WO1993000454A1 - Diamond-covered member and production thereof - Google Patents
Diamond-covered member and production thereof Download PDFInfo
- Publication number
- WO1993000454A1 WO1993000454A1 PCT/JP1992/000804 JP9200804W WO9300454A1 WO 1993000454 A1 WO1993000454 A1 WO 1993000454A1 JP 9200804 W JP9200804 W JP 9200804W WO 9300454 A1 WO9300454 A1 WO 9300454A1
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- WIPO (PCT)
- Prior art keywords
- diamond
- base material
- substrate
- solid solution
- film
- Prior art date
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0635—Carbides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0664—Carbonitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0209—Pretreatment of the material to be coated by heating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C30/00—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
- C23C30/005—Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates
Definitions
- the present invention relates to a diamond-coated member and a method for producing the same, and more particularly, to an excellent adhesion between a base material and a diamond-film covering the same, exhibiting excellent durability, and a useful life.
- TECHNICAL FIELD The present invention relates to a diamond-coated member having significantly improved characteristics and a method for producing the same. Background art
- diamonds are used.
- diamonds are deposited on the surface of base materials such as tools and wear-resistant members by using a diamond synthesis technology based on a gas phase method such as CVD or PVD to form a diamond coating. Methods are known. By coating the base material with the diamond coating in this way, a high degree of surface hardness and wear resistance can be imparted to tools and wear-resistant members.
- an intermediate layer composed of a base material component and a carbon component is formed on the surface of a base material of various materials, and a diamond is formed on the surface of the intermediate layer by a vapor phase synthesis method.
- Attempts have been made to form a diamond film (diamond-like thin film) and improve the adhesion between the substrate and the diamond film by using an intermediate layer (Japanese Patent Laid-Open No. 60-20843). And Japanese Patent Application Laid-Open No. 61-106478.
- Japanese Patent Application Laid-open No. Sho 60-208473 and Japanese Patent Application Laid-Open No. 61-64878 disclose that a metal carbide or a nitride may be interposed between a substrate and a diamond coating.
- a method of providing an intermediate layer made of a material and a boron compound is shown. However, this method However, practically sufficient adhesion has not been obtained.
- Japanese Patent Application Laid-Open No. 6-104694 proposes a method in which a mixture of a base material component and diamond is used as an intermediate layer. However, also in this case, sufficient adhesion has not been obtained.
- the intermediate layer is required to maintain high adhesion to both the substrate and the diamond thin film, and (2) the strength of the intermediate layer itself is sufficiently high. It is extremely difficult to select the most suitable material because it must meet the strict requirements that it must be used.
- various ideas have been devised on the selection of the material of the intermediate layer and the method of forming the same as in the above-mentioned conventional method, but the diamond-coated member having the intermediate layer obtained by the conventional method has the following disadvantages. In either case, the above conditions (1) and (2) have not been fully satisfied.Especially when used under severe conditions such as cutting tools and sliding members, sufficient durability and service life cannot be obtained. There was a problem.
- Japanese Patent Publication No. 11-62-480 proposes a method of removing the metal components such as Co and Ni by treating the surface of S material made of cermet with an acid. ing.
- Japanese Patent Application Laid-Open No. 61-106494 proposes a method of removing a metal component by treating the surface of a cermet substrate with an acid.
- this method due to the difference in thermal stress between the tungsten carbide and the diamond film, sufficient adhesion of the diamond film to the substrate made of cermet cannot be obtained, and the diamond film cannot be formed at a high temperature. The disadvantage is that it easily peels off from the substrate.
- the poor adhesion between the substrate and the diamond thin film is due to the difference in their thermal expansion coefficients, and the thermal expansion coefficient of ceramics such as silicon nitride tends to change depending on its composition and sintering conditions.
- attention has been given to technologies for forming a diamond-based thin film on a ceramic-based substrate having a controlled thermal expansion coefficient see Japanese Patent Application Laid-Open Nos. Nos. 1-291493, JP-A-62-170767, etc.).
- the material and composition of the base material are limited to a very narrow range, and even if the adhesion can be improved, Sufficient properties such as hardness and fracture toughness of the material itself There is a problem that it is difficult to make.
- the diamond-coated member obtained by the conventional method does not have sufficient durability and service life as a diamond-die tool and a wear-resistant member.
- Japanese Patent Application Laid-Open No. H11-103922 proposes a method in which a substrate made of a cemented carbide is heat-treated in a vacuum in advance, and then a diamond thin film is formed thereon. Although the adhesion is improved by preliminarily heat-treating the base material in a vacuum as described above, even in this case, it has not reached a sufficient level.
- Japanese Patent Application Laid-Open No. 2-293385 the surface of a sintered body containing tungsten carbide as a main component is treated in a decarburized atmosphere to form fine tungsten carbide on the surface and improve adhesion. Techniques are disclosed. However, this method has a drawback that the composition of the substrate is limited to a relatively narrow range, and the substrate can be formed only by a high-cost method such as hot blessing.
- Japanese Patent Application Laid-Open No. 1-2646361 discloses that metals, such as carbides, nitrides, carbonates, and nitrides of metals belonging to groups 4a, 5a and 6a of the periodic table, and their mutual solid solutions After heating or polishing a sintered alloy consisting of at least one hard layer and a bonding layer mainly composed of Co and / or Ni, a diamond-like force is applied to the surface. There has been proposed a method of forming a coating film made of diamond or diamond.
- Japanese Patent Application Laid-Open No. 3-115571 proposes a method of reducing the concentration of bonding debris on the surface of a substrate by carburizing.
- the tungsten carbide layer containing a large amount of carbon formed on the surface of the base material is brittle, so even if the adhesion of the diamond film to the tungsten carbide layer is improved, cohesive peeling occurs in the tungsten carbide layer. The problem remains that the diamond film is easily peeled off.
- An object of the present invention is to solve the above problems.
- an object of the present invention is to provide a diamond-coated 5 member which has excellent adhesion between a substrate and a diamond-like film covering the same, exhibits excellent durability, and has a significantly improved service life. That is.
- Another object of the present invention is to use a base material having excellent properties such as sufficiently high toughness, and to sufficiently improve the adhesion between the base material and the diamond-like film to obtain a cutting tool and the like.
- a diamond-coated member of the present invention comprises a carbide of two or more metals selected from metals belonging to Groups IVA, VA and VIA of the periodic table; A substrate having at least one solid solution layer selected from the group consisting of a material and a carbonitride on the surface thereof, and a diamond-like layer formed on the solid solution layer.
- the thickness of the solid solution layer is preferably at least 0.1 x m or more, and the solid solution layer is preferably porous,
- the solid solution layer When the solid solution layer is porous, the solid solution layer preferably has a porosity of 5 to 80%,
- the solid solution layer is porous, its BET value is preferably 30 to 300 cm 2 / g.
- a method for producing a diamond-coated member according to the present invention wherein a base material made of a tungsten carbide cemented carbide is used as the base material, the base material is subjected to normal pressure to 3, After heat treatment at 1,200 to 1,600 ° C. in an inert gas atmosphere at a pressure of 1000 atm, a diamond-like film is formed on the surface of the base material by a gas phase method. Is characterized by
- the tungsten carbide cemented carbide has a composition of 50 to 95% by weight of tungsten carbide, 1 to 30% by weight of titanium carbide, and 2 to 20% by weight of cobalt.
- tungsten carbide cemented carbide has a composition of 50 to 95% by weight of tungsten carbide, 1 to 30% by weight of titanium carbide, and 2 to 20% by weight of cobalt.
- the tungsten carbide cemented carbide preferably has a composition of 80 to 93% by weight of tungsten carbide, 3 to 10% by weight of tantalum carbide, and 4 to 10% by weight of cobalt.
- the surface of the substrate is subjected to a temperature of 10 to 100 torr, 500 to 100 tons in a mixed gas atmosphere of carbon dioxide gas and hydrogen gas. It is preferable to perform plasma treatment at 1,100 ° C,
- the method for manufacturing a diamond-coated member according to the present invention includes, when a base material formed of cermet is employed as the base material, the base material is formed of an inert gas. Heat-treating in an atmosphere, usually at a pressure of not more than 300 atm, and forming a diamond-like film on the surface of the heat-treated substrate by a vapor phase method. Characterized in that
- a method for manufacturing a diamond-coated member according to the present invention comprises, as a base material, at least one kind of a thin layer selected from the group consisting of titanium metal, titanium nitride, titanium carbide and titanium carbonitride.
- the substrate is heat-treated at a temperature of 1,000 to 1,600 ° C in an inert gas atmosphere. Forming a diamond thin film on the surface of the heat-treated base material by a vapor phase synthesis method.
- a method for producing a diamond-coated member according to the present invention comprises the steps of: preparing a substrate produced from a silicon nitride-based ceramic in a rare gas atmosphere for 5 to 3,000,000. Heat treatment at 1,300 to 2,000 ° C under atmospheric pressure, and forming a diamond-like film on the surface of the heat-treated substrate by a vapor phase method It is characterized by
- the silicon nitride ceramic preferably contains at least one selected from the group consisting of silicon nitride, ⁇ -sialon and / 3—sialon as a main component,
- the method for producing a diamond-coated member according to the present invention includes, as a material, at least 30 to 95 capacities selected from the group consisting of silicon nitride, ⁇ -sialon, and / 3-sialon. % And at least one type selected from the group consisting of metal carbides, metal nitrides, metal carbonitrides and metal borides, at least 70% to 5% »% Heating to 1,400 to 1,800 ° C under a nitrogen gas atmosphere and a pressure of 5 to 3,000 atm, and applying a diamond-like film to the surface of the heat-treated substrate by a gas phase method Is formed.
- the diamond-coated member of the present invention is formed of two or more kinds of carbides, nitrides, and carbonitrides selected from metals belonging to Groups IVA, VA, and vI of the periodic table.
- the material of the base material is determined by how the solid solution layer existing on the surface is formed.
- the solid solution layer can be formed by heating the base material to alter the surface of the base material itself.
- the solid solution layer is formed on the surface of the base material by the IVA group or the VA group of the periodic table.
- metals belonging to Groups IVA, VA and VIA of the Periodic Table are required because solid solution components must be deposited on the base material surface from inside the base material. It is better to use a cemented carbide or a sam- ple containing two or more metals selected from the group consisting of:
- tungsten carbide cemented carbides include WC, W—WC, WC—C, W—WC—. C—W—C, WC—Co, WC—Co—W, WC—Co—C, WC—Co—W—C, etc.
- W—Ti—Co such as CN—Co, WC—TaC—Co, WC—TiC—TaC—Co—C, etc.—W—Ti—Ta—Co — Carbide alloys such as —C, WC—Nb—Co.
- the tungsten carbide cemented carbide can be obtained from tungsten carbide, tantalum carbide, titanium carbide and the like as described above.
- the tungsten carbide-based cemented carbide used in the present invention those containing metals such as Ti, Co, Ta, Mo, Cr, and Ni are preferable.
- cemented carbides sometimes contain carbon called “free carbon”.
- tungsten carbide cemented carbide used as the base material specific examples include WC—TiC—Co, WC—TaC—Co WC-TiC-TaC-Co, WC-Co, and WC-Nb-Co.
- tungsten carbide is 50 to 95% by weight, preferably 70 to 94% by weight, and titanium carbide is 1 to 30% by weight, preferably 2 to 20%. % By weight and 2 to 20% by weight of cobalt, preferably 4 to 10% by weight.
- tungsten carbide is 80 to 93% by weight, preferably 85 to 92% by weight
- tantalum carbide is 1 to 20% by weight, preferably 2 to 10% by weight. %, And 3 to 10% by weight, preferably 4 to 6% by weight of cobalt.
- tungsten carbide is 30 to 96% by weight, preferably 74 to 93% by weight
- titanium carbide is 1 to 30% by weight, preferably Is 2 to 10% by weight, 1 to 20% by weight of tantalum carbide, preferably 2 to 10% by weight, and 2 to 20% by weight of cobalt, preferably 3 to 8% by weight.
- tungsten carbide is 30 to 96% by weight, preferably 74 to 93% by weight
- titanium carbide is 1 to 30% by weight, preferably Is 2 to 10% by weight, 1 to 20% by weight of tantalum carbide, preferably 2 to 10% by weight, and 2 to 20% by weight of cobalt, preferably 3 to 8% by weight.
- cobalt preferably 3 to 8% by weight.
- tungsten carbide is 90 to 98% by weight, preferably 94 to 97% by weight, and cobalt is 2 to 10% by weight, preferably 3% by weight. And about 6% by weight.
- tungsten carbide those used for conventional tools and the like can be used.
- WC WCX (where X represents a positive real number other than 1; X is a number greater than 1 or less than 1.
- WC is particularly preferably used.
- the titanium carbide is not particularly limited, and titanium carbide used for producing an ordinary alloy can be used.
- T i C and T i C y (where y represents a positive real number other than 1 and usually y is a number greater than 1 or less than 1)
- Specific compounds and non-stoichiometric compounds, or compounds in which other elements such as oxygen are bonded, exchanged, or penetrated, and the like can be given.
- TiC is usually particularly preferably used.
- the tantalum carbide is not particularly limited, and those used for producing ordinary alloys can be used. Specifically, T a C, T a C z (where z represents a positive real number other than 1, and usually z is a number greater than 1 or less than 1) Specific compounds and nonstoichiometric compounds, or compounds in which other elements such as oxygen are bonded, substituted, or invaded, can be given. Of these, TaC is usually particularly preferably used.
- the cobalt is not particularly limited, but a simple metal can be suitably used.
- the tungsten carbide, the titanium carbide, the tantalum carbide and the cobalt do not need to be particularly pure, and may contain impurities as long as the object of the present invention is not hindered.
- the tungsten carbide may contain a trace amount of excess carbon, excess metal, impurities such as oxides, and the like.
- the cermet used in the present invention includes, for example, carbides and nitrides such as Ti, W, Mo, Cr, Ta, Nb, V. Zr, Hf, and the like. , Cr, Cermet materials containing metals such as Mo, Fe, etc. as sintering aids can be mentioned, and any material that is generally known as a cermet material can be used without any particular limitation. Can be.
- cermet is expressed differently from the above, the following description is also possible. That is, as a cermet that can be used in the present invention, WC, TaC, or TiN was added to TiC, and Ni, Co, or Mo was added as a binder phase.
- titanium carbide, tungsten carbide and titanium nitride based cermets are preferably used.
- Particularly preferred are sacrificial materials using Ni, Co or Mo as a sintering aid in TiC, TiN, TiCN and the like.
- the solid solution in the present invention is formed by exposing the solid solution metal, which will be described later, to the surface of the base material. It is preferable to contain components that form a solid solution. Les ,.
- the said base material can also use what is marketed.
- the base material can be obtained by a method such as sintering after blending the above components in an appropriate ratio.
- an auxiliary binder containing ethylene glycol, ethylene-vinyl acrylate, polybutylene methacrylate, adamantan, etc. as a main component Prior to sintering, an auxiliary binder containing ethylene glycol, ethylene-vinyl acrylate, polybutylene methacrylate, adamantan, etc. as a main component, if necessary, together with the above-mentioned components. Is also good.
- the sintering method is not particularly limited, and can be performed according to a conventionally known sintering method.
- each of the above components can be used in the form of powder, fine powder, ultrafine particles, whiskers, or various other shapes.
- 0.05 to 4 ⁇ preferably in the form of fine particles or ultrafine particles of about l to 3 / zm, or whisker-like in which the aspect ratio is about 20 to 200, etc. Can be suitably used.
- the sintering temperature is usually 1,200 to 1,600, preferably 1,300 to 1,600 or 1,300 to 1,550. It is appropriate to set the temperature in the range of C or 1,350 to 1,550 ° C.
- the sintering time is usually from 0 to 5 hours or more, preferably from 1 to 4 hours.
- the base material may be formed into a desired shape before the sintering, and then sintered. Alternatively, after the sintering, the base material may be processed into a desired shape, if necessary. It can be used as a base material for a kind of covering member.
- the coating formed on the surface of the base material is composed of two or more metals selected from metals belonging to Groups IVA, VA and VIA of the periodic table, or carbides, nitrides, and the like thereof. If Z or carbonitride is used and the solid solution layer referred to in the present invention can be formed by heating, the base material does not need to be formed by components necessary for forming the solid solution layer.
- the coating formed on the substrate surface is a metal selected from metals belonging to Groups IVA, VA and VIA of the periodic table, or a carbide, nitride and / or carbonitride thereof.
- the material of the substrate is appropriately selected such that the solid solution layer specified in the present invention can be formed by heating the component and the component of the coating.
- the WC component in the base material is diffused and moved to the surface of the base material by heating, whereby the solid solution layer defined in the present invention is formed.
- the base material used when forming a solid solution layer by transforming the base material by heating to form a solid coating layer, and the base material used when forming a solid solution layer by heating And may overlap with each other.
- a base material is formed by using the base material used to form a solid solution layer by transforming the base material itself by heating, forming a specific coating layer on the surface of the base material, and heating the base material.
- a solid solution layer can be formed from the coating layer and the components in the substrate. Therefore, when the base material for forming the solid solution layer by forming a specific coating film on the surface of the base material is exemplified, the base material for forming the solid solution layer by altering the base material itself is exemplified. Although it will be duplicated, the following is an example.
- the substrate is not particularly limited, and various types and compositions generally known can be used.
- W, Mo, Cr, Co, Ni, F e, T i, Z r, H f, N b, T a, A l, B, G a, S i, etc. one or more of these cemented carbides, or one or more of these metals
- cemented carbides of various compositions consisting of carbon, nitrogen, oxygen and Z or boron specifically, for example, WC, W—WC, WC—C, W—WC—C, etc.
- Ta C Mo—C system such as T a—C system such as x
- T i-C system such as T i C, Mo C x, Mo—M o Cx, and Mo C x—C system
- S i C etc.
- S i — C system F e — F e C system, etc.
- F e — C system A l 2 0 3 -1 F e system, etc.
- T i one N i C system, T i C one C o system such as T i one C o-C system, BN-based 4 BC one F e system like the F e- BC system, T i one N system of T i N system, etc.
- a 1 N x system such as a 1 one N system, T a N x system or the like of the T a- N type, WC- T a C- C o- C system, etc.
- W- T a- C o- C system , WC—TiC—Co—C system, etc.
- W-Ti—Ta— C o— C system A wide variety of cemented carbides can be mentioned, such as W-Ti-C-N series, W-Co-Ti-C-N series.
- particularly preferred examples include, for example, tungsten carbide cemented carbides suitable for cutting tools ffl (specifically, for example, ffl classification symbols P01, P10, P20 used in JISB 4053) , P30, P40, P50 etc., P series, M10, M20, M30. M40 etc., M series, K01, K10, ⁇ 20, ⁇ 30, ⁇ 40 etc.
- WC-C such as cemented carbide tips for cutting tools such as ⁇ series, and carbide dies for drawing dies such as V series such as VI, V 2.
- V3, center and cutting tools W—C ⁇ —C cemented carbide such as ⁇ -based, WC—TiC-TaC—Co-based W—Ti-Ta—Co—C-based cemented carbide, or these A part of Ta is changed to Nb, etc.).
- W—C ⁇ —C cemented carbide such as ⁇ -based, WC—TiC-TaC—Co-based W—Ti-Ta—Co—C-based cemented carbide, or these A part of Ta is changed to Nb, etc.).
- What kind of material and shape of the cemented carbide is adopted may be appropriately selected according to the purpose of use and the like.
- the above-mentioned cermet can also be used as a material for the base material.
- metals listed in Group IVA of the Periodic Table particularly Ti, Zr, Hf, and metals belonging to Group VA in the same table
- at least one metal selected from the group consisting of V, Nb, Ta, and Group VIA of the same table particularly Cr, Mo, W, or a carbide, nitride, and / or Alternatively, carbonitride is used.
- titanium metal titanium nitride, titanium carbide and titanium carbonitride
- niobium metal titanium nitride, titanium carbide and titanium carbonitride
- niobium carbide titanium carbonitride
- niobium carbonitride titanium metal, titanium nitride, titanium carbide and titanium carbonitride
- niobium metal titanium metal, titanium nitride, titanium carbide and titanium carbonitride
- niobium metal niobium nitride, niobium carbide and niobium carbonitride.
- titanium nitride examples include those represented by TIN, or TIN,, TIN-Ti, and TIN.
- the titanium carbide is represented by, for example, T i (: or T i Ci, T i C-C, T i C-T i, T i C-T i-C, T i-C, etc.
- the titanium carbonitride examples include, for example, TiCN, TiC'TiN, Ti. C x ⁇ Ti N x> T i C ⁇ T i N-C, T i C ⁇ T i N-T i, T i C ⁇ T i N one i-(:, T i one N-C, etc. Can be mentioned.
- the titanium coat those usually represented by T i, T i N, T i C or T iCN are preferable, but may be composed of two or more of these. One, two or more of these may contain an excess of T i, C and / or N components.
- the coating containing titanium may contain other elements or components other than Ti, C, and N as long as the object of the present invention is not impaired.
- a commonly used method for example, a commonly used ion-blanching method ⁇ sputtering method can be adopted.
- the thickness of the coating is not particularly limited, but is usually in the range of 100 to 500,000 A, preferably in the range of 1,000 to 200,000 A. Therefore, it is selected so as to obtain a desired thickness of the solid solution barrier layer. If the film thickness is less than 100 mm, the effect of the intermetallic debris cannot be expected. If it exceeds 50,000 A, internal stress may be generated in the intermediate layer itself.
- the solid solution layer that is formed is composed of groups IVA, VA, and VA of the periodic table (IUPAC). It consists of at least one of carbides, nitrides and carbonitrides of two or more metals selected from metals belonging to Group VIA.
- solid solution for example can be expressed when composed of two kinds of metals general formula M in ' ⁇ 1 M 2 * 2 C, Formula Micromax, Micromax New or general formula M' A1 MCN.
- M ′ and M 2 are groups IVA (T i, Z r, U ⁇ ), groups VA (V, N b, T a) and groups VIA (C r, respectively) of the periodic table (IUPAC).
- M o, W) are different metals selected from each other, and A l and A 2 are positive real numbers. Also, in the case where three or more kinds of gold are used, they can be similarly expressed as M ′ ⁇ ⁇ 2 ⁇ 2 ⁇ ,, ⁇ • - ⁇ ⁇ ⁇ resort.
- This solid solution break can be easily determined by the X-ray diffraction method.
- the cross section of this solid solution can be analyzed by EDAX (formal name: Energy Dispersive Analysis of X-rays) to confirm the composition and distribution of the metal atoms that form the solid solution.
- EDAX energy Dispersive Analysis of X-rays
- metal that can be used for the solid solution include W, Ti, Ta, Mo, Nb, Cr, V, Zr, and Hf.
- the composition of the solid solution is not particularly limited, and although it depends on the number of metals in the solid solution, 10 to 90 at%, preferably 40 to 80 at% of the metal in the total metal is contained. Preferably, the remainder is made of another metal. If one metal is less than 10 atomic% or more than 90 atomic%, the adhesion to the diamond film may be insufficient.
- W is 10 to 90 atomic%
- Ti is 10 to 90 atomic%
- W is 10 to 90 atomic%. It is preferable that 90 atomic%, 1 is 20 to 80 atomic%, and Ta is 10 to 30 atomic%.
- This solid solution layer is preferably a porous layer. If this solid solution layer is formed as a porous layer, the diamond-like film formed on the solid solution layer contributes to the improvement of the adhesion of the diamond-like film to the substrate by the anchor effect.
- the porous solid solution layer may be hereinafter particularly referred to as a porous layer.
- the solid solution layer When the solid solution layer is porous, it has voids at a rate of 5 to 80%, preferably at a rate of 10 to 80%, and more preferably at a rate of 15 to 70%. It is desirable.
- the solid solution layer having a porosity in the above range effectively absorbs high temperature distortion caused by a difference between the coefficient of thermal expansion of the diamond film and the coefficient of thermal expansion of the base material. Therefore, it is difficult for the diamond-like film to peel off from the base material. If the porosity is lower than the above range, it becomes difficult to absorb the strain applied due to the difference in thermal expansion at a high temperature, and the tendency of the diamond film to easily peel off from the substrate can be reduced. Can not. When the porosity exceeds the above range, the strength of the porous layer itself becomes small, and such a porous layer functions as an intermediate layer existing between the diamond film and the substrate. This makes it difficult to peel off the diamond film.
- the voids in the porous solid solution layer are maintained even after a diamond-like film is formed on the surface of the porous layer.
- a cross section of a diamond-like member formed by forming a diamond-like film on the surface of a substrate having a porous layer was observed by SEM, it was found that voids still existed in the porous layer.
- Can be This is a state in which voids in the porous layer and openings on the surface of the porous layer are covered with a diamond film.
- the porosity of the porous layer after the surface of the porous layer is covered with the diamond film is preferably in the range of 5 to 70%, particularly 30 to 60%. Is preferably within the range.
- the porosity of the porous layer after formation of the diamond-like film is the porosity of the porous layer before formation of the diamond-like film (hereinafter referred to as porosity before formation).
- porosity before formation There is a tendency to decrease.
- the decrease in the porosity after formation as compared with the porosity before formation means that the diamond-like film formed on the porous layer has entered the voids in the porous layer.
- the porous layer adheres to the substrate of the diamond-like film due to an anchor effect or the like by the diamond-like film penetrating into the voids of the porous layer. It is considered that this contributes to the improvement of the performance.
- the porosity of the porous layer can be measured and evaluated with a mercury porosimeter.
- this porous layer has an 8 3 0 0 cm z is preferably from Z g, is preferably in particular 5 0 ⁇ 2 5 0 cm 2 Zg.
- the BET value of the porous layer is within the above range, the mechanical strength of the porous layer itself is maintained, and the adhesion of the diamond-like film can be improved by the relaxation of the internal stress and the anchoring effect. .
- the surface of the solid solution layer (which may also be referred to as the surface of the substrate) has a roughness Ra of usually 0.05 to 2. 5 ⁇ , preferably 0.1 to 1. ⁇ . . If the surface roughness Ra of the solid solution layer is larger than the above value, the adhesiveness with the diamond film is reduced, and if it is smaller than the above value, the adhesiveness with the diamond film is also reduced. There is.
- the thickness of the formed solid solution layer is preferably uniform and thin. Thickness tends to be brittle.
- the thickness of the solid solution layer is usually 0.1 m or more, preferably 0.5 to 30 iim, and more preferably 1 to 10 / zm.
- the thickness of the solid solution layer when it is porous is preferably 0.1 to 40 m.
- the thickness of the solid solution layer can be determined as follows. That is, the thickness of the porous layer can be determined by cutting the base material having the solid solution layer with a diamond wheel and observing the cut cross section by SEM.
- the composition of the solid solution layer is continuously shifted to the composition of the substrate, rather than forming a clear interface with the substrate body.
- the solid solution layer preferably covers the entire surface, but an uncoated portion not covered with the solid solution layer may be present on the surface of the substrate as long as the adhesion is not impaired.
- the solid solution layer is formed by heat-treating the base material to alter the surface of the base material, or forming a specific coating layer on the base material surface, and then heating the base material to form the specific coating layer and the base material.
- the heat treatment for heating the base material itself to alter the surface layer of the base material is performed by heating the surface of the base material under a constant pressure in an inert gas atmosphere.
- the inert gas examples include rare gases such as argon gas, helium gas, neon gas, and xenon gas, and nitrogen gas. Among them, argon gas can be particularly preferably used. In addition, if gases that react with the base material such as oxygen gas are mixed in the inert gas, these react with the base material, and thus, in the inert gas, oxygen gas and the like are removed as much as possible. It is desirable to keep.
- the pressure varies slightly depending on the type of the base material, but is generally at normal pressure or at most 300,000 atm, preferably at 5 to 3,000 atm. Yes, particularly preferably from 1,000 to 3,000 atmospheres.
- the pressure is lower than the normal pressure, the surface of the base material is not improved to a desired state. Further, even if the pressure exceeds 3,000 atm, no further effect can be obtained as compared with the effect obtained at 3,000 atm.
- the pressure during the heat treatment is preferably 5 to 3,000 atm.
- the pressure is preferably from 1,000 to 3,000 atm. If the pressure is lower than 5 atm, the surface of the base material is not sufficiently modified.
- the temperature at the time of the heat treatment slightly varies depending on the type of the base material. Generally, however, the temperature is preferably from 1,000 to 1,600 ° C, and more preferably from 1,200 ° C. It is preferably from 0 to 1,600 ° C, more preferably from 1,300 to 1,450 ° C. Generally, when the temperature is outside the above range, the surface of the base material is not improved to a desired shape.
- the temperature at the time of the heat treatment is 1, 200 to 1,600. ° C is preferable, and 1,300 to 1,45.0 ° C is particularly preferable. If the temperature is outside the above range, the surface of the substrate may not be improved to a desired shape.
- the time for the heat treatment depends on the temperature conditions and cannot be unconditionally determined. However, it is generally preferably 1 minute to 500 minutes, and particularly preferably 15 minutes to 300 minutes. If the time for the heat treatment is less than 1 minute, the surface modification of the substrate becomes insufficient. In addition, when the time for the heat treatment exceeds 500 minutes, the surface reforming proceeds excessively, so that irregularities increase on the surface of the substrate, and there is a risk of causing deformation of the substrate, which is preferable. Absent.
- the heat treatment can be performed by an appropriate method such as plasma heating, irradiation with light or the like, energization, laser heating, or electrolysis.
- the heating temperature is usually from 1,200 to 1,600 ° C, preferably from 200,000 ° C. 1300-I, 550 ° C.
- the atmosphere for the heat treatment is an inert gas such as argon, helium, or nitrogen gas.
- the pressure at the time of the heat treatment is appropriately selected from normal pressure or a pressure of 3,000 atm or less, preferably from 5 to 3,000 atm. These atmospheric gases and pressures are appropriately determined depending on the kind of metal used for the film formation.
- the time for the heat treatment is determined by the temperature conditions and cannot be unconditionally determined. However, it is generally preferably 1 minute to 500 minutes, and particularly preferably 15 minutes to 300 minutes. If the time for the heat treatment is less than 1 minute, the modification of the coating film becomes insufficient. If the time for the heat treatment exceeds 500 minutes, the same disadvantages as described above occur, which is not preferable.
- the heat treatment can be performed by an appropriate method such as plasma heating, irradiation with light or the like, energization, laser heating, or electrolysis.
- At least one member selected from the group consisting of metals belonging to Groups IVA, VA and VIA of the Periodic Table (IUPAC) or carbides, nitrides and carbonitrides thereof is formed on the surface of the substrate. Is formed.
- the surface of the solid solution layer thus obtained may have irregularities depending on the heat treatment conditions.In such a case, the surface of the solid solution layer is smoothed by grinding, lapping, bolishing, etching, or the like. It is better to apply processing. By performing such a smoothing process, when a diamond thin film is formed on the surface and used as a grinding tool or the like, the processing accuracy of the finished surface of the work material can be improved.
- the solid solution layer on the surface of the base material is subjected to an acid treatment or a plasma treatment to sufficiently remove metal components forming the bonding layer such as Ni and Co on the surface layer.
- an acid treatment or a plasma treatment to sufficiently remove metal components forming the bonding layer such as Ni and Co on the surface layer.
- the diamond coating formed on the surface of the solid solution existing on the surface of S material is a polycrystalline diamond formed in the present invention, in the present invention, it is a film containing a diamond-like carbon in a part or a film made of the diamond-like carbon within a range not to impair the object of the present invention. There may be.
- the identification of diamonds can be easily confirmed by Raman spectroscopy.
- the precipitation state of diamonds can be confirmed by SEM (transmission scanning electron microscope).
- the thickness of the thin film of diamonds formed on the surface of the solid solution in the base material cannot be determined uniformly because it differs depending on the purpose of use of the diamond-coated member, etc. 3 to 50 ⁇ or more is appropriate. If the thin film of diamonds is too thin, the surface of the substrate may not be sufficiently coated.
- the present invention it is possible to coat a thin film of diamonds on the surface of the solid solution layer in the substrate that has been heat-treated as described above, and furthermore, for example, to include titanium or tantalum in the solid solution layer.
- the plasma processing is performed in a mixed gas atmosphere of carbon dioxide gas and hydrogen gas at 10 to 100 torr, 500 to 1, 100.
- a mixing ratio of carbon dioxide gas of 60 to 90% and hydrogen gas of 40 to 10% is preferable.
- the pressure during the plasma treatment is preferably in the range of 10 to 100 torr. When the pressure is higher than the above range, the controllability of the process is poor, and when the pressure is lower, the process takes time.
- the substrate temperature is in the range of 500 to 1, lO Ot :, preferably 700 to 900. If the temperature is higher than the above range, the controllability of the processing is poor and the reproducibility is poor, and if the temperature is low, the processing takes time.
- the processing time is from 1 minute to 200 minutes, preferably 60 minutes.
- a CVD method can be suitably employed.
- various methods such as a microwave plasma CVD method, a high-frequency plasma CVD method, a thermal filament CVD method, and a DC arc CVD method are known. This pretreatment smell In this case, any of these CVD methods can be applied.
- a micro mouth-wave plasma CVD method and a high-frequency plasma CVD method can be mentioned. If the same CVD method as that used for the vapor phase synthesis of diamond described later is adopted, it is convenient in terms of equipment configuration.
- the substrate surface is activated, and the bonding force between the substrate and the diamond is increased.
- the surface of the solid solution layer formed as described above is coated with a thin film of diamonds, regardless of whether the pretreatment is performed or not.
- the diamonds here include diamonds and diamond-like carbons that partially contain diamond-like carbon in addition to diamonds.
- Examples of the carbon source gas include: paraffinic hydrocarbons such as methane, ethane, propane, and butane; olefinic hydrocarbons such as ethylene, propylene, and butylene; and acetylene-based hydrocarbons such as acetylene and arylene.
- paraffinic hydrocarbons such as methane, ethane, propane, and butane
- olefinic hydrocarbons such as ethylene, propylene, and butylene
- acetylene-based hydrocarbons such as acetylene and arylene.
- Hydrogen diolefin hydrocarbons such as butadiene and allene; alicyclic hydrocarbons such as cyclopropane, cyclobutane, cyclopentane and cyclohexane; aromatic hydrocarbons such as cyclobutadiene, benzene, toluene, xylene and naphthalene Ketones such as acetone, getyl ketone and benzophenone; alcohols such as methanol and ethanol; other oxygen-containing hydrocarbons; amines such as trimethylamine and triethylamine; other nitrogen-containing hydrocarbons; , Carbon monoxide, carbon peroxide, etc. It is Ru can.
- diolefin hydrocarbons such as butadiene and allene
- alicyclic hydrocarbons such as cyclopropane, cyclobutane, cyclopentane and cyclohexane
- aromatic hydrocarbons such as cyclobutadiene, benzen
- paraffinic hydrocarbons such as methane, ethane, and propane
- alcohols such as ethanol and methanol
- ketones such as acetone and benzophenone
- amines such as trimethylamine and triethylamine
- carbon dioxide It is carbon monoxide, and carbon monoxide is particularly preferred.
- the carbon source gas usually, these are used in a mixture with an active gas such as hydrogen or an inert gas such as helium, argon, neon, xenon, or nitrogen.
- concentration of the carbon source gas differs depending on the type of Rj gas and cannot be determined unconditionally, but is usually 0.5 to 50% by volume, preferably 1 to 20% by volume. When the carbon source gas concentration is high, the content of diamond-like carbon in the diamond film tends to increase.
- various known thin film vapor phase synthesis methods such as a CVD method, a PVD method, or a combination thereof can be used.
- various thermal filament methods including the EA CV D method, various DC plasma CVD methods including the thermal plasma method, and microwave plasma CVD methods including the thermal plasma method are preferable. It can be used for
- the conditions for forming the diamond thin film are not particularly limited, and the reaction conditions usually used in the above-described gas phase synthesis method can be applied.
- reaction pressure generally preferably 1 0 one 6 ⁇ 1 0 3 T orr, is preferably particularly 1 to 800 T range orr ⁇ .
- reaction pressure is lower than 1 0 _ 6 T orr is sometimes formation rate of a thin film of diamond such slower.
- 1 0 in the case 3 T orr by Ri high compared to the effect obtained when the 1 0 3 T orr, there are no more effect.
- the surface temperature of the base material varies depending on the means for activating the source gas and the like, it cannot be specified unconditionally, but is usually 300 to 1,200 ° C, preferably 450 to 1, It should be within the range of 000 ° C.
- this temperature is lower than 300, formation of crystalline diamond thin films may be insufficient. If the temperature exceeds 1,200, etching of the formed diamond thin film is likely to occur.
- the reaction time is not particularly limited, and it is preferable to appropriately set the reaction time according to the formation rate of the diamond thin film so that the diamond thin film has a desired thickness.
- the carbon source gas of the raw material reacts with the metal of the solid solution layer to carbonize the metal of the solid solution layer, Then, diamond is formed, so that the adhesion between the solid solution layer and the diamond thin film is improved.
- a diamond-coated member can be manufactured by the method of the present invention.
- a diamond-coated member having a large adherence of the diamond-based film to the base material, in which the diamond-based film is formed on the surface of the solid solution layer existing on the surface of the base material can be manufactured.
- the present invention is not limited to the above method, and according to the other method of the present invention, it is possible to produce a diamond-coated member having high adhesion of a diamond film to a substrate.
- a method for producing a diamond-coated member comprises the steps of: subjecting a substrate produced from a silicon nitride-based ceramic to a rare gas atmosphere under a pressure of 5 to 300 atm.
- a substrate consisting of 0 to 5% by volume is heated in a nitrogen gas atmosphere at 1,300 to 2,100 ° C under a pressure of 5 to 3,100 atmospheres, and then heated.
- the main purpose is to form a diamond film on the surface of the treated substrate by a vapor phase method.
- the surface properties of the substrate are changed by subjecting the silicon nitride-based ceramics to a heat treatment under the above-mentioned specific temperature and rare gas pressure or nitrogen gas pressure.
- the adhesion between the substrate and the diamond thin film is greatly improved.
- the reason why the adhesion can be greatly improved by the heat treatment in the pressurized rare gas atmosphere or the nitrogen gas atmosphere in the method of the present invention is not necessarily clear. It is considered as follows.
- the fine crystal grains of silicon nitride or sialon that have been altered from the components of the base material by this heat treatment give sufficient roughness at the microscopic level to the surface of the base material and react with the diamond.
- Produces a certain kind of carbide which results in a high anchoring effect and chemical bonding to the diamond thin film, resulting in high adhesion between the substrate and the diamond thin film It is thought that it will be done.
- the silicon nitride-based ceramic which is a material constituting the base material used in the present invention includes at least one selected from the group consisting of silicon nitride, ⁇ -sialon and 0-sialon as a main component. Can be listed.
- the preferable content of silicon nitride, ⁇ -sialon or / 3-sialon (hereinafter, these may be referred to as a silicon nitride component) is usually 60 to 99% by volume. Especially, it is 80 to 95% by volume.
- the remaining components except at least one selected from the group consisting of silicon nitride, ⁇ -sialon, and / 3—sialon in the ceramic are metal carbides, metal nitrides, and metals.
- the preferred content of silicon nitride, ⁇ -sialon or / 3-sialon, if at least one selected from the group consisting of borides, is It is always from 30 to 95% by volume, especially from 40 to 70% by volume.
- the volume% is defined by a charged composition based on a charged amount of a raw material.
- the object of the present invention can be achieved, but the toughness of the base material itself becomes insufficient. Also, even if the heat treatment is performed under the above specific conditions, the desired heat treatment effect for improving the adhesion to the diamond thin film cannot be sufficiently exhibited, and the object of the present invention is sufficiently achieved. You may not be able to. In the case of a base material having a silicon nitride component ratio of less than 60% by volume, since the concentration of the silicon nitride component is too low, the transformation of Si 3 or sialon microcrystalline particles does not sufficiently occur, and diamonds It can be understood that the modification of the substrate surface to enhance the adhesion of the thin film becomes insufficient.
- At least one ceramic selected from the group consisting of silicon nitride, ⁇ -sialon and / 3-sialon and at least one ceramic selected from the group consisting of metal carbides, metal nitrides and metal borides When the base material is formed by ffl, the object of the present invention can be achieved if the content ratio of the silicon nitride component is, for example, less than 60% by volume but up to 30% by volume.
- a base material having a silicon nitride component content of more than 99% by volume it is possible to achieve the object of the present invention, but the characteristics of the silicon nitride component itself are strengthened. In some cases, it may be difficult to sufficiently exert various favorable effects (for example, effects of improving hardness, controlling the coefficient of thermal expansion, and sintering as a ceramic substrate) by adding appropriate components of .
- a ceramic comprising at least one selected from the group consisting of silicon nitride, ⁇ -sialon and / or sialon and at least one selected from the group consisting of metal carbides, metal nitrides and metal borides
- the object of the present invention can be achieved well if the content ratio of the silicon nitride component is up to 95% by volume.
- the characteristics of silicon nitride itself become strong, and it is difficult to sufficiently exert various favorable effects (for example, an effect of improving hardness, control of thermal expansion coefficient, etc.) by adding other suitable components. It may be difficult to achieve the object of the present invention.
- the preferred range of the content ratio of the silicon nitride component in the base material is generally In addition, since it depends on the type and combination of other components used together with the silicon nitride component, the heat treatment conditions actually applied to the substrate, and the like, this is appropriately determined by experiments.
- the silicon nitride-based ceramics constituting the substrate used in the method of the present invention contains a silicon nitride component as a main component.
- the remaining components in the silicon nitride-based ceramics include metal carbides, metal nitrides, gold borides, alumina, silicon carbide, cubic boron nitride, diamonds, and the like. Can be.
- the remaining components such as metal nitrides are components that suitably act to maintain the hardness, heat resistance, and oxidation resistance of the base material.
- metal carbide examples include tungsten carbide, titanium carbide, tantalum carbide, hafnium carbide and the like.
- metal nitride examples include titanium nitride, tantalum nitride, and hafnium nitride.
- gold boride examples include silicon carbide and titanium boride.
- tungsten carbide which is formally represented by WC is preferably used. That is, in the present invention, as the substrate, a silicon nitride-based ceramic composed of the silicon nitride and the tungsten carbide is preferably used. Among them, silicon nitride (Si 3 N) and tungsten carbide ( WC) or sintered bodies containing these as main components are particularly preferably used.
- the content ratio of the silicon nitride is within the above specific range.
- the content of WC exceeds 70% by volume (ie, in this case, the content of silicon nitride is less than 30% by volume, the adhesion of the diamond thin film is improved as described above. effect with becomes insufficient)
- the toughness of the base material itself is low (for example, the K lc representing the rice with a 5. less than 5 MP acm 1/2.), whereas, the content of WC is 5
- the volume is less than%, the hardness of the base material may be insufficient (for example, the HV representing the hardness is less than 1,600 Kgm 2 ).
- the base material may be a ready-made product such as a commercially available product, or may be prepared and used independently.
- the substrate used in the present invention is manufactured by using various methods including known methods.
- titanium nitride or the like which is formally represented by TiN, is preferably used. That is, in the present invention, as the substrate, the nitride Kei Ingredient nitride Kei Motokei ceramics consisting of titanium nitride is a preferred use, among others, nitride Kei element (S i 3 4) and titanium nitride (T iN) or a sintered body containing these as a main component is particularly preferably used as a substrate.
- the content ratio of the silicon nitride component be within the above-mentioned specific range.
- the content of TiN exceeds 40% by volume (that is, in this case, the proportion of the silicon nitride component is less than 60% by volume, so that the adhesion of the diamond thin film as described above is reduced). improvement with there may be insufficient), Nari ⁇ the substrate itself is rather low (e.g., K ics representing the toughness 5.
- the content ratio is less than 3% by volume of T i N, sometimes the toughness of the base material that Do insufficient (e.g., if the K ics representing the toughness is 6. 0 MP acm less than 1/2 There is also.)
- the base material may be a ready-made product such as a commercially available product, or may be prepared and used independently.
- the base material used in the present invention can be produced by various methods including known methods. For example, usually, a fine particle silicon nitride component, a fine particle component such as metal nitride such as TiN, and an appropriate sintering aid are sufficiently mixed, and the mixture is mixed, for example, in a nitrogen gas atmosphere. It can be suitably obtained by sintering using a gas pressure sintering method at a temperature in the range of 1,700 to 1,900 ° C. to obtain a silicon nitride ceramic having a predetermined composition.
- a ceramic consisting of at least one selected from the group consisting of silicon nitride, ⁇ -sialon and / 3-sialon and at least one selected from the group consisting of metal carbides, metal nitrides and metal borides.
- the base material is specified as described above. That is, in a pressurized rare gas atmosphere of 5 to 3,000 atm, at a temperature of 1,300 to 2,000, preferably 1,350 to 1,750 ° C Heat treatment at a temperature of.
- the substrate to be subjected to the heat treatment may have various shapes and sizes.
- the entire surface or a predetermined partial surface of the base material to be subjected to the heat treatment may be subjected to a surface treatment by physical or chemical means according to an ordinary method in advance. For example, a method in which an appropriate roughness is given to the base material surface in advance by a usual grinding process is suitably adopted.
- examples of the rare gas include helium, neon, argon, and krypton.
- the silicon nitride component in the base material is decomposed. And may cause undesired reactions. Further, if the heat treatment of the base material is performed in an atmosphere other than the rare gas or only under the condition that the rare gas pressure is less than 5 atm, even if the temperature is within the above range, the temperature of the rare gas is reduced. Since the gas pressure is too low, the adhesion between the base material and the diamond thin film is not sufficiently improved, and in some cases, the silicon nitride component reacts with other added components to cause the base material to warp. There is.
- the higher the rare gas pressure in the heat treatment the better.
- the nitrogen pressure is increased beyond 300,000 atmospheres, the effect of further improving the adhesion to the diamond-like thin film is hardly observed.
- the preferable range of the rare gas pressure is usually 9.5 to 2000 atm.
- the base material is subjected to only a low temperature range of less than 1,300 ° C, even if the rare gas pressure falls within the above range, the modification of the fine crystal particles of the silicon nitride component is performed.
- the quality of the base material is not sufficiently improved, and the effect of improving the adhesion between the base material and the diamond thin film cannot be obtained.
- heating at a high temperature exceeding 2,000 ° C After processing, The silicon nitride particles grow abnormally, easily impairing the desirable properties of the silicon nitride-based ceramic base material, deforming the base material, and energy cost. Becomes larger.
- the holding time does not need to be kept, and a holding time P of 1 or less may be provided. If the retention time is to be secured, the preferred retention time is about 1 to 2 hours.
- the microcrystalline particles of the silicon nitride component can be modified on the base material surface as described above.
- the modified microcrystalline particles of the silicon nitride component are usually bulk crystals, and the size thereof is usually about 0.5 to 5 nm in average effective diameter and 1 to 1 in average length. About ⁇ ⁇ .
- the surface roughness of the substrate can be increased substantially uniformly at a microscopic level.
- the R a u (a measure of surface roughness) of a substrate can be significantly increased by the heat treatment, for example, from 0-8 rn to 2.0 m.
- the base material subjected to the heat treatment is a conventional type not subjected to the heat treatment. Compared with the base material, it has excellent properties that can significantly improve the adhesion to the diamond thin film.
- the base material is at least two kinds selected from the group consisting of silicon nitride, ⁇ -sialon and / 3 mono-sialon, at least 30 to 95% by volume and metal carbide, metal nitride. And at least one of the remaining components selected from the group consisting of metal borides and 70 to 5% by volume.
- a diamond thin film is formed on the base material.
- the substrate is subjected to the above-mentioned specific conditions, that is, a pressurized nitrogen atmosphere of 5 to 300 atm, at a temperature of 1,400 to 1,800, preferably 1, Heat treatment at a temperature of 500 to 1,780 ° C.
- the surface of the substrate to be subjected to the heat treatment is subjected to a surface treatment by physical or chemical means according to a conventional method.
- the surface of the base material is given an appropriate roughness in advance by a grinding process that is usually performed. And the like.
- the pressure in the heat treatment means that the nitrogen (N 2 ) pressure may be in the range of 5 to 30.0 atm (absolute pressure, atm) [ffl]. Therefore, when a mixed gas of nitrogen and another gas is used as the atmosphere selection gas, the total pressure is P (5 + P), where P is the sum of the partial pressures of the other gases. ⁇ (30000 + P) pressure range.
- the heat treatment can usually be suitably performed in a pure nitrogen gas atmosphere.
- the heat treatment of the base material at a high temperature such as the above temperature range is performed at a low pressure without performing the above-mentioned predetermined pressurized atmosphere, silicon nitride in the base material may be decomposed or may be inconvenient. May cause a reaction. Further, if the heat treatment of the base material is performed in an atmosphere other than nitrogen gas or only under a condition in which the nitrogen gas pressure is less than 5 atm, even if the temperature is within the above range, the nitrogen pressure Is too low, the adhesion between the substrate and the diamond thin film is not sufficiently improved, and in some cases,> the silicon nitride reacts with WC to cause the substrate to warp. In general, the nitrogen pressure in the heat treatment is preferably higher.
- the preferred range of nitrogen pressure is usually from 10 to 2,000 atm.
- the substrate When the substrate is performed only in a low temperature range of less than 1,400 ° C., even if the nitrogen pressure falls within the above range, Si 3 N ⁇ growth of microcrystalline particles, etc. The properties of the material are not sufficiently improved, and the effect of improving the adhesion between the base material and the diamond thin film cannot be sufficiently obtained.
- the heat treatment is performed at a high temperature exceeding 1,800 ° C, However, the silicon nitride component excessively reacts with other components (for example, WC), thereby deteriorating the desirable characteristics of a ceramic substrate containing silicon nitride or the like or deforming the substrate. Problems are likely to occur, and energy costs increase.
- the heat treatment is usually performed for 0.5 to 4 hours, preferably for about 1 to 2 hours.
- microcrystalline particles of silicon nitride or sialon can be grown on the base material surface as described above.
- the grown crystal grains of silicon nitride or sialon Is usually a needle-shaped crystal, and its size is usually about 0.2 to 3 / xm in average effective diameter and about 2 to 10 m in average length.
- the surface roughness of the base material can be increased substantially uniformly at a microscopic level.
- the heat treatment the R »a c of the base material (a measure of surface roughness), for example, 0.2 from 8 m. Can greatly be increased to 4 ⁇ ⁇ .
- the base material subjected to the heat treatment is a conventional type not subjected to the heat treatment.
- the anchor effect on the diamond-like thin film is remarkably increased, and has excellent properties capable of significantly improving the adhesion to the diamond-like thin film.
- a tire quadrature film is formed on a desired surface of the heat-treated base material.
- the method for forming the diamond thin film is the same as that described in (1) 2 Diamond thin film J, and therefore detailed description thereof is omitted.
- the solid solution layer was analyzed by X-ray.
- Tables 1 and 2 show lattice constants measured by X-ray analysis of the substrate surface in each example.
- the lattice constant of WC is 4.2 14 A.
- a substrate made of cemented carbide having a size of 12.7 mm ⁇ 12.7 mm square shown in Table 1 was heat-treated under the respective solid solution layer forming conditions shown in Table 1.
- a diamond-like thin film was formed on the surface of the base material on which the solid solution and the body layer were formed by the heat treatment under the following conditions to obtain each diamond-coated member.
- the thickness of the formed diamond thin film was approximately 25 m in each case.
- Source gas (mixed gas of 0 (15% by volume) and 1 (85% by volume)
- Synthesis conditions Reaction pressure 40 Torr, substrate temperature 900, synthesis time 10 hours
- Synthesis method source gas excitation method: microwave plasma CVD method.
- K 0 1 WC-Co system (W: 91 wt%, Co: 5 wt%, C: 4 wt%)
- TiN-Ni Ti: 59 wt%, Ni: 6 wt%, Co: 9 wt%, Ta: 20 wt%, Mo: 6 wt%)
- a diamond-like thin film was formed in the same manner as in Examples 1 to 7 to obtain each diamond-coated member.
- the thickness of the formed diamond thin film was approximately 25 ⁇ m in each case.
- Heating Atmospheric pressure Temperature Time Solid solution porosity BET value Peeling area Adhesion Solid solution layer
- Example 8 TiC / K10 Heater Ar 2000 1400 30 7 60, 160 Almost None Large 4.40
- Example 9 TiC / K10 Heater Ar 2000 1350 60 5 50 120 Almost None Large 4.39
- Example 10 TiC / K10 Heater A r 2000 1300 120 3 40 100 Almost None Large 4.38
- Example 11 TiCN / KlO heater A r 2000 1350 120 5 50 120 Almost None Large 4.38
- Example 12 TaC / K10 Heater Ar 2000 1350 300 7 60 160 Almost None Large 4.42
- Example 14 TiC / K20 heater one 2 1350 1350 120 5 40 100 Almost none Large 4.32
- Example 15 TiC / KOl heater one ⁇ 2 1350 1350 60 4 50 120 Almost none Large 4.30
- Example 16 NbC / KlO heater Ar 2000 1350 180 5 40 100 Almost none Large 4.36
- Example 17 NbC
- a cemented carbide member K10, M10, or P1
- a coating layer titanium coating layer
- TiN, TiCN or TiC titanium coating layer
- Table 4 As shown in Table 4, as the base material, a cemented carbide member (K10, M10, or P1 A substrate coated with a coating layer (titanium coating layer) made of TiN, TiCN or TiC was used for 0), and this was heat-treated under each heat treatment condition shown in Table 4.
- K10, M10, and PI0 indicate the classification symbols for cemented carbide chips used based on JISB 4053, respectively. Have the following compositions, respectively.
- the surface of the cemented carbide substrate having at least the heat-treated titanium coat layer (at least on the surface of the titanium coat layer) is scratched with diamond abrasive particles having an average particle size of 1 ⁇ .
- a diamond-like thin film was formed on the surface under the following conditions to obtain each diamond-coated member. The thickness of the formed diamond thin film was approximately 25 im in each case.
- each of the diamond-coated members (comparative test pieces) obtained above was subjected to the indentation method in the same manner as in Examples 20 to 29 to form a diamond-like thin film and a substrate.
- the adhesion was evaluated. The results are shown in Table 4.
- TiN Thickness of titanium coating layer (TiN: 1-5 m. TiCN; 1.5 jum, TiC; 1.5 p.m, ⁇ i; 1 jLtm)
- Tungsten carbide 91.8% by weight, Titanium carbide 2.9% by weight, Cobalt 4.9 Used as a base material 12.7mm X 12.7mm substrate with 111% shaking as the main component was.
- the substrate was subjected to a heat treatment in an argon gas atmosphere at 2,000 atmospheres and 1,400 ° C. for 1 hour.
- the surface of the heat-treated substrate was observed with an electron microscope, it was observed that 2-3 Aim protruding crystals were formed on the substrate surface.
- the heat-treated substrate is placed on a substrate support in a diamond synthesis reaction tube, and a mixed gas of carbon monoxide gas containing 30% by volume of carbon monoxide gas and hydrogen gas is supplied to the reaction tube. It was distributed. Then, a microwave having a frequency of 2.45 GHz was introduced to form a diamond by a plasma CVD method.
- the pressure in the reaction tube was 40 torr, the temperature of the substrate was 80 O ⁇ C, and the reaction was performed for 5 hours. As a result, a diamond film having a thickness of 5 / Xm was formed on the surface of the substrate.
- the adhesion between the diamond film and the surface of the substrate was evaluated by an indentation method using the obtained diamond-like film-coated member.
- Table 5 shows the results. As shown in Table 5, the peeled area was 0.05 mm 2 , and the adhesion between the diamond film and the surface of the substrate was large.
- a diamond film coating member was obtained in the same manner as in Example 30 except that the composition of the base material was changed to 76.8% by weight of tungsten carbide, 8.6% by weight of titanium carbide, and 3.9% by weight of cobalt. Was.
- the resulting diamond-film-coated member was evaluated for adhesion between the diamond film and the surface of the substrate in the same manner as in Example 30.
- Table 5 shows the results. As shown in Table 5, the peeled area was 0.05 mm 2 and the adhesion between the diamond film and the surface of the substrate was large.
- a diamond film-coated member was obtained in the same manner as in Example 30 except that the heat treatment of the substrate was not performed.
- the obtained diamond-film-like coated member was evaluated for adhesion between the diamond film and the surface of the substrate in the same manner as in Example 30.
- Table 5 shows the results. As shown in Table 5, the peel area was 0.14 mm 2 Thus, the adhesion between the diamond film and the surface of the substrate was small.
- Example 3 The heat treatment under a reduced pressure of 1 0 3 torr, 1, 4 carried out at a temperature of 0 0 ° G, except that the space between the processing time was 1 hour was carried out in the same manner as in Example 3 0.
- the resulting diamond-coated film-coated member was evaluated for adhesion between the diamond film and the surface of the substrate in the same manner as in Example 30.
- Table 5 shows the results. As shown in Table 5, the peeled area was 0.16 mm 2 , and the adhesion was small.
- the base material was made of a cemented carbide consisting of 9% by weight of tungsten carbide, 3% by weight of tantalum carbide, and 6% by weight of cobalt, with a thickness of 2 mm and a side of 1 2-7 mm square.
- the substrate was heat-treated at 1,400 ° C. for 30 minutes under an atmosphere of argon gas at 2,000 atmospheres.
- the heat-treated substrate placed on the support base of the diamond synthesis reaction tube, introducing a mixed gas of hydrogen gas containing carbon monoxide gas 3 0 volume% as the raw material gas, frequency 2. 4 5 GH Z
- the film was excited using the microwave and a diamond thin film was formed by a plasma CVD method.
- the reaction was performed for 5 hours at a pressure of the reaction tube of 40 Torr and a temperature of the substrate of 800 ° C. to obtain a member coated with a diamond thin film having a thickness of 5 ⁇ m.
- Example 32 The same procedures as in Example 32 were carried out except that the heat treatment conditions for the base material were changed as shown in Table 6. Table 6 shows the results.
- Example 32 was repeated except that the heat treatment conditions for the base material were changed as shown in Table 6. Table 6 shows the results.
- a substrate made of cemented carbide consisting of 94% by weight of tungsten carbide and 6% by weight of cobalt and having a thickness of 2 mm and a side of 12.7 mm square was used.
- the substrate was heated to 900 at a reduced pressure of 40 Torr with a mixed gas flow rate of 70% by volume of carbon dioxide gas and 30% by volume of hydrogen gas at a reduced pressure of 40 Torr.
- the output was set to 350 and plasma treatment was performed for 60 minutes.
- the substrate thus treated is placed on a support in a diamond synthesis reaction tube, and a mixed gas of carbon monoxide gas and hydrogen gas containing 15% by volume of carbon monoxide gas is introduced as a source gas.
- Excitation was performed using microwaves at a frequency of 2.45 GHz, and a diamond thin film was formed by plasma CVD.
- the reaction was performed for 5 hours with the pressure of the reaction tube set to 40 T rr and the temperature of the substrate set to 900 ° C.
- the adhesion of the diamond thin film of the diamond-coated member obtained in this manner was evaluated in the same manner as in the above example. As a result, the peeled area of the diamond thin film in this case was 0.05 rara 2 and the adhesion was extremely good.
- a substrate made of tungsten carbide and titanium nitride-based cermet and having a thickness of l mm and a piece of 12.7 mra (the substrate composition of each substrate of Examples 37 to 45 was This was heat-treated under the conditions shown in Table 7-.
- the heat-treated substrate is placed on a substrate support in a diamond synthesis reaction tube, and a mixed gas of carbon monoxide gas containing 30% by volume of carbon monoxide gas and hydrogen gas is supplied to the reaction tube. It was distributed. Then, a microwave with a frequency of 2.45 GHz is introduced to form diamond by plasma CVD.
- the pressure in the reaction tube was 40 torr, the temperature of the substrate was 900 ° C., and the reaction was performed for 5 hours. As a result, a diamond film having a thickness of 10 / im was formed on the surface of the substrate.
- the resulting diamond-like membrane-coated member was plated by indentation.
- the adhesion between the diamond film and the surface of the substrate was evaluated.
- Table 7 shows the results. As shown in Table 7, in each of Examples 37 to 45, the peeled area was 0.05 mm 2 , and the adhesion between the diamond film and the surface of the substrate was large.
- a diamond-coated member was obtained in the same manner as in Examples 37 to 45 except that the heat treatment conditions for the base material were changed as shown in Table 7.
- Nitride Kei element (S i 3 N,) 92% by volume, titanium nitride (T i N) 3 volume% Oyobi sintering assistant ⁇ (Y 2 0 3) nitriding the mixed raw material consisting of 5 volume% was obtained by sintering Kei
- An elementary ceramics material was ground and processed into a SPGN-1 20308 thrower-wafer shape, and used as a substrate in a gas atmosphere of the type shown in Table 1.
- the substrate was subjected to a heat treatment at the heating temperature shown in Table 8 for 1 hour under the gas pressure shown in Table 8.
- the heat treatment significantly increased the substrate surface roughness (R ra , x ) from 0.8 jLt m to 2.0 ⁇ . From the electron micrograph, it was confirmed that silicon nitride (Si 3 ,) aggregated particles were formed on the surface of the substrate after the heat treatment.
- the base material subjected to the heat treatment is placed on a support table, charged into a diamond synthesis reactor, and used as a source gas in order to form a diamond-like thin film on the surface of the base material.
- T Introducing a mixed gas consisting of 15% by volume of carbon oxide and 85% by volume of hydrogen gas, under the conditions of 4 OT orr and substrate temperature of 1,000 ° C, by microwave CVD, 5Hifii) to perform a diamond synthesis reaction, and Five parts were manufactured.
- the thickness of the diamond-like thin film in the diamond coated member thus obtained was 12 ⁇ m.
- Table 8 shows the results of the cutting test.
- Example 45 1 to 7 times in argon up to 200 0 1 6 5 0 35000
- Example 46 Argon 2.1 times up to 20000 45000 m No film peeling.
- Example 47 1.7 times up to 9.5 m 400 m
- Example 48 Anoregon 1 to 3 times up to 9.5 16 00 28000 m No film peeling.
- Projection Example 49 Argon 2.8 times up to 200,000,750,59000 No film peeling.
- Example 50 Argon 2.4 fold up to 20000 50,000 50000 No film peeling.
- COMPARATIVE EXAMPLE 27 Argon 0.2 times at 1,400,500 m.
- Comparative Example 28 Argon At 1.0000 20000 m, 1.0 times film peeling was observed.
- One chip shape is used as the base material after grinding the base ceramic material, and the base material is used in a nitrogen gas atmosphere at a nitrogen pressure of 2.
- the heat treatment was performed for 1 hour under the conditions of 1, 000 atm and 1,650 ° C.
- the surface roughness (F u) of the base material was greatly increased from 0.8 iLt m to 2. From the electron micrograph, it was confirmed that silicon nitride (SiaN,) needle-like crystals were formed on the surface of the substrate after the heat treatment.
- the base material subjected to the heat treatment is placed on a support table, charged into a diamond synthesis reactor, and used as a source gas in order to form a diamond thin film on the surface of the base material.
- a mixed gas consisting of 15% by volume of carbon oxide and 85% by volume of hydrogen gas the microwave CVD method was used under the conditions of a pressure of 4 Torr or a substrate temperature of 900 ° C.
- a diamond synthesis reaction was performed to produce the desired five diamond-coated members.
- the thickness of the diamond thin film in the diamond coated member thus obtained is 20 m.
- this diamond-coated member has remarkably excellent adhesion between the base material and the diamond-like thin film, and has high performance even as a cutting tool requiring strict conditions such as strength, hardness, and wear resistance. It has been confirmed that the product has excellent durability and has a long service life. (Example 52)
- a diamond-coated member was manufactured in the same manner as in Example 51 except that the nitrogen gas pressure during the heat treatment of the substrate in Example 51 was changed to 9.5 atm. The same cutting test as in Example 51 was performed on this diamond-coated member.
- this diamond-coated member has remarkably excellent adhesion between the base material and the diamond-like thin film, and has high performance even as a cutting tool requiring strict conditions such as strength, hardness, and wear resistance.
- the product exhibited excellent durability and that the service life of ffl was remarkably long.
- the substrate was heat-treated in the same manner as in Example 51 except that the nitrogen gas pressure during the heat treatment of the substrate in Example 51 was changed to 1 atm (normal pressure). This heat treatment caused the base material to warp, making it unusable as a cutting tip.
- a substrate made of the same material as that used in Example 51 was used, and this substrate was used as it was without heat treatment in a pressurized nitrogen atmosphere under the same conditions as in Example 51.
- a thin film of diamonds was formed.
- a solid solution is formed by heat treatment on the surface of a specific cemented carbide or ceramic as a base material, and in some cases, a porous layer is formed. Since a certain solid solution layer is formed, and a diamond-like film is formed on the surface of such a solid solution layer, the solid solution layer itself is firmly bonded to the base material, and Since the diamond-like film is firmly bonded, the diamond-like film is firmly bonded to the substrate, and the diamond-like film does not peel off at high temperatures, resulting in excellent durability. Therefore, the diamond-coated member of the present invention can be applied to tools such as a cutting tool, a grinding tool, and a polishing tool having a remarkably long service life.
- the above-mentioned specific cemented carbide or cermet is used as a base material, and a solid solution is formed on the surface of the base material by heat treatment.
- a solid solution layer which is a porous layer is formed, and not only can a diamond-coated member formed by forming a diamond film on the surface of such a solid solution layer be produced, but also a silicon nitride-based material can be produced.
- a ceramic material is subjected to a heat treatment in a specific gas atmosphere at a specific temperature and gas pressure within a specific range, and then the heat-treated substrate is coated with a diamond thin film.
- the diamond coated member is manufactured by a specific method, the adhesion between the base material and the thin film (coat) of the tire is remarkably excellent, and the mechanical properties of the base material itself are improved. It has excellent strength, hardness, fracture toughness, etc., and exhibits sufficient practical performance and durability when used as a cutting tool or a wear-resistant member, and achieves a significantly longer life. Thus, it is possible to manufacture a diamond coated member which is extremely excellent in practical use.
- the diamond-coated member according to the present invention is excellent in adhesion of a diamond-based thin film, and thus can be suitably applied to cutting tools and the like.
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Cutting Tools, Boring Holders, And Turrets (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1019930700522A KR930701638A (ko) | 1991-06-24 | 1990-06-24 | 다이어몬드류 피복부재 및 그 제조방법 |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
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JP15154891 | 1991-06-24 | ||
JP3/151548 | 1991-06-24 | ||
JP3/155050 | 1991-06-27 | ||
JP3155050A JP3068242B2 (ja) | 1991-06-27 | 1991-06-27 | ダイヤモンド被覆部材の製造方法 |
JP3/323263 | 1991-12-06 | ||
JP32326391 | 1991-12-06 | ||
JP4/31055 | 1992-02-18 | ||
JP03105592A JP3260156B2 (ja) | 1992-02-18 | 1992-02-18 | ダイヤモンド類被覆部材の製造方法 |
JP03193892A JP3190090B2 (ja) | 1992-02-19 | 1992-02-19 | ダイヤモンド被覆部材の製造方法 |
JP4/31938 | 1992-02-19 | ||
JP4/41224 | 1992-02-27 | ||
JP04122492A JP3260157B2 (ja) | 1991-12-06 | 1992-02-27 | ダイヤモンド類被覆部材の製造方法 |
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WO1993000454A1 true WO1993000454A1 (en) | 1993-01-07 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP1992/000804 WO1993000454A1 (en) | 1991-06-24 | 1992-06-24 | Diamond-covered member and production thereof |
Country Status (3)
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EP (1) | EP0549801A4 (ja) |
KR (1) | KR930701638A (ja) |
WO (1) | WO1993000454A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0627498A1 (en) * | 1993-05-25 | 1994-12-07 | Ngk Spark Plug Co., Ltd | Ceramic-based substrate, and methods for producing same |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
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DE4437053A1 (de) * | 1994-10-18 | 1996-02-08 | Widia Gmbh | WC-Hartlegierung, Verfahren zu seiner Herstellung und seiner Verwendung |
WO1998028462A1 (de) | 1996-12-24 | 1998-07-02 | Widia Gmbh | Verbundkörper, bestehend aus einem hartmetall-, cermet- oder keramiksubstratkörper und verfahren zu seiner herstellung |
DE19722728A1 (de) * | 1996-12-24 | 1998-06-25 | Widia Gmbh | Verbundkörper, bestehend aus einem Hartmetall-, Cermet-, oder Keramiksubstratkörper und Verfahren zu seiner Herstellung |
JP4560964B2 (ja) * | 2000-02-25 | 2010-10-13 | 住友電気工業株式会社 | 非晶質炭素被覆部材 |
EP1644551A1 (de) * | 2001-09-06 | 2006-04-12 | Böhlerit ges.m.b.H. & CO.KG | Beschichter mehrphasiger körper |
JP4456378B2 (ja) | 2004-02-24 | 2010-04-28 | ペルメレック電極株式会社 | 導電性ダイヤモンド電極の製造方法 |
EP1829844B1 (en) | 2004-11-26 | 2016-09-07 | Kyocera Corporation | Silicon nitride based sintered compact and method for production thereof, and member for molten metal, member for hot working and member for excavation |
DE102005051685B4 (de) * | 2005-10-25 | 2009-07-30 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Werkstück aus einem Siliciumnitridsubstrat sowie Verfahren zu seiner Herstellung |
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JPS61104078A (ja) * | 1984-10-26 | 1986-05-22 | Toshiba Tungaloy Co Ltd | 硬質被覆焼結合金及びその製造方法 |
JPH01246361A (ja) * | 1988-03-28 | 1989-10-02 | Toshiba Tungaloy Co Ltd | 耐剥離性にすぐれたダイヤモンド被覆燒結合金及びその製造方法 |
JPH01255630A (ja) * | 1988-04-04 | 1989-10-12 | Mitsubishi Metal Corp | ダイヤモンド被覆炭化タングステン基超硬合金製切削工具の製造法 |
Family Cites Families (4)
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SE453474B (sv) * | 1984-06-27 | 1988-02-08 | Santrade Ltd | Kompoundkropp belagd med skikt av polykristallin diamant |
JPH0667797B2 (ja) * | 1987-10-12 | 1994-08-31 | 出光石油化学株式会社 | ダイヤモンドの合成方法 |
JPH01162770A (ja) * | 1987-12-18 | 1989-06-27 | Kyocera Corp | ダイヤモンド被覆部材 |
WO1992005904A1 (en) * | 1990-10-05 | 1992-04-16 | Sumitomo Electric Industries, Ltd. | Hard material clad with diamond, throwaway chip, and method of making said material and chip |
-
1990
- 1990-06-24 KR KR1019930700522A patent/KR930701638A/ko not_active Application Discontinuation
-
1992
- 1992-06-24 WO PCT/JP1992/000804 patent/WO1993000454A1/ja not_active Application Discontinuation
- 1992-06-24 EP EP19920912845 patent/EP0549801A4/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61104078A (ja) * | 1984-10-26 | 1986-05-22 | Toshiba Tungaloy Co Ltd | 硬質被覆焼結合金及びその製造方法 |
JPH01246361A (ja) * | 1988-03-28 | 1989-10-02 | Toshiba Tungaloy Co Ltd | 耐剥離性にすぐれたダイヤモンド被覆燒結合金及びその製造方法 |
JPH01255630A (ja) * | 1988-04-04 | 1989-10-12 | Mitsubishi Metal Corp | ダイヤモンド被覆炭化タングステン基超硬合金製切削工具の製造法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0627498A1 (en) * | 1993-05-25 | 1994-12-07 | Ngk Spark Plug Co., Ltd | Ceramic-based substrate, and methods for producing same |
US5725932A (en) * | 1993-05-25 | 1998-03-10 | Ngk Spark Plug Co., Ltd. | Ceramic-based substrate for coating diamond and method for preparing substrate for coating |
US5858480A (en) * | 1993-05-25 | 1999-01-12 | Ngk Spark Plug Co., Ltd. | Ceramic-based substrate for coating diamond and method for preparing substrate for coating |
Also Published As
Publication number | Publication date |
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EP0549801A1 (en) | 1993-07-07 |
KR930701638A (ko) | 1993-06-12 |
EP0549801A4 (en) | 1993-10-06 |
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