generate electric current to power a load.
- FIG. 6 a partial schemataic view of a top portion of another exemplary compressor, in this case an orbital scroll compressor 34' having a direct discharge by way of non-limiting example is shown.
- Compressor 34' is similar to compressor 34 discussed above with reference to Figure 5.
- discharge passage 39' communicates directly with discharge passage 51' of non-orbiting scroll member 49' such that the compressed working fluid (discharge gas) flows directly into discharge passage 39' from discharge passage 51'.
- a muffler 56' is attached to discharge passage 39'. The relatively hot compressed working fluid flows through muffler 56'.
- Waste heat Qwaste from the relatively hot discharge gas within muffler 56' is conducted through the walls of muffler 56' to the ambient environment within which compressor 34' is located.
- a TEM 33' may be attached to muffler 56' with hot thermal conductor 30' in heat-transferring relation with the exterior surface of muffler 56' and cold thermal conductor 32' in heat-transferring relation with the ambient environment.
- Cold thermal conductor 32' may include fins over which the ambient air flows and hot thermal conductor 30' may include a contoured surface matched to the exterior contour of muffler 56' to facilitate heat transfer.
- the temperature differential between the ambient air and muffler 56' causes waste heat Q to flow through TEM 33' and generate an electric current that powers load 26'.
- thermoelectric device 20' may be placed in heat- transferring relation to the relatively hot discharge gas in muffler 56' (via the exterior surface of muffler 56') and the relatively cold ambient environment to provide a temperature gradient that may be used to generate electric current to power a load.
- a multi-compressor system 60 including compressors 34i-34 n are arranged in parallel with the relatively hot, high- pressure discharge gas from each compressor 34 flowing into a common discharge manifold 61 is shown.
- the temperature differential between the discharge gas and ambient causes waste heat Q to flow from the discharge gas to the ambient environment through manifold 61.
- Positioning a TEM 33 adjacent discharge manifold 61 with a hot thermal conductor 30 in heat-transferring relation to discharge manifold 61 and cold thermal conductor 32 in heat- transferring relation to the ambient air about discharge manifold 61 may generate electric current from waste heat Q flowing through thermoelectric device 20 within TEM 33.
- the electric current may be used to power load 26.
- a thermoelectric device may be positioned between the relatively hot discharge gas in the manifold and the ambient environment to generate an electric current from the waste heat Q to power a load 26.
- an exemplary refrigeration system 64 includes a compressor 65, a condenser 66, an expansion device 67 and an evaporator 68 all connected together to thereby form a vapor-compression circuit 69.
- Condenser 66 transfers a heat Q 3 from the relatively hot working fluid flowing therethrough to an airflow flowing there across and condenses the working fluid.
- Evaporator 68 is operable to extract a heat flow Q 4 from an airflow flowing there across and transfer it to the relatively cool and expanded working fluid flowing therethrough.
- Refrigeration system 64 includes various loads 26 that require electricity to operate.
- Loads 26 may include electrically driven fans 70, 71 which push air across condenser 66 and evaporator 68, respectively, various valves, solenoids or actuators 72 and various sensors 73.
- load 26 may include a controller 74, which may be used to control or communicate with valves 72, sensors 73, compressor 65, fans 70, 71 and other components of refrigeration system 64.
- the various power requirements of refrigeration system 64 may be met by a power distribution member 75 which supplies current to power the various loads 26 of refrigeration system 64.
- the power demands of the various loads 26 may be provided by a power supply 76, which may provide both AC current and DC current, through power-distribution block 75.
- the electric current may be supplied by individual connections directly to power supply 76, through one or more power distribution devices, and/or through controller 74.
- Waste heat Qwa ste generated by refrigeration system 64 may be conducted to one or more thermoelectric devices 20 to generated electric current supplied to load 26.
- a TEM 33a may capture waste heat Qi from compressor 65 and generate current I supplied to power-distribution block 75.
- TEM 33b may extract waste heat Q 2 from the relatively high-temperature working fluid flowing through vapor-compression circuit 69, particularly compressed working fluid that has not been condensed, and generate current I supplied to power-distribution block 75.
- a TEM 33 will not produce power to supply load 26. Rather, during startup, power may be supplied by power supply 76. Once refrigeration system 64 reaches steady state (nominal) operation, waste heat Qw aste will be generated and TEM 33 may produce electric current.
- An energy-storage device 78 may provide temporary startup power to one or more components of refrigeration system 64. Energy-storage devices, such as rechargeable batteries, ultra capacitors, and the like, may store a sufficient quantity of power to meet the requirements, particularly at system startup, of some or all of the components of refrigeration system 64 up until the time TEM 33 is able to produce sufficient current to power those components. Excess current generated by TEM 33 may be utilized to recharge energy-storage device 78 for a subsequent startup operation. Thus, energy storage device 78 may be part of load 26.
- thermoelectric devices 20 may use waste heat Qwaste to generate electric current that can power various components of refrigeration system 64.
- the electric current supplied by thermoelectric devices may be used to supplement electric current from power supply 76 and/or meet the demand of the refrigeration system.
- an energy-storage device 78 may provide the initial startup power requirements of refrigeration system 64 until one or more thermoelectric devices 20 are able to replace the electrical power supplied by energy-storage device 78.
- a refrigeration system 164 includes a vapor-compression circuit 169 and TEM 133.
- TEM 133 which produces an electric current I to power a load 126, may extract heat Q 102 from the relatively high-temperature, non-condensed working fluid flowing through vapor- compression circuit 169 between compressor 165 and condenser 166, thereby de-superheating the working fluid flowing into condenser 166.
- Working fluid may exit compressor 165 at, by way of non- limiting example, 182°F and arrive at TEM 133 at about 170 0 F.
- compressor 165 may operate more efficiently or at a lower capacity or at a lower temperature, such as by way of non-limiting example 115°F.
- Thermoelectric device 20 may power load 126 while de-superheating non-condensed working fluid thereby meeting part of all of the power demand and increasing the efficiency of the system.
- a refrigeration system 264 includes a pair of thermoelectric modules 233a, 233b for subcooling the condensed working fluid exiting condenser 266.
- First thermoelectric module 233a extracts waste heat Q20 1 from compressor 265 and generates an electric current I that is supplied to second thermoelectric module 233b, which is in heat-transferring relation to vapor-compression circuit 269.
- first TEM 233a drives the temperature gradient across second TEM 233b to allow the removal of heat Q205 from condensed working fluid in vapor-compression circuit 269.
- Cold side 224b of thermoelectric device 220b is in heat-transferring relation to the condensed working fluid within vapor-compression circuit 269 exiting condenser 266, where heat Q2 05 is extracted from the condensed working fluid and transferred to the ambient.
- the flow of air caused by fan 270 may be directed over hot thermal conductor 230b of second TEM 233b.
- Second TEM 233b may remove heat Q 205 to sub-cool the condensed working fluid therein and increase the cooling capacity of refrigeration system 264.
- Condenser 266 may reduce the working fluid temperature to approximately ambient temperature and second thermoelectric module 233b may further cool the condensed working fluid to below-ambient temperature by extracting heat Q 2 os therefrom.
- the lower-temperature condensed working fluid provides a larger cooling capacity for evaporator 268, which can extract a larger quantity of heat Q 2 o 4 from the air flowing across evaporator 268, thus achieving a greater cooling capacity.
- thermoelectric module 333 is utilized to supplement the heating capacity of refrigeration system 364.
- Hot thermal conductor 330 of TEM 333 is in heat-transferring relation with a portion of the relatively high-temperature, high-pressure working fluid exiting compressor 365 and flowing through an auxiliary flow path 380.
- Cold thermal conductor 332 of TEM 333 is in heat-transferring relation with the condensed working fluid exiting condenser 366.
- Power supply 376 selectively supplies electric current to TEM 333 thereby forming a temperature gradient across TEM 333 which extracts heat Q 306 from the condensed working fluid and transfers the heat Q 306 to the portion of the relatively high-temperature, high-pressure working fluid flowing through auxiliary flow path 380, further increasing the temperature of the working fluid.
- This higher-temperature working fluid is directed through an auxiliary condenser 382 to supplement the heat transfer to the air flowing over condenser 366.
- the air flow generated by fan 370 flows over condenser 366 then auxiliary condenser 382.
- Auxiliary condenser 382 transfers heat Q 312 from the higher-temperature working fluid flowing therethrough to the air flowing thereacross, thereby increasing the temperature of the air flow and providing additional heat transfer to the air flow.
- the condensed working fluid exiting auxiliary condenser 382 joins with the condensed working fluid exiting condenser 366 prior to flowing past TEM 333.
- thermoelectric device in refrigeration system 364 transfers heat to a portion of the relatively high-temperature, high-pressure working fluid exiting the compressor which is subsequently transferred to an air flow flowing across an auxiliary condenser, thereby supplementing the overall heat transferred to the air flow.
- the electric current supplied to the thermoelectric device is modulated to provide varying levels of supplementation of the heat Q 312 transferred to the air flowing over the condenser and the auxiliary condenser.
- thermoelectric module 433 selectively transfers heat to a single-phase fluid flowing through a single-phase, heat-transfer circuit 486 which supplements the heating capacity of refrigeration system 464.
- Heat-transfer circuit 486 includes a pump 487 and a heat exchanger 483 arranged adjacent condenser 466 such that air flow generated by fan 470 flows across both condenser 466 and heat exchanger 483.
- Cold thermal conductor 432 is in heat-transferring relation with the condensed working fluid exiting condenser 466 which extracts heat Q 406 therefrom.
- Hot thermal conductor 430 is in heat-transferring relation with the single-phase fluid flowing through heat-transfer circuit 486 and transfers heat Q 4 o6 thereto.
- Power supply 476 modulates the current flowing to thermoelectric device 420 within TEM 433 to generate and maintain a desired temperature gradient thereacross, thereby resulting in a desired quantity of heat Q 406 transferred to the single-phase fluid and increasing the temperature of the single- phase fluid to a desired temperature.
- Pump 487 pumps the single-phase fluid through heat exchanger 483 which transfers heat Q 412 from the single-phase fluid to the air flowing thereacross, which raises the temperature of the air flow.
- a variety of single-phase fluids can be utilized within heat-transfer circuit 486.
- the single-phase fluid may be a potassium formate or other types of secondary heat transfer fluids, such as those available from Environmental Process Systems Limited of Cambridgeshire, UK and sold under the Tyfo® brand, and the like.
- a thermoelectric device transfers heat Q406 from the condensed working fluid exiting the condenser to a single-phase fluid flowing through a heat-transfer circuit which transfers heat Q 412 to the air flowing across heat exchanger 483.
- Refrigeration system 564 operated as a heat pump is shown.
- Refrigeration system 564 is similar to refrigeration system 464 with the addition of a second single-phase, heat-transfer circuit 588.
- Second heat-transfer circuit 588 includes a pump 589 and a subcooler 590.
- Subcooler 590 is in heat-transferring relation with condensed working fluid exiting condenser 566 and the single-phase fluid flowing through heat-transfer i circuit 588.
- Subcooler 590 transfers heat Q507 from the condensed working fluid flowing therethrough to the single-phase fluid flowing therethrough, which increases the temperature of the single-phase fluid.
- Cold thermal conductor 532 of TEM 533 is in heat-transferring relation with the single-phase fluid flowing through heat-transfer circuit 588.
- Hot thermal conductor 530 of TEM 533 is in heat-transferring relation with the single- phase fluid flowing through heat-transfer circuit 586.
- Power supply 576 modulates the current flowing to thermoelectric device 520 to maintain a desired temperature differential thereacross which transfers heat Q 508 from the single- phase fluid within heat-transfer circuit 588 to the single-phase fluid in heat- transfer circuit 586 through thermoelectric device 520.
- Heat Q 508 increases the temperature of the single-phase fluid flowing through heat-transfer circuit 586.
- Heat Q512 is transferred from the single-phase fluid flowing through heat-transfer circuit 586 to the air flowing across heat exchanger 583, thereby increasing the temperature of the air flow.
- Refrigeration system 564 uses two single-phase fluid heat-transfer circuits 586, 588 in heat-transferring relation to one another through thermoelectric device 520 to supplement the heating of the air flow flowing across condenser 566.
- Refrigeration system 664 provides a dehumidification and reheating of the cooling air provided thereby is shown.
- Refrigeration system 664 includes vapor-compression circuit 669 having a working fluid flowing therethrough.
- Evaporator 668 is operated at a very low temperature and extracts heat Q. 604 from the air flow flowing thereacross which lowers the humidity and temperature of the air flow.
- First and second heat- transfer circuits 691, 692 in heat-transferring relation through TEM 633 transfer heat to the air flow to raise the temperature thereby making the air flow suitable for its intended application.
- First heat-transfer circuit 691 includes a pump 693 and a subcooler 694 and has a single-phase fluid flowing therethrough.
- Subcooler 694 transfers heat Q ⁇ o9 from the condensed working fluid exiting condenser 666 to the single-phase fluid flowing through first heat-transfer circuit 691 which increases the temperature of the single-phase fluid.
- Cold thermal conductor 632 is in heat-transferring relation with the single-phase fluid flowing through first heat-transfer circuit 691 while hot thermal conductor 630 is in heat-transferring relation with the single-phase fluid flowing through second heat transfer circuit 692.
- Power supply 676 modulates the current flowing to thermoelectric device 620 in TEM 633 to maintain a desired temperature gradient thereacross and transfer heat Q 6 io from the single-phase fluid flowing through first heat-transfer circuit 691 to the single-phase fluid flowing through second heat-transfer circuit 692 through thermoelectric device 620.
- Heat Q 6 io increases the temperature of the single-phase fluid flowing through second heat-transfer circuit 692.
- a pump 695 pumps the single- phase fluid in second heat-transfer circuit 692 through a reheat coil 696.
- the air flow induced by fan 671 flows across both evaporator 668 and reheat coil 696.
- Reheat coil 696 transfers heat Q 6 n from the single-phase fluid flowing therethrough to the air flow flowing thereacross.
- Heat Q 6 n increases the temperature of the air flow without increasing the humidity.
- Refrigeration system 664 utilizes two single-phase heat transfer circuits 691, 692 in heat-transferring relation therebetween with a thermoelectric device to reheat an air flow dehumidified and chilled by the evaporator of the vapor compression circuit.
- compressors generate waste heat that can be utilized with one or more thermoelectric devices to generate a current flow that can be used elsewhere.
- the compressors can be either internally or externally-driven compressors and may include rotary compressors, screw compressors, centrifugal compressors, and the like.
- TEM 33g is shown as being integrated in the wall of shell 37, it should be appreciated that TEMs may be integrated into other components, if desired, to be in direct contact with a heat source or heat sink.
- condensers and evaporators are described as being coil units, it should be appreciated that other types of evaporators and condensers may be employed. Additionally, while the present teachings have been described with reference to specific temperatures, it should be appreciated that these temperatures are provided as non-limiting examples of the capabilities of the refrigeration systems. Accordingly, the temperatures of the various components within the various refrigeration systems may vary from those shown.
- thermoelectric device e.g., thermoelectric device
- additional valves, sensors, control devices and the like can be employed, as desired, in the refrigeration systems shown.
- thermal insulation may be utilized to promote a directional heat transfer so that desired hot and cold sides for the thermoelectric device are realized. Accordingly, the description is merely exemplary in nature and variations are not to be regarded as a departure from the spirit and scope of the teachings.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Applications Or Details Of Rotary Compressors (AREA)
- Compressor (AREA)
- Sorption Type Refrigeration Machines (AREA)
Abstract
Description
Claims
Priority Applications (2)
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CN2006800414763A CN101305248B (en) | 2005-11-09 | 2006-10-11 | System and method for transferring heat in steam compression loop through thermoelectric device |
EP06825719.5A EP1946015B1 (en) | 2005-11-09 | 2006-10-11 | System including a vapor-compression circuit and associated method for operating the same |
Applications Claiming Priority (2)
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US11/270,879 | 2005-11-09 | ||
US11/270,879 US20070101737A1 (en) | 2005-11-09 | 2005-11-09 | Refrigeration system including thermoelectric heat recovery and actuation |
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WO2007055852A1 true WO2007055852A1 (en) | 2007-05-18 |
WO2007055852A8 WO2007055852A8 (en) | 2007-09-27 |
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US (5) | US20070101737A1 (en) |
EP (1) | EP1946015B1 (en) |
KR (1) | KR101014217B1 (en) |
CN (2) | CN101305248B (en) |
WO (1) | WO2007055852A1 (en) |
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Also Published As
Publication number | Publication date |
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EP1946015A4 (en) | 2014-04-30 |
US20070101739A1 (en) | 2007-05-10 |
CN102278834B (en) | 2014-07-16 |
US7296416B2 (en) | 2007-11-20 |
US20070101740A1 (en) | 2007-05-10 |
US20070101737A1 (en) | 2007-05-10 |
WO2007055852A8 (en) | 2007-09-27 |
CN102278834A (en) | 2011-12-14 |
US7752852B2 (en) | 2010-07-13 |
US7240494B2 (en) | 2007-07-10 |
US20110120145A1 (en) | 2011-05-26 |
CN101305248A (en) | 2008-11-12 |
US8307663B2 (en) | 2012-11-13 |
KR20080071996A (en) | 2008-08-05 |
EP1946015A1 (en) | 2008-07-23 |
EP1946015B1 (en) | 2020-12-23 |
CN101305248B (en) | 2011-07-27 |
US20070101738A1 (en) | 2007-05-10 |
KR101014217B1 (en) | 2011-02-14 |
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