M334463 八、新型說明： 【新型所屬之技術領域】 本創作係關於一種封裝結構，尤指採用獨立封裝體的封裝結 構0 【先前技術】 封裝形式除了有最早發展出來的兩排直立式封裝(dual in line package ’ DIP)外’尚有晶粒承載器（chip carrier)、覆晶 (FC)、針格陣列(pin grid array ; PGA)、膠帶承載器（tape carrier)、密封包裝(hermetic package)、球格陣列（ball grid array ; BGA)、四方平麵包裝(quad flat package ; QFP)、導線架 在晶粒之上（lead on chip ; LOC)、晶粒尺寸封裝（chip scaie package，CSP)、裸晶(bare die)、膠帶承載器封裝(tape carrier package ; TCP)等。 不論上述哪種封裝製程，通常都會經過灌膠製程步驟。一般 來說’灌膠製程都是藉著壓模成型(molding)，亦即模具夾住晶片 載體（即具有複數個晶片的印刷電路板），並在該晶片载體被容置 在模具模穴時，以適當的昇溫條件與充填壓力下，將封裝體填充 至上述模穴中，以密封保護住晶片。最後，經過固化步驟，使封 裝體被固化成型。 M334463 然而’上述晶片載體上具有複數個晶片或其他元件時，這使 得上述灌膠餘情欲卿的對象，因為其表針料均句，當 封裝體從模具的-端被導人時，非常容轉致封裝體在模具内^ 有模流不均自的縣，勒導賴裝體包触轉，而在封裝體 内形成空隙。 义 在完成封裝讀，為了職數賴體單^(分別包含M334463 VIII. New Description: [New Technology Field] This creation is about a package structure, especially a package structure with a separate package. [Prior Art] In addition to the earliest developed two-row vertical package (dual) In line package 'DIP) outside 'chip carrier, flip chip (FC), pin grid array (PGA), tape carrier, hermetic package , ball grid array (BGA), quad flat package (QFP), lead on chip (LOC), chip scaie package (CSP), Bare die, tape carrier package (TCP), etc. Regardless of which of the above packaging processes, it is usually through the potting process step. Generally, the 'filling process' is by molding, that is, the mold sandwiches the wafer carrier (ie, a printed circuit board having a plurality of wafers), and the wafer carrier is housed in the mold cavity. At the same time, the package is filled into the above-mentioned cavity under appropriate temperature rising conditions and filling pressure to seal and protect the wafer. Finally, the curing step is carried out to cure the package. M334463 However, when there are a plurality of wafers or other components on the above wafer carrier, this makes the above-mentioned object of the glue filling, because the needle material is uniform, when the package is guided from the end of the mold, it is very In the case where the mold is in the mold, the mold flow is not uniform, and the package is twisted to form a void in the package. Righteousness in the completion of the package read, for the job number
、 〜匕3日日月X 曰曰片載體緣出來’在每個賴單狀㈣事蚊財切割道 因此，在對著整個晶片導人封裝料，由於蝴道上 任何晶片或其他元件，使得在切割道上的封裝體將流動得相對幸 快’並且由於流動中的封裝體容易遭到晶片所阻撞，因此阻祀 封裝體橫向流動、以及_流至晶肢面之上，最致了 不均勻的現象。 彳又ί編 為解決此問題，已有人提出美國專利第·观 上效果仍然有限。 貝探 公^第了^1=模流不均關題’已有人提出中華民國專利 ，_5遽「陣列型態基板上封踢 剎這上額外設置阻礙物，而 ^精耆勒 而平均化《則_上_動2切封韻過快流動， 封：切有不夠均㈣’在針對屬於麵纖维的 作為’就用雷射切割還是無法提供極為平坦的表 % >1334463 % 面’而採用沖切(punching)切割時，其平坦度更差。底下，先簡 單說明玻璃纖維的特性，再說明為什麼雷射切割玻璃纖維時仍無 法提供夠平坦的表面。 上述玻璃纖維主要是用玻璃熔體拉製成的纖維，其主要成分 :為二氧化矽、氧化鋁、氧化鈣。玻璃纖維又分矽酸鹽玻璃纖維和 硼石夕酸鹽玻璃纖維兩大類。石夕酸鹽玻璃纖維又根據特性分為：無 鹼電絕緣玻璃(E玻璃）、鹼玻璃(A玻璃）、耐化學玻璃(c玻璃）、 • 紐玻璃(S玻璃）、含鑽玻璃（L玻璃）、高彈性模量玻璃(M玻璃) 和低介電玻璃（D破璃)等。 在製作玻璃纖維時，若採用玻璃球法時，需先根據要求的配 方製成玻璃小球，剔除次品，並後送入掛禍中炼融，使溶態玻璃 從·底部的許多小孔中流出形成絲束。此後，將絲束上油並集 束再运到速度高達2GGG〜5咖公尺/分的拉絲機捲繞筒上，拉伸 喊為玻稿。若採職接法時，不f要絲成_球，可以直 接將各組分按配關時投人池窯⑽融，___清後通過 .窯内數十塊拉絲板的小孔流出’再按前述處王里工序獲得玻璃長絲。 - 不論採用何種方法製作玻璃纖維時，破璃纖維中必定包含有 玻璃的成分，這使得雷射切割時所帶來的高溫，在雷射綱到有 玻璃成分時，熱量容錄中在某處，導致麵纖維受料均，被 =割掉的厚度自然也不均勻’同時玻璃成分容易在切割時整個脫 洛’進轉致玻璃纖維被雷射切割時仍無法提供夠平坦的表面。 7 M334463 【新型内容】 本創作之主要目的雜供_種採_立封裝體的封裝結構， 二=平均分散人雜力縣__元，喊縣體平坦的封 7構。_此立封賴的方式時，也盡量減少封裝體需要 "刀賴度，職細謂物，獅㈣的後果。 曰目的，本創她獨立糊的封裝結構主要包含 Γ載肢(包含有複數個載體單元）、設置於晶片載體上的複數個 =、分麵模形成(mQlding)於晶㈣體上的每個晶片之上的複 二^。為了製物立封跡·咖別晶片作個別 載雕」曰*，由於入膠時所帶來的壓力被平均分散至每個 载脰早疋’而獲得整縣坦的雌結構。 式得：==點與精神可以藉由以下的新型詳述及_ 【實施方式】 縣圖為本創作_立封裝體白 工丁心圖如第1A圖所示，在本創作製造方; 以及下社要是⑻鋪ig。別細ig具有上表I 並且在&兩個表面切⑽成有外層線路層(未描 、、，曰，以便與晶片12a〜12b(例如快閃記憶體矩陣)作電性連接。在 M334463 ==俗㈣痛謝概㈤，嶋體ι〇包含 ::的魏個載體單元㈤.且每1體單元·⑽定義 有曰曰片接合區，以便安裝晶片12a〜12b。 =封裝時，如第1B圖所示，針對晶片紐訂的晶片 二物形成㈤ding)複數個封裝體16。具體來說，利用 冲子固別晶片12a〜12b作個別入膠的模具(未以充 =體填入模具模穴中，而形成個別地封裝住每侧12遷 封4體16。如此一來，在封裝時平均分散入膠壓力至每 個載體單元.⑽，而獲得整體平坦的塊結構。 母 _ =1Β圖所示之結構中，複數個封裝體16之間的區域仍被 疋批14。在晶片载體1G上屬於切割道U的區域之上具 =_如，且薄層膠_連接至複數個封裝體16。換句 »祝’溥層膠體16a的厚度遠小於複數個封裝體Μ。這使得，採 =種獨立封裝體的方式時，也盡量減少封裝體Μ需要被切割的 二以縮短__日_，聽帶來不_後果。需注意的 疋’溥=勝體16a與複數個封裝體16的材料為玻璃纖維。 疋成封衣之後4了將複數個載體單元版〜⑽(分別包含 晶片晶片载體1()分離出來，在每個載體單元伽〜⑽ 之間已事先定A有彼此交錯的_道14。在相對於蝴道Μ的晶 八、10的内种亚未有任何線路或電子元件，並且能已事先部 刀挖空，以利後續切割的進行，不過在相對位置上的晶片載體⑺ 9 M334463 的上表面、下表面上可能具有猶詹。在需要分軸成品時，可 依，產品特性的需求(例如SD卡），利甩雷射等手段沿著切割道14 進灯切灿所需的外型，或配合已事先挖空的部分完成切型。 此外’在上述每―“接合區上可疊設有魏個晶片，而不 僅限於如帛1Α〜1Β崎示之單層晶㈣雜、轉。 藉由以上較越體實補之舰，係輕缺加清楚描述本 本創作之料加以限制。相反地，其目的是希望能涵蓋各種改變 及具齡性的铸於摘作所欲申請之翻範圍的鱗内。 【圖式簡單說明】 的封裝結構之製造方式 第1A〜1B圖為本創作採用獨立封裝體 示意圖。 【主要元件符號說明】 10晶片載體 10a〜10b載體單元 12a〜12b晶片 14切割道 16封裝體 16a薄層膠體, ~ 匕 3 日 日 日 X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X X The package on the scribe line will flow relatively fast' and because the package in the flow is easily blocked by the wafer, the barrier package flows laterally, and flows to the surface of the crystal body, resulting in the most uneven The phenomenon. In order to solve this problem, it has been suggested that the effect of the US patent is still limited. Beyond the public ^ first ^1 = mold flow unevenness question 'has been proposed by the Republic of China patent, _5 遽 "array type substrate on the top of the kick brakes on this additional obstacles, and ^ fine and even average Then _上_动2cutting rhyme is too fast flowing, sealing: cutting is not enough (four) 'in the case of the surface fiber's use 'with laser cutting or can not provide an extremely flat table% >1334463 % face' When punching and cutting, the flatness is even worse. Underneath, the characteristics of the glass fiber are briefly explained, and it is explained why the laser can not provide a flat surface when the glass fiber is cut. The above glass fiber is mainly melted with glass. The main components of the fiber are: cerium oxide, aluminum oxide, calcium oxide. The glass fiber is divided into two categories: bismuth silicate glass fiber and borax silicate glass fiber. Features are: alkali-free electrical insulating glass (E glass), alkali glass (A glass), chemical glass (c glass), • New glass (S glass), diamond-containing glass (L glass), high elastic modulus glass (M glass) and low dielectric glass (D glass In the production of glass fiber, if the glass ball method is used, it is necessary to first make a glass ball according to the required formula, remove the defective product, and then send it into the disaster to smelt, so that the dissolved glass is from the bottom. A plurality of small holes flow out to form a tow. Thereafter, the tow is oiled and bundled and transported to a wire drawing drum of a speed of up to 2 GGG to 5 deg/min, and the drawing is called a glass draft. When the law is not, the yarn should be _ball, and the components can be directly injected into the kiln (10) when they are matched. After ___clear, pass through the small holes of dozens of drawing plates in the kiln. In the process, glass filaments are obtained. - Regardless of the method used to make the glass fiber, the glass fiber must contain the glass component, which causes the high temperature caused by laser cutting, when the laser is composed of glass. In the heat recording, somewhere, the surface fiber is received, and the thickness of the cut is naturally uneven. At the same time, the glass component is easy to be cut when the whole glass is cut. Provide a flat surface. 7 M334463 [New Content] The purpose of the miscellaneous supply _ seed mining _ vertical package packaging structure, two = the average dispersion of the people's miscellaneous county __ yuan, shouting the county body flat seal 7 structure. _ This way to seal the way, also minimize the package The need for "Knife Lai, the job is the premise, the lion (four) consequences. In addition, the creation of her independent paste package structure mainly contains the Γ carrier (including a plurality of carrier units), a plurality of sets on the wafer carrier =, the face mold is formed (mQlding) on the wafer (four) body on the top of each wafer. For the purpose of the production of the seal, the coffee chip for individual sculptures 曰 *, due to the glue The pressure is evenly distributed to each female sputum, and the female structure of the entire county is obtained. Formula: == point and spirit can be explained by the following new details and _ [Embodiment] County map-based creation _ stand-up package white work Dingxin diagram as shown in Figure 1A, in the creation of the creation; If the next society is (8) shop ig. The other ig has the above table I and is cut (10) on both surfaces to form an outer wiring layer (not drawn, 曰, so as to be electrically connected to the wafers 12a to 12b (for example, a flash memory matrix). In M334463 == vulgar (four) painful (5), 嶋 ι 〇 contains:: Wei carrier unit (5). And each body unit (10) defines a splicing area for mounting the wafers 12a~12b. As shown in FIG. 1B, a plurality of packages 16 are formed (f) ding for the wafer blanks. Specifically, the punching molds 12a to 12b are used as individual molds for inserting the glue (not filled into the mold cavity by the filling body, and the body 16 is individually packaged for each side 12). When the package is evenly dispersed into the adhesive pressure to each carrier unit (10), an overall flat block structure is obtained. In the structure shown in the parent _ =1 Β diagram, the area between the plurality of packages 16 is still batched 14 On the wafer carrier 1G, the area belonging to the dicing street U has __, and the thin layer of glue _ is connected to the plurality of packages 16. The thickness of the slab layer 16a is much smaller than that of the plurality of packages. Μ 这 这 这 这 采 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种 种The material of the plurality of packages 16 is glass fiber. After the sealing, a plurality of carrier unit plates (10) (containing the wafer wafer carrier 1 (), respectively, are separated between each carrier unit and (10). It has been determined in advance that A has a staggered _way 14. In the opposite of the Μ Μ Μ 、, 10 Any circuit or electronic component, and can be hollowed out in advance to facilitate the subsequent cutting, but the wafer carrier (7) 9 M334463 in the relative position may have a semi-finished product on the upper surface and the lower surface. At the time, depending on the characteristics of the product (such as SD card), the laser and other means can be used to cut the desired shape along the cutting path 14 or to complete the cutting type with the part that has been previously hollowed out. In each of the above-mentioned "joining areas", Wei wafers may be stacked, and are not limited to single-layer crystals (four), such as 帛1Α~1Β崎, which are represented by the above-mentioned more complex body. The purpose of clearly defining the material of the present invention is to limit it. On the contrary, the purpose is to cover the various scales and ages of the scales of the application for the purpose of the application. Modes 1A to 1B are schematic views of a separate package for the creation of the present invention. [Main Symbol Description] 10 wafer carriers 10a to 10b carrier units 12a to 12b wafer 14 dicing 16 package 16a thin layer colloid