TWI852022B - Temperature control device, method, and server - Google Patents

Abstract

This application provides a temperature control device, the temperature control device includes a temperature sensor, a control unit, a heating component, and a ventilation component. The temperature sensor is used to sense the temperature in a server; the control unit is used to determine whether the temperature in the server is less than a preset temperature. When the temperature in the server is less than a preset temperature, the heating component heats the server, and the ventilation component switches to the off state. When the temperature inside the server is not less than the preset temperature, the heating component stops heating the server and the ventilation component switches to the open state. The present application also provides a temperature control method and a server. Thus, the temperature control device, method and server can dynamically adjust the temperature inside the server by the heating component and the ventilation component.

Description

Temperature control device, method and server

This application relates to the field of server technology, in particular to a temperature control device method and a server.

With the development of Internet technology, the application of servers is becoming more and more extensive. For servers, temperature is one of the factors that affect whether they can work normally. In a low temperature environment, the server may not be able to start normally. By setting up temporary heating equipment (such as a heater) next to the server, the temperature of the server can be increased, but this method consumes a lot of manpower and material resources and is not convenient to operate; by sticking a heating sheet inside the server, the temperature of the server can also be increased, but the power of the heating sheet is not easy to control, and the heating circuit is scattered in the server, which increases the difficulty of server maintenance.

In view of the above problems, this application provides a temperature control device, method and server, which can control the temperature inside the server.

The present application provides a temperature control device, which is applied in a server, and includes a temperature sensor, a control unit, a heating component, and a ventilation component; the temperature sensor is used to sense the temperature in the server; the control unit is electrically connected to the temperature sensor, the heating component, and the ventilation component, and the control unit is used to determine whether the temperature in the server is lower than a preset temperature; when the temperature in the server is lower than the preset temperature, the control unit outputs a first control signal, and the heating component is turned on. The component heats the server according to the first control signal, and the ventilation component switches to a closed state according to the first control signal to retain the heat generated by the heating component in the server; when the temperature in the server is not less than the preset temperature, the control unit outputs a second control signal, the heating component stops heating the server according to the second control signal, and the ventilation component switches to an open state according to the second control signal to dissipate the heat in the server to the outside.

In some possible implementations, the heating assembly includes a heating element and a heat sink fin assembly. The heating element is attached to one side of the heat sink fin assembly. The heating element is electrically connected to an external power source. When the temperature inside the server does not reach a preset temperature, the control unit controls the heating element to heat and transfer the heat to the heat sink fin assembly. The heat sink fin assembly is used to transfer the heat to the server.

In some possible implementations, the ventilation assembly includes a track and a ventilation plate. The track includes a first extension member and a second extension member. The first extension member extends from the frame surface of the server along a first direction and is bent parallel to the frame surface along a second direction. The second extension member is disposed opposite to the first extension member in the second direction, and the bending direction of the second extension member is opposite to that of the first extension member. An accommodation space is formed between the first extension member and the second extension member, and the ventilation plate is disposed in the accommodation space.

In some possible implementations, through holes are provided on the vent plate and the frame, and the vent assembly further includes a switch assembly, which includes a switch and a drive, one end of the drive is connected to the switch, and the other end of the drive is connected to the vent plate, and the switch assembly is used to control the drive to push and pull the vent plate so that the vent plate slides on the track.

In some possible implementations, when the temperature inside the server is lower than the preset temperature, the driver drives the vent plate to slide on the track, so that the vent plate and the through hole on the frame are misaligned, so as to control the server to be disconnected from the outside world; when the temperature sensor detects that the temperature inside the server reaches the preset temperature, the driver drives the vent plate to slide on the track, so that the vent plate and the through hole on the frame are aligned, so as to control the server to be connected to the outside world.

In some possible implementations, a first fan and a second fan are disposed in the server, the first fan and the second fan are disposed adjacent to each other, and the first fan and the heat sink fin assembly are disposed opposite to each other.

In some possible implementations, when the first fan is turned on and the second fan is turned off, a first air duct is formed to accelerate the heating of the server; when both the first fan and the second fan are turned on, a second air duct is formed to accelerate the heat dissipation of the server.

In some possible implementations, a third fan is disposed adjacent to the heat sink fin assembly, and the third fan is used to dissipate the heat on the heat sink fin assembly into the server; when the first fan and the third fan are activated and the second fan is turned off, a third air duct is formed to accelerate the heating of the server; when the first fan, the second fan and the third fan are all activated, a fourth air duct is formed to accelerate the heat dissipation of the server.

This application also provides a temperature control method, including: sensing the temperature inside the server; if the temperature inside the server does not reach the preset temperature, executing the heating method, otherwise executing the cooling method; sensing the temperature inside the server again, if the temperature inside the server does not reach the preset temperature, executing the heating method, otherwise executing the cooling method; the heating method includes: controlling the heating component to heat the server, and controlling the ventilation component to switch to a closed state to retain the heat generated by the heating component in the server; the cooling method includes: controlling the heating component to stop heating the server, and controlling the ventilation component to switch to an open state to dissipate the heat in the server to the outside.

This application also provides a server, including the above-mentioned temperature control device.

Therefore, the temperature control device, method and server provided by this application can dynamically adjust the temperature inside the server through the heating component and the ventilation component.

10: Server

11: Temperature sensor

12: Control unit

101: Power supply components

102: Shell

1021: Upper cover

1022:Border

1023: First edge

103: Processor

104: Motherboard

105: Isolation parts

106: Input/output interface

107: Memory device

100, 200, 300: Temperature control device

1001: First heating component

1002: First heating sheet

1003: First connecting piece

1004: First heat sink fin assembly

1005: Air guide

1006: First heating circuit

1007: Heat sink fins

201: First Fan

202: Second Fan

203: Ventilation assembly

2031: First ventilation piece

2032: Second ventilation piece

204:Track

2041: First extension piece

2042: Second extension piece

205: Ventilation plate

206: Switch assembly

207: Switch parts

208:Driver

209:Block

301: Second heating component

302: The Third Fan

303: Second heat sink fin assembly

L1: First air duct

L2: Second air duct

L3: The third air duct

L4: The fourth air duct

S1-S6: Steps

Figure 1 is a schematic diagram of the server structure provided in this application.

Figure 2 is a schematic diagram of a circuit module of a temperature control device provided in one embodiment of the present application.

Figure 3 is a schematic diagram of the structure of the temperature control device in Figure 2.

Figure 4 is a schematic diagram of a circuit module of a temperature control device provided in another embodiment of the present application.

Figure 5 is a schematic diagram of the structure of the temperature control device in Figure 4.

Figure 6 is a schematic diagram of the first ventilator in Figure 4 being arranged on a baffle outside the server.

Figure 7 is a schematic diagram of the structure of the first ventilation component in Figure 4 in the open mode.

Figure 8 is a schematic diagram of the structure of the first ventilation part in Figure 4 in the closed mode.

Figure 9 is a schematic diagram of the first air duct.

Figure 10 is a schematic diagram of the second air duct.

Figure 11 is a schematic diagram of a circuit module of a temperature control device provided in another embodiment of the present application.

Figure 12A is a schematic diagram of the overall structure of the temperature control device in Figure 11.

Figure 12B is a schematic diagram of the structure of the second heating component in Figure 11.

Figure 13 is a schematic diagram of the third air duct.

Figure 14 is a schematic diagram of the fourth air duct.

Figure 15 is a flow chart of the temperature control method provided in this application.

In the embodiments of this application, the terms "first" and "second" are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying order. For example, the first application, the second application, etc. are used to distinguish different applications, rather than to describe the specific order of applications. The characteristics of "first" and "second" can explicitly or implicitly include one or more of the characteristics.

Please refer to Figure 1, which is a schematic diagram of the server 10 provided in this application. The server 10 includes a power supply assembly 101, a housing 102, a processor 103, and a motherboard 104.

The housing 102 includes a cover 1021 and a frame 1022 . A first edge 1023 of the cover 1021 is connected to one side of the frame 1022 . The cover 1021 can rotate relative to the frame 1022 around the first edge 1023 , so that the housing 102 can be in a closed state or an open state. Optionally, an isolator 105 is disposed in the housing 102, and the two ends of the isolator 105 are fixedly connected to the two sides of the frame 1022 disposed opposite to each other, so as to divide the internal space contained in the housing 102 into a first cavity and a second cavity, a power supply assembly 101 is disposed in the first cavity, a motherboard 104 is disposed in the second cavity, a processor 103 is disposed on the motherboard 104, and the power supply assembly 101 is used to supply power to the motherboard 104 and the processor 103. For example, a through hole is disposed on the isolator 105, and the power supply assembly 101 is electrically connected to the motherboard 104 and the processor 103 through the through hole to supply power to the motherboard 104 and the processor 103.

In some embodiments, an input/output (I/O) interface 106 is also provided on one side of the frame 1022, and an external device is electrically connected to the motherboard 104 through the input/output interface 106 to realize data interaction between the external device and the motherboard 104.

The motherboard 104 is provided with a memory device 107 for storing program codes, computer data, etc. Optionally, other components are also provided on the motherboard 104, such as a platform controller hub (PCH), a hard disk driver (HDD), etc., to maintain the normal operation of the server 10.

In some embodiments, the server 10 also includes a temperature control device 100. The temperature control device 100 is used to control the temperature inside the server 10 so that the components inside the server 10 can operate normally.

Specifically, please refer to Figure 2, which is a circuit module diagram of a temperature control device 100 provided in an embodiment of the present application. The temperature control device 100 includes a temperature sensor 11, a control unit 12, and a first heating component 1001.

The temperature sensor 11 is electrically connected to the control unit 12, and the control unit 12 is electrically connected to the first heating component 1001.

The temperature sensor 11 is disposed in the server 10 to sense the temperature in the server 10. The temperature sensor 11 can transmit the sensed temperature in the server 10 to the control unit 12 through a temperature signal. The control unit 12 is used to determine whether the temperature in the server 10 is lower than a preset temperature according to the temperature signal. If the temperature in the server 10 is lower than the preset temperature, it means that the current temperature of the server 10 is lower than the working temperature. The control unit 12 outputs a first control signal to the first heating component 1001; if the temperature in the server 10 is not lower than the preset temperature, the control unit 12 outputs a second control signal to the first heating component 1001.

The first heating component 1001 is disposed on the processor 103, and is used to heat the server 10 according to the first control signal, or to stop heating the server 10 according to the second control signal.

Thus, the control unit 12 can control the first heating component 1001 to heat or stop heating the server 10 according to the temperature inside the server 10, so as to dynamically adjust the temperature inside the server 10.

In this embodiment, the first heating assembly 1001 is disposed on the processor 103. As shown in FIG3, the first heating assembly 1001 includes a first heating plate 1002, a first connector 1003, and a first heat sink fin assembly 1004. The first heat sink fin assembly 1004 can be disposed on the surface of the processor 103 to absorb the heat generated by the processor 103 during operation. The first heat sink fin assembly 1004 can include a plurality of heat sink fins 1007. These heat sink fins 1007 can be arranged in a rectangular shape, and each heat sink fin 1007 can be arranged at intervals. In some embodiments, the heat sink fin 1007 can be made of copper, aluminum, or other metal materials with good thermal conductivity.

Optionally, an air guide 1005 (shown in FIG. 1 ) may be provided on the first heat sink fin assembly 1004 . The air guide 1005 is used to guide the airflow in the server 10 to dissipate heat from the first heat sink fin assembly 1004 , thereby improving the heat dissipation effect.

The first connector 1003 is detachably disposed on one side of the first heat sink fin assembly 1004, the first heating sheet 1002 is attached to the surface of the first heat sink fin assembly 1004, the first heating sheet 1002 is provided with a first heating circuit 1006, and both ends of the first heating circuit 1006 are electrically connected to the first connector 1003. Specifically, the first heating circuit 1006 may include a resistor, and the first heating circuit 1006 is continuously bent and disposed inside the first heating sheet 1002 to increase the length of the first heating circuit 1006 and optimize the heating effect.

In some embodiments, the first connector 1003 can be connected to an external power source or to the power assembly 101. The first connector 1003 receives the first control signal output by the control unit 12 and conducts the electrical connection with the external power source or the power assembly 101 to control the external power source or the power assembly 101 to pass current into the heating circuit. According to Joule's law, the current flowing through the heating circuit will be converted into heat, so that the first heat sink fin assembly 1004 heats up. The first heat sink fin assembly 1004 transfers the heat to the processor 103, thereby causing the processor 103 to heat up. In a low temperature environment, the processor 103 can be quickly heated through the temperature control device 100, so that the server 10 can work normally in a low temperature state.

Please refer to FIG. 4, which is a circuit module diagram of a temperature control device 200 provided in another embodiment of the present application. The difference between the temperature control device 200 provided in this embodiment and the temperature control device 100 shown in FIG. 2 is that the temperature control device 200 further includes a first fan 201, a second fan 202, and a ventilation component 203. The control unit 12 is electrically connected to the first fan 201, the second fan 202, and the ventilation component 203.

The first fan 201 and the second fan 202 are used to transfer the heat in the server 10 to the components on the motherboard 104 through wind flow, or to dissipate the heat generated by the components to the outside through wind flow.

The ventilation component 203 is used to control the connection between the server 10 and the outside world so that the heat inside the server 10 can be dissipated, or to control the server 10 to be disconnected from the outside world so that the heat inside the server 10 can be quickly transferred to the components on the motherboard 104, thereby accelerating the heating rate and efficiency of the components inside the server 10.

The control unit 12 can output a third control signal or a first control signal or a second control signal to the first fan 201 and/or the second fan 202. The first fan 201 and/or the second fan 202 can be activated according to the first control signal to accelerate the heat conduction in the server 10, or can be shut down according to the second control signal to maintain the heat in the server 10.

In some embodiments, if the temperature in the server 10 is lower than the preset temperature, the control unit 12 also outputs a first control signal to the ventilation component 203. If the temperature in the server 10 is not lower than the preset temperature, the control unit 12 outputs a second control signal to the ventilation component 203. The ventilation component 203 controls the server 10 to connect with the outside world according to the first control signal, so that the heat in the server 10 can be dissipated, or the ventilation component 203 controls the server 10 to disconnect from the outside world according to the second control signal, so that the heat in the server 10 can be quickly transferred to the components on the motherboard 104, thereby accelerating the heating rate and efficiency of the components in the server 10.

Please refer to FIG. 5, which is a structural diagram of a temperature control device 200 provided in another embodiment of the present application. The ventilation assembly 203 includes a first ventilation member 2031 and a second ventilation member 2032. The first fan 201 and the second fan 202 are both disposed on the motherboard 104, and the first fan 201 and the second fan 202 are disposed adjacent to each other. The first fan 201 and the first heating assembly 1001 are disposed at intervals. The first ventilation member 2031 and the second ventilation member 2032 are respectively disposed on two opposite surfaces of the frame 1022, and the first ventilation member 2031 and the second ventilation member 2032 are disposed opposite to each other. In this embodiment, the number of first fans 201 is 5, the number of second fans 202 is 3, and the first fans 201 are arranged on one side of the second fans 202 close to the power supply assembly 101.

The first ventilator 2031 and the second ventilator 2032 are used to control the connection between the server 10 and the outside world, so that the heat inside the server 10 can be dissipated through the first ventilator 2031 and/or the second ventilator 2032, or control the server 10 to be disconnected from the outside world, so that the heat inside the server 10 can be quickly transferred to the components on the motherboard 104, thereby accelerating the heating rate and efficiency of the components inside the server 10.

In some embodiments, the first ventilator 2031 may also be disposed on a baffle outside the server 10, as shown in FIG6, to prevent the first ventilator 2031 from being inconveniently disposed on the frame 1022 of the server 10 due to the relatively scattered input/output interfaces 106.

Please refer to Figure 7, which is a schematic diagram of the structure of the first ventilation component 2031 provided in this application in the open mode.

The first ventilating member 2031 includes a track 204, a ventilating plate 205, and a switch assembly 206. The track 204 includes a first extension member 2041 and a second extension member 2042. The first extension member 2041 is substantially L-shaped, extending from the surface of the frame 1022 along a first direction (Z direction), and then extending parallel to the surface of the frame 1022 along a second direction (Y direction). The second extension member 2042 is disposed opposite to the first extension member 2041 in the second direction (Y direction), and the bending direction of the second extension member 2042 is opposite to that of the first extension member 2041. An accommodation space is formed between the first extension member 2041 and the second extension member 2042, and the ventilating plate 205 is disposed in the accommodation space, and the ventilating plate 205 can slide in the accommodation space along a third direction (X direction). There are multiple through holes evenly arranged on the vent plate 205, and there are multiple through holes correspondingly arranged on the frame 1022. The second vent 2032 has the same structure and working principle as the first vent 2031, and will not be elaborated here.

The switch assembly 206 includes a switch 207 and a drive 208. One end of the drive 208 is connected to the switch 207, and the other end of the drive 208 is connected to the vent plate 205. The switch 207 is electrically connected to the control unit 12. The switch 207 is used to control the drive 208 to push and pull the vent plate 205 according to the first control signal or the second control signal, so that the vent plate 205 slides on the track 204. Optionally, the drive 208 includes an elastic connector, and the switch 207 can drive the elastic connector to elastically deform through electromagnetic induction, thereby controlling the vent plate 205 to slide on the track 204. Specifically, the switch 207 includes an electromagnet. When the electromagnet is energized, a magnetic field is generated, and the elastic connector is attracted by the magnetic field force to pull the vent plate 205.

When the switch 207 receives the second control signal, the switch 207 switches to the on state, and the driving member 208 controls the vent plate 205 to slide, so that the through hole on the vent plate 205 is aligned with the through hole on the frame 1022, thereby realizing the connection between the outside and the inside of the server 10, so as to accelerate the heat dissipation in the server 10.

Please also refer to Figure 8, which is a schematic diagram of the structure of the first ventilation component 2031 provided in this application in the closed mode.

It can be understood that when the temperature sensor 11 in the temperature control device 200 detects that the server 10 has not reached the preset temperature, the control unit 12 outputs a first control signal to the switch 207, the switch 207 switches to the disconnected state, and the drive 208 controls the vent plate 205 to slide, so that the through hole on the vent plate 205 and the through hole on the frame 1022 are misaligned, thereby achieving disconnection between the outside and the inside of the server 10. As a result, the heat generated by the first heating plate 1002 in the temperature control device 200 will not escape to the outside through the first vent 2031 and the second vent 2032, and the inside of the server 10 can be quickly heated up, thereby improving the heating rate and efficiency of the inside of the server 10.

Please refer to Figure 9, which is a schematic diagram of the first air duct L1 of the temperature control device 200 provided in this application.

When the temperature sensor 11 detects that the temperature inside the server 10 is lower than the preset temperature, the control unit 12 outputs a first control signal to the switch 207 of the first ventilator 2031 and the second ventilator 2032. The switch 207 controls the through hole on the ventilating plate 205 and the through hole on the frame 1022 to be misaligned, thereby disconnecting the server 10 from the outside world.

The control unit 12 also outputs a first control signal to the first fan 201 and a second control signal to the second fan 202. Thus, the first fan 201 is turned on and the second fan 202 is turned off. The heat flow path in the server 10 forms a first air duct L1, thereby transferring heat to the motherboard 104 and the components thereon through the first air duct L1, thereby increasing the temperature of the motherboard 104 and the components thereon, so that they can quickly reach the preset temperature and work normally.

Please refer to Figure 10, which is a schematic diagram of the second air duct L2 of the temperature control device 200 provided in this application.

When the temperature sensor 11 detects that the temperature inside the server 10 is not lower than the preset temperature, the control unit 12 outputs a first control signal to the switch 207 of the first ventilator 2031 and the second ventilator 2032. The switch 207 controls the through holes on the ventilating plate 205 to align with the through holes on the frame 1022, thereby connecting the server 10 to the outside world.

The control unit 12 also outputs a first control signal to the first fan 201 and the second fan 202. Thus, the first fan 201 and the second fan 202 are both activated, and the heat flow path in the server 10 forms a second air duct L2, thereby dissipating the heat to the outside through the second air duct L2.

Please refer to Figure 11, which is a circuit module diagram of a temperature control device 300 provided in another embodiment of the present application. The difference between the temperature control device 300 provided in this embodiment and the temperature control device 100 shown in Figure 3 is that the temperature control device 300 provided in this embodiment also includes a second heating component 301.

The control unit 12 is electrically connected to the second heating component 301. The control unit 12 outputs a first control signal or a second control signal to the second heating component 301 according to the temperature signal to control the second heating component 301 to heat or stop heating the server 10.

Please refer to FIG. 12A and FIG. 12B, which are schematic diagrams of the structure of the temperature control device 300 provided in another embodiment of the present application. The second heating component 301 is disposed on the motherboard 104, and the second heating component is disposed opposite to the second fan 202. The second heating component 301 includes a third fan 302, a second heat sink fin assembly 303, a second heating plate and a second connector (not shown in the figure). The third fan 302 and the second heat sink fin assembly 303 are disposed adjacent to each other. The connection relationship and function of the second heating plate and the second connector with other structures are similar to the connection relationship and function of the first heating plate 1002 and the first connector 1003 with other structures, which will not be described in detail here.

The control unit 12 outputs a first control signal to the second connector, and the second connector conducts the electrical connection with the external power source or the power component 101 to control the external power source or the power component 101 to pass current into the heating circuit, or the control unit 12 outputs a second control signal to the second connector, and the second connector controls the external power source or the power component 101 to stop passing current into the heating circuit.

The control unit 12 also outputs a first control signal or a second control signal to the third fan 302 to control the third fan 302 to turn on or off.

Please refer to Figure 13, which is a schematic diagram of the third air duct L3 of the temperature control device 300 provided in this application.

When the temperature sensor 11 detects that the temperature inside the server 10 is lower than the preset temperature, the control unit 12 outputs a first control signal to the switch 207 of the first ventilator 2031 and the second ventilator 2032. The switch 207 controls the through hole on the ventilating plate 205 and the through hole on the frame 1022 to be misaligned, thereby disconnecting the server 10 from the outside world.

The control unit 12 also outputs a first control signal to the first fan 201 and the third fan 302, and outputs a second control signal to the second fan 202. Thus, the first fan 201 and the third fan 302 are turned on, and the second fan 202 is turned off. The heat flow path in the server 10 forms a third air duct L3, thereby transferring heat to the motherboard 104 and the components thereon through the third air duct L3, thereby increasing the temperature of the motherboard 104 and the components thereon, so that they can quickly reach the preset temperature and work normally.

Please refer to Figure 14, which is a schematic diagram of the fourth air duct L4 of the temperature control device 300 provided in this application.

When the temperature sensor 11 detects that the temperature inside the server 10 is not lower than the preset temperature, the control unit 12 outputs a first control signal to the switch 207 of the first ventilator 2031 and the second ventilator 2032. The switch 207 controls the through hole on the vent plate 205 to align with the through hole on the frame 1022, thereby connecting the server 10 to the outside world.

The control unit 12 also outputs a first control signal to the first fan 201, the second fan 202 and the third fan 302. Thus, the first fan 201, the second fan 202 and the third fan 302 are all activated, and the heat flow path in the server 10 forms a fourth air duct L4, thereby dissipating the heat to the outside through the fourth air duct L4.

Please refer to Figure 15, which is a flow chart of the temperature control method provided in this application. The temperature control method provided in this application can be applied to any one of the temperature control device 100, the temperature control device 200 and the temperature control device 300. The temperature control method includes the following steps:

Step S1: Detect the temperature inside the server.

In some embodiments, the temperature inside the server 10 can be detected through the temperature sensor 11.

Step S2: If the temperature inside the server does not reach the preset temperature, control the first heating component or the second heating component to generate heat.

In some embodiments, when the temperature sensor 11 detects that the temperature inside the server 10 does not reach the preset temperature, the control unit 12 can output a first control signal to control the first heating component 1001 or the second heating component 301 to generate heat, and dissipate the generated heat to the inside of the server 10 through the first heat sink fin assembly 1004 or the second heat sink fin assembly 303.

Step S3: Start the first fan or the second fan.

In some embodiments, when the temperature sensor 11 detects that the temperature in the server 10 does not reach the preset temperature, the control unit 12 can output a first control signal to activate the first fan 201 or the second fan 202 to enhance heat conduction. Specifically, for the temperature control device 200, the first fan 201 is turned on and the second fan 202 is turned off, and for the temperature control device 300, the first fan 201 is turned off and the second fan 202 is turned on.

Step S4: Detect the temperature inside the server again. If the temperature inside the server does not reach the preset temperature, repeat steps S2-S3, otherwise execute step S5.

Step S5: Control the first heating component or the second heating component to stop generating heat.

When the temperature sensor 11 detects that the temperature inside the server 10 reaches the preset temperature, the control unit 12 outputs a second control signal to cause the first heating component 1001 or the second heating component 301 to stop heating, so as to slow down the temperature rise inside the server 10 and promote the temperature drop inside the server 10.

Step S6: Control the first ventilator and/or the second ventilator to open.

It should be noted that before the server 10 is powered on, the first ventilator 2031 and the second ventilator 2032 are both in a closed state. This is to prevent the first ventilator 2031 and the second ventilator 2032 from dissipating the heat inside the server to the outside when the temperature is lower than the preset temperature.

When the temperature sensor 11 detects that the temperature inside the server 10 reaches the preset temperature, the control unit 12 outputs a second control signal, and the switch assembly 206 controls the through holes provided on the first ventilator 2031 and the second ventilator 2032 to align with the through holes provided on the frame 1022, thereby controlling the server 10 to be connected to the outside world to accelerate the heat dissipation of the server 10.

Ordinary technical personnel in this technical field should recognize that the above implementation is only used to illustrate this application, and is not used as a limitation of this application. As long as it is within the scope of the essence of this application, appropriate changes and modifications made to the above implementation are within the scope of protection required by this application.

11: Temperature sensor

12: Control unit

1001: First heating component

Claims (8)

A temperature control device is applied in a server. The improvement is that the temperature control device comprises a temperature sensor, a control unit, a heating component and a ventilation component. The temperature sensor is used to sense the temperature in the server. The control unit is electrically connected to the temperature sensor, the heating component and the ventilation component. The control unit is used to determine whether the temperature in the server is lower than a preset temperature. The ventilation component is used to control the connectivity between the server and the outside world. When the temperature in the server is higher than a preset temperature, the ventilation component is used to control the connectivity between the server and the outside world. When the temperature in the server is lower than the preset temperature, the control unit outputs a first control signal, the heating component heats the server according to the first control signal, and the ventilation component switches to a closed state according to the first control signal to retain the heat generated by the heating component in the server; when the temperature in the server is not lower than the preset temperature, the control unit outputs a second control signal, the heating component stops heating the server according to the second control signal, and the ventilation component switches to a closed state according to the first control signal. The ventilation assembly is switched to an open state according to the second control signal to dissipate the heat in the server to the outside; wherein the ventilation assembly includes a rail and a ventilation plate, the rail includes a first extension member and a second extension member, the first extension member extends from the surface of the frame of the server along a first direction, and is bent along a second direction parallel to the surface of the frame, the second extension member is arranged opposite to the first extension member in the second direction, and the bending direction of the second extension member is opposite to that of the first extension member , a containing space is formed between the first extension member and the second extension member, and the vent plate is arranged in the containing space; through holes are arranged on the vent plate and the frame, and the vent assembly further includes a switch assembly, and the switch assembly includes a switch member and a driving member, one end of the driving member is connected to the switch member, and the other end of the driving member is connected to the vent plate, and the switch assembly is used to control the driving member to push and pull the vent plate so that the vent plate slides on the track. The temperature control device as described in claim 1, wherein the heating assembly includes a heating element and a heat sink fin assembly, the heating element is attached to one surface of the heat sink fin assembly, the heating element is electrically connected to an external power source, when the temperature in the server does not reach a preset temperature, the control unit controls the heating element to heat and transfer the heat to the heat sink fin assembly, and the heat sink fin assembly is used to transfer the heat to the server. The temperature control device as described in claim 1, wherein when the temperature in the server is lower than a preset temperature, the driver drives the vent plate to slide on the track, so that the vent plate and the through hole on the frame are misaligned, so as to control the server to be disconnected from the outside world; when the temperature sensor detects that the temperature in the server reaches the preset temperature, the driver drives the vent plate to slide on the track, so that the vent plate and the through hole on the frame are aligned, so as to control the server to be connected to the outside world. The temperature control device as described in claim 2, wherein the server is provided with a first fan and a second fan, the first fan and the second fan are arranged adjacent to each other, and the first fan and the heat sink fin assembly are arranged opposite to each other. The temperature control device as described in claim 4, wherein when the first fan is started and the second fan is turned off, a first air duct is formed to accelerate the heating of the server; when both the first fan and the second fan are started, a second air duct is formed to accelerate the heat dissipation of the server. The temperature control device as described in claim 4, wherein a third fan is disposed adjacent to the heat sink fin assembly, and the third fan is used to dissipate the heat on the heat sink fin assembly into the server; When the first fan and the third fan are started and the second fan is turned off, a third air duct is formed to accelerate the heating of the server; when the first fan, the second fan and the third fan are all started, a fourth air duct is formed to accelerate the heat dissipation of the server. A temperature control method, the improvement of which is that it includes: sensing the temperature inside a server; if the temperature inside the server does not reach a preset temperature, executing a heating method, otherwise executing a cooling method; sensing the temperature inside the server again, if the temperature inside the server does not reach a preset temperature, executing a heating method, otherwise executing a cooling method; the heating method includes: controlling a heating component to heat the server, and controlling a ventilation component to switch to a closed state, so as to retain the heat generated by the heating component in the server; the cooling method includes: controlling the heating component to stop heating the server, and controlling the ventilation component to switch to an open state, so as to dissipate the heat in the server to the outside; wherein the ventilation component includes a rail and a ventilation plate, and the rail includes a first extension member and a second extension member , the first extension extends from the frame surface of the server along the first direction, and is bent along the second direction parallel to the surface of the frame, the second extension is arranged opposite to the first extension in the second direction, and the bending direction of the second extension is opposite to that of the first extension, a containing space is formed between the first extension and the second extension, and the vent plate is arranged in the containing space; through holes are arranged on the vent plate and the frame, the vent assembly further includes a switch assembly, the switch assembly includes a switch and a drive, one end of the drive is connected to the switch, and the other end of the drive is connected to the vent plate, the switch assembly is used to control the drive to push and pull the vent plate so that the vent plate slides on the track. A server, the improvement of which is that the server includes a temperature control device as described in any one of claims 1 to 6.

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